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TechInsights Teardown: DJI Mini 5 Pro drone
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ECIA: Electronic components moderation continues in August
And September will continue that trend.
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ST targets surging 70M-unit cabin sensor market
The company unveils an infrared sensor architecture and embedding imaging processing device to simplify camera design and integration.
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Why foldable phones are the next smartphone battleground
With the release of the Apple iPhone Duo, other vendors in the sector will likely be forced to reassess strategies.
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Infineon furthers its core growth drivers with memory sale
The company will sell its NOR flash and F-RAM business to Winbond.
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Verizon makes world’s first AI-based crowd detection field trial
The successful testing provides a path to future 6G use cases.
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