Supply Chain
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3D magnetic pico-resolver introduced
Melexis calls it a world’s first design.
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Top MPU vendors expand market share
The top players reached 86.0% of the global market in 2021.
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Video: Chipsets support 5G-V2X for Day 2 scenarios
These devices are reportedly the first to support 5G-V2X for Day 2 scenarios, enabling critical actions such as automatic braking.
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Intel develops 8 wavelength laser array on a silicon wafer
The silicon photonics research will allow for optical compute interconnect applications such as AI and ML.
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Boston Dynamics’ robots to use lidar from Velodyne
In a multi-year agreement, the sensors will give robots navigation and perception capabilities.
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Design software targets complex RF and microwave systems
Keysight’s software includes EM simulation for multi-technology circuit assembly and simulation.
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Innergie launches C6 adapter with GaN technology
The new adapter takes advantage of gallium nitride (GaN) technology and boosts charging efficiency for consumers by up to 91.5%.
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Intel forms cloud alliance for foundry services
It will improve customer design, enable secure designs and accelerate time-to-market.
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Sensors Converge: Glass break detection sensors improve home security
Aspinity’s sensors were named as a finalist for best sensors award.
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World’s smallest lidar can detect a range of 300 meters
The device can also handle Level 4 autonomous driving.
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Allegro MicroSystems announces groundbreaking new position sensors for ADAS applications
Equipped with tunneling magnetoresistance and vertical Hall elements, the sensors combine industry-leading accuracy with built-in redundancy for safety-critical systems.
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Nanya begins construction on $10 billion DRAM fab
The fab will allow the company to implement several generations of 10 nm-class memory process technologies.
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Marposs designed and built equipment for the first real 5G trials in manufacturing
The 5G-SMART initiative will test advanced 5G integrated manufacturing applications such as digital twins and industrial robotics.
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Qorvo delivers next generation PA modules for 5G designs
These 8 W gallium nitride (GaN) power amplifier modules are optimized for U.S. and European markets.
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Report: Samsung to begin 3 nm semiconductors production soon
TSMC is also close to this process manufacturing node.
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Velodyne begins lidar traffic project in Helsinki, Finland
The goal of the project is to collect traffic data and improve road safety.
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Development board gives IoT devices a 5G connection
Microchip’s solution uses a microcontroller and Monarch 2 single-chip radio for cellular connections.
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Video: Qorvo simplifies GaN PA biasing
Integrated technology and configurability enhance gallium arsenide (GaN) power amplifier (PA) testing and design.
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Embedded World: SolidRun unveils 64 bit SOMs
The devices are based on the RZ/G2 family of SOCs from Renesas.
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Highly integrated BLE SoC developed by Renesas
The chip integrated power management, GPU and BLE connectivity in a single chip.
