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Intel, Hon Hai to jointly develop AI infrastructure
The companies will work on silicon, rack, system and application layers.
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Jungheinrich’s PowerCube: Meeting the demands of modern logistics
By maximizing storage density and accelerating order processing, the system helps warehouses handle more goods in less space and time.
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Bringing co-packaged optics to rack-scale AI infrastructure
Ayar Labs joins Nvidia’s NVLink Fusion platform.
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Flann to introduce WG32/WR3 demo at IMS 2026
A range of solutions in WG32/WR3 waveguides, including the industry standard programmable rotary vane attenuator and a brand-new programmable linear vane attenuator, will be demonstrated.
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Compact SWIR spectroscopy modules improve signal quality for accessible material analysis
The upgraded MEMS FPI design delivers higher signal to noise ratio and improved stray light suppression.
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BTL Laboratory becomes Taiwan’s first test house with a CTIA Certification compliant OTA test system by Rohde & Schwarz
The collaboration makes BTL the first test house in the region to provide its customers with comprehensive over-the-air testing services including certification of wireless devices.
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Taoglas to demonstrate smarter antenna selection and integration for compact wireless technologies at Hardware Pioneers Max 2026
The company will demonstrate practical ways to reduce antenna and RF selection and integration complexity, accelerate design cycles and improve wireless performance in compact connected devices.
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Indium Corporation to feature precision gold-based die-attach preforms at IMS
High-reliability, gold-based precision die-attach preforms will be showcased at the event.
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Cupola360 showcases reality remote management solutions at COMPUTEX 2026 with Omni Speed Dome debut
Building upon its 360° panoramic camera modules, Cupola360 will unveil solutions seamlessly integrating hardware, platform software, artificial intelligence (AI) and internet of things (IoT) control.
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Cosmic brings its latest high-power semiconductor testing platforms to PCIM Europe 2026
Innovations that advance semiconductor testing capabilities will be highlighted.
MULTIMEDIA
Sponsored by
Industries Industries
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Computex 2026: CoolIT pushes single-phase DLC to 15 kW
DATA CENTER AND CRITICAL INFRASTRUCTUREIt also makes the case for cold plates through 2030.
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Jungheinrich’s PowerCube: Meeting the demands of modern logistics
DISCRETE AND PROCESS AUTOMATION -
Bringing co-packaged optics to rack-scale AI infrastructure
DATA CENTER AND CRITICAL INFRASTRUCTURE -
Flann to introduce WG32/WR3 demo at IMS 2026
INDUSTRIAL ELECTRONICS
Supply Chain Supply Chain
Sponsored by
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Computex 2026: CoolIT pushes single-phase DLC to 15 kW
MEMS AND SENSORSIt also makes the case for cold plates through 2030.
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Intel, Hon Hai to jointly develop AI infrastructure
MEMS AND SENSORS -
Bringing co-packaged optics to rack-scale AI infrastructure
POWER SEMICONDUCTORS -
Compact SWIR spectroscopy modules improve signal quality for accessible material analysis
MEMS AND SENSORS
Teardowns Teardowns
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TechInsights Teardown: Sony WH-1000XM6 Wireless Noise Canceling Headphones
AUDIO AND VIDEOA partial deep dive into the Japanese headset.
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TechInsights Teardown: Amazon Ring Wired Doorbell Pro (Gen 3)
AUDIO AND VIDEO -
TechInsights Teardown: Supermicro server with 8 AMD Instinct MI 350X and 2 AMD EPYC Turin 9555
BUSINESS PROCESS SOLUTIONS -
TechInsights Teardown: Samsung’s The Premiere 5 Projector
CONSUMER PERIPHERALS
