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Thermo Fisher electron microscope helps chipmakers get better data
The FIB-SEM tool prepares sample directly from a wafer.
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Infineon's 300 mm SiC wafers more than double chips
The German chipmaker has processed 300 mm SiC wafers into functional power devices using existing silicon equipment.
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How Intel and Altera aim to simplify edge AI sensor challenges
The companies are developing a real-time sensor bridge for healthcare, aerospace and defense, and robotics applications.
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Semtech unveils new eSIM that unlocks global IoT connectivity
The multi-network, multi-profile device give vendors one SKU that pairs smart connectivity with local carrier profiles.
MULTIMEDIA
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Industries Industries
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Texas wastewater: A new weapon against data center water woes
DISCRETE AND PROCESS AUTOMATIONThe team evaluated two desalination methods: reverse osmosis, which forces water through a semipermeable membrane to remove salt, and thermal treatment, which evaporates water and condenses the vapor.
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Infineon's 300 mm SiC wafers more than double chips
RF & MICROWAVE -
How Intel and Altera aim to simplify edge AI sensor challenges
INDUSTRIAL ELECTRONICS -
Semtech unveils new eSIM that unlocks global IoT connectivity
WIRED CONNECTIVITY
Supply Chain Supply Chain
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Quantum magnetometers could make GPS spoofing irrelevant
MEMS AND SENSORSGPS can be lied to through jamming and spoofing. These sensors are fighting back though the Earth’s magnetic field.
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Thermo Fisher electron microscope helps chipmakers get better data
SEMICONDUCTOR EQUIPMENT -
Infineon's 300 mm SiC wafers more than double chips
POWER SEMICONDUCTORS -
How Intel and Altera aim to simplify edge AI sensor challenges
MEMS AND SENSORS
Teardowns Teardowns
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TechInsights Teardown: Hypershell Hyper X Carbon exoskeleton
INDUSTRIAL ELECTRONICSA partial deep dive into the mobility device.
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TechInsights Teardown: Garmin Fenix 8 Pro
CONSUMER PERIPHERALS -
TechInsights Teardown: Lenovo Legion Go 2
AUDIO AND VIDEO -
TechInsights Teardown: DJI Mini 5 Pro drone
AEROSPACE
