TechInsights Teardown: Vivo X Fold 3 Pro
TechInsights Teardown: Zvision ML-30s lidar
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GF nears GaN chip mass production
The pure play foundry received an additional $9.5 million from the U.S. government for the push toward semiconductor manufacturing.
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Advancing high-accuracy virtual design of power electronic applications
The Onsemi power loss model generator now includes passive components to more accurately model designs and enable customers to go to market faster.
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Metis-e radio module: Optimized for metering applications
The module can be used both as a transmitter for a meter as well as a receiver for a gateway or data collector.
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Littelfuse launches RCMP20 Residual Current Monitor Series for Mode 2 and Mode 3 charging stations
The series supports more compact, high-current electric vehicle chargers with improved safety, design flexibility and thermal management.
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Vishay Intertechnology automotive grade surface-mount thick film power resistor offers multi-pulse capabilities in TO-263 (D2PAK) package
The resistor combines multi-pulse capabilities with high power dissipation of 35 W at 25° C.
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CES 2025: Two-way audio tech enhances gaming audio by 30%
xMEMS Labs and Merry Electronics will demonstrate a production-ready wireless over-the-ear headphone at the world’s largest trade show.
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GF signs foundry agreements with ICsense and Soitec
The deals will help boost ASIC manufacturing and RF-SOI substrates, respectively.