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ECIA: 5 year high for electronic components market sentiment
But July may falter slightly.
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Another big SATCOM deal as Rocket Lab buys Iridium
The $8 billion deal continues a big year of expansion in satellite communications.
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SEMI: AI boosts 300 mm memory fab equipment investment past $50 billion
It is the first time it has hit this dollar mark.
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Emerson unveils AI-ready test automation platform
NI Nigel AI has been expanded across the Emerson test software portfolio, introducing new prompt-based code generation and offering an integrated, artificial intelligence (AI)-ready test automation platform.
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EPC announces EPC2378 25 V, 410 µO eGaN in mass production for high-density DC-DC conversion
The transistor enables high-density power system designers to achieve higher efficiency, faster switching and greater power density in demanding DC-DC conversion applications.
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Online event: Thermography for industrial automation
Learn how temperature distributions and temporal temperature profiles can be captured, analyzed and used for effective process monitoring.
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New Epson low-power OCXO redefines precision timing for AI and edge infrastructure
The power- and footprint-saving oven-controlled crystal oscillator (OCXO) delivers the ultra-stable timing performance required for artificial intelligence (AI), edge and next-generation communication infrastructures.
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Robotic snakes crawl along power lines to identify failures before they occur
The snake-like robots wrap themselves around power lines while using onboard cameras and sensors to detect hazards like damaged wires, worn components and abnormal temperatures – all of which are possible signs of imminent failure.
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Littelfuse launches ultra-low power omnipolar TMR switch sensor
The switch sensor enables high-sensitivity magnetic field sensing with 1.5 µA current draw for always-on, battery-powered designs.
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PEI-Genesis inks global franchise agreement with Sumitomo Electric Interconnect Products
The partnership expands PEI-Genesis’s portfolio to include heat shrink tubing, solder sleeves, crimp termination products and heat shrink identification solutions.


