Supply Chain
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CHIPS Act roundup: The final funding under Biden
Four companies to receive proposed direct funding to help build America’s semiconductor manufacturing industry.
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ECIA: Electronic components optimism remains for Q1
After an improved December, the outlook for January is expected to improve sales sentiment.
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Global chip investments decline for second year amid weak demand
Smartphones and EVs are dragging the market, leading to major semiconductor vendors to decrease investments.
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GF to build advanced packaging factory in New York
It will be used for silicon photonics for AI, automotive, aerospace and defense markets.
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Advanced sensing features come to wearables in 2025
Smart rings, smartwatches and healthcare devices are all evolving to include even more features and they will start rolling out this year.
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Mouser Electronics new product insider: Over 10,000 new parts added in fourth quarter of 2024
Learn about some of the 10,000 products introduced by Mouser from October through December.
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CHIPS Act roundup: HP, Macom get direct funding
Plus an additional $210 million in tech hub grants.
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Why rad-hard components are critical for space electronics
As the world continues to push the boundaries of harsh environments, ruggedized semiconductors gain traction.
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InnoPhase IoT unveils Talaria 6 Family of SoCs featuring Wi-Fi 6, multi-protocol connectivity and enhanced cybersecurity
The platform demonstrated at CES 2025 elevates internet of things (IoT) user experience with increased throughput, energy efficiency and range, and increased compute power and security.
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CES 2025: Precise navigation by a two-chip, nine-axis sensor solution
TDK launches PositionSense that integrates a six-axis IMU and a three-axis magnetometer.
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WeWALK unveils smarter, TDK-powered cane at CES 2025
CES 2025 has AI-everything, even a cane that responds to voice commands using TDK MEMS sensors.
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The next level of systems integration: Substrate-like PCBs
This type of integration is where high-density designs are built to include standard PCB components.
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Micron to expand Virgina fab
The facility will be upgraded to produce modern DRAM memory.
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Final 2024 CHIPS Act roundup: Samsung, TI and Amkor funding
What will a change in administration bring for the bill in 2025?
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New TPSMB Asymmetrical TVS Diodes from Littelfuse: Superior gate driver protection for automotive SiC MOSFETs
The series is engineered for next-gen electric vehicle infrastructure, delivering compact, single-component solutions for power efficient onboard charging and inverters.
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Partnership to accelerate development of superconductor technology for power transmission and fusion energy
The partnership seeks to advance the SUBRACABLE innovation which offers potential to overcome limitations of traditional copper cables and current flat tape superconductors.
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How nanosatellites are reshaping global connectivity
Miniaturization in SATCOM will help to lower barrier to entry and improve global communications.
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CES 2025: Tiny integrated speaker-microphone launched
SonicEdge’s device is targeted at TWS earbuds and headphones.
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Hamamatsu unveils the highest-density LD module — A pump source for the 1-kJ laser used in fusion research
Using these laser diode (LD) modules as light sources for pumping the laser medium will achieve laser power in the 1 kJ class, an important milestone in making laser fusion practical.
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Radar for parking assistance comes to CES 2025
Novelic’s 180° FOV radar module replaces ultrasonic sensors in vehicles.