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Intel Foundry breaks ground on Santa Clara facility
It points to continued momentum for the company’s semiconductor manufacturing prowess.
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GM secures a supply of memory, storage chips from Micron
The agreement also includes a collaboration for future memory and storage needs for GM’s vehicle roadmap.
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Faster charging for EV batteries
Speedier battery charging can be realized by relying on interfacial anion-reduction catalysis technology.
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Siemens to expand electrical switchgear capacity for data centers
The company will invest about $341 million at its German plants.
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FPT enters the top three of Europe’s certified high-voltage battery producers with TÜV SÜD recognition
The certification covers the design, development and manufacturing process of the FPT eBS 37 EVO high-voltage battery for light commercial vehicles, minibuses and pleasure boating applications.
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Orbital wants 100,000 data center satellites in space
Each satellite would function as one high-density rack in orbit.
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Flir launches the fixed Si2a PD acoustic imaging camera for continuous partial discharge monitoring
The fixed-mount acoustic imaging camera designed to deliver continuous, always-on monitoring of partial discharge (PD) in medium to high-voltage utility and industrial environments.
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PPTC: Compact protection for maximum reliability
The devices provide reliable resettable overcurrent and overtemperature protection for modern electronic applications.
MULTIMEDIA
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Industries Industries
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Data center cabling for the AI era
INDUSTRIAL ELECTRONICSA complete rethinking of traditional data center design, including cable components, is required to deploy future artificial intelligence (AI)-driven applications.
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GM secures a supply of memory, storage chips from Micron
ELECTRONICS AND SEMICONDUCTORS -
Faster charging for EV batteries
ELECTRONICS AND SEMICONDUCTORS -
Siemens to expand electrical switchgear capacity for data centers
INDUSTRIAL ELECTRONICS
Supply Chain Supply Chain
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New UCIe routing approach in package substrates
LEDUCIe provides wide channels with high signal counts, and a new transmission line structure could help keep layer counts reasonable as bump count scales up in IC substrates.
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Intel Foundry breaks ground on Santa Clara facility
MEMS AND SENSORS -
GM secures a supply of memory, storage chips from Micron
MEMORY AND STORAGE -
ECIA: 5 year high for electronic components market sentiment
MEMS AND SENSORS
Teardowns Teardowns
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TechInsights Teardown: Lenovo Legion Go
AUDIO AND VIDEOA partial deep dive into the handheld gaming system.
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TechInsights Teardown: Form Smart Swim 2 Pro
AUDIO AND VIDEO -
TechInsights Teardown: Sony WH-1000XM6 Wireless Noise Canceling Headphones
AUDIO AND VIDEO -
TechInsights Teardown: Amazon Ring Wired Doorbell Pro (Gen 3)
AUDIO AND VIDEO
