<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/">
<channel>
<title>Electronics360: Electronics Supply Chain News &amp; Analysis</title>
<link>https://electronics360.globalspec.com/supply-chain</link>
<description><![CDATA[Recent content from Electronics360: Electronics Supply Chain News & Analysis]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Fri, 31 Jul 2026 08:49:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
<item>
<title><![CDATA[Inseego rolls out multi-carrier 5G mobile router]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24059/inseego-rolls-out-multi-carrier-5g-mobile-router?from_rss=1]]></link>
<description><![CDATA[The device offers flexibility to users across multiple carrier networks.]]></description>
<pubDate>Fri, 31 Jul 2026 08:49:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24059]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Broadband</dc:subject>
</item>
<item>
<title><![CDATA[AT&T completes EchoStar spectrum acquisition]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24056/at-t-completes-echostar-spectrum-acquisition?from_rss=1]]></link>
<description><![CDATA[The 50 MHz of nationwide spectrum could be used to widen the telecom’s FWA portfolio.]]></description>
<pubDate>Fri, 31 Jul 2026 08:40:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24056]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Service Providers</dc:subject>
</item>
<item>
<title><![CDATA[Memory, optics, packaging: CHIPS Act targets AI's compute bottleneck]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24058/memory-optics-packaging-chips-act-targets-ai-s-compute-bottleneck?from_rss=1]]></link>
<description><![CDATA[Seven companies land a combined $874 million in the latest round of CHIPS Act R&D awards.]]></description>
<pubDate>Fri, 31 Jul 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24058]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[PI tackles high-resolution focusing demands in metrology and microscopy]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24024/pi-tackles-high-resolution-focusing-demands-in-metrology-and-microscopy?from_rss=1]]></link>
<description><![CDATA[New fast nano-precision focusing systems are built around two complementary drive technologies.]]></description>
<pubDate>Fri, 31 Jul 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24024]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[TDK and LG Innotek to collaborate on AI sensing modules]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24057/tdk-and-lg-innotek-to-collaborate-on-ai-sensing-modules?from_rss=1]]></link>
<description><![CDATA[The companies will target these platforms for humanoid robots.]]></description>
<pubDate>Fri, 31 Jul 2026 08:18:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24057]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[GF gets CHIPS Act funding to accelerate silicon photonics R&D]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24053/gf-gets-chips-act-funding-to-accelerate-silicon-photonics-r-d?from_rss=1]]></link>
<description><![CDATA[The $300 million award will be exchanged for a 1% equity stake given to the U.S. government.]]></description>
<pubDate>Thu, 30 Jul 2026 12:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24053]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Impact of the Japanese Kumamoto earthquake]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24055/impact-of-the-japanese-kumamoto-earthquake?from_rss=1]]></link>
<description><![CDATA[Production halted at numerous facilities in the region as a result.]]></description>
<pubDate>Thu, 30 Jul 2026 08:32:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24055]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Value Chain</dc:subject>
</item>
<item>
<title><![CDATA[CPO switch production ramps up by Nvidia and Broadband]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24054/cpo-switch-production-ramps-up-by-nvidia-and-broadband?from_rss=1]]></link>
<description><![CDATA[However, challenges remain.]]></description>
<pubDate>Thu, 30 Jul 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24054]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[ChipAgents garners 120 chip deployments for Agentic AI]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24048/chipagents-garners-120-chip-deployments-for-agentic-ai?from_rss=1]]></link>
<description><![CDATA[The chip design startup has also raised $60 million in funding.]]></description>
<pubDate>Wed, 29 Jul 2026 08:50:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24048]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronic Design Automation</dc:subject>
</item>
<item>
<title><![CDATA[SIA: Chip sales on track to reach $1.5 trillion in 2026]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24049/sia-chip-sales-on-track-to-reach-1-5-trillion-in-2026?from_rss=1]]></link>
<description><![CDATA[This is nearly double from sales in 2025.]]></description>
<pubDate>Tue, 28 Jul 2026 12:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24049]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[6G project unites US and other global leaders]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24047/6g-project-unites-us-and-other-global-leaders?from_rss=1]]></link>
<description><![CDATA[The Call to Action for 6G Leadership and Security initiative will work toward a shared vision and roadmap for the next generation of wireless communication.]]></description>
<pubDate>Tue, 28 Jul 2026 08:17:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24047]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Broadband</dc:subject>
</item>
<item>
<title><![CDATA[Rochester Electronics and Qorvo team to offer long-term availability of RF components]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24028/rochester-electronics-and-qorvo-team-to-offer-long-term-availability-of-rf-components?from_rss=1]]></link>
<description><![CDATA[The collaboration expands access to Qorvo’s radio frequency (RF) and power high-performance semiconductor solutions, with a particular emphasis on longevity of supply and lifecycle support.]]></description>
<pubDate>Mon, 27 Jul 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24028]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Future Electronics showcases onsemi TREO analog and mixed-signal platform]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24041/future-electronics-showcases-onsemi-treo-analog-and-mixed-signal-platform?from_rss=1]]></link>
<description><![CDATA[Power, analog and digital capabilities are combined into a single platform.]]></description>
<pubDate>Mon, 27 Jul 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24041]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[The quantum communications revolution]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23951/the-quantum-communications-revolution?from_rss=1]]></link>
<description><![CDATA[Quantum communications networks are coming, but still face large technical and infrastructure hurdles before they’re widely adopted.]]></description>
<pubDate>Sun, 26 Jul 2026 08:07:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23951]]></guid>
<dc:creator>Andy Tomaswick</dc:creator>
<dc:subject>Wired Connectivity</dc:subject>
</item>
<item>
<title><![CDATA[Japanese vendors form vision sensor manufacturing JV]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24039/japanese-vendors-form-vision-sensor-manufacturing-jv?from_rss=1]]></link>
<description><![CDATA[Sony Semiconductor and Mitsubishi Electric will focus on ways to accelerate automation and advanced manufacturing equipment.]]></description>
<pubDate>Thu, 23 Jul 2026 08:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24039]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[NAND flash chip shortage may get relief in 2027]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24034/nand-flash-chip-shortage-may-get-relief-in-2027?from_rss=1]]></link>
<description><![CDATA[Process migrations and growth bit output will help even the supply-demand balance.]]></description>
<pubDate>Wed, 22 Jul 2026 08:44:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24034]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Memory and Storage</dc:subject>
</item>
<item>
<title><![CDATA[Intel lands first named foundry win under Tan]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24035/intel-lands-first-named-foundry-win-under-tan?from_rss=1]]></link>
<description><![CDATA[The company will build Fortinet’s SP6 cybersecurity ASIC.]]></description>
<pubDate>Wed, 22 Jul 2026 08:30:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24035]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Siemens to acquire 2 EDA vendors in 2 days]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24032/siemens-to-acquire-2-eda-vendors-in-2-days?from_rss=1]]></link>
<description><![CDATA[The deals will expand the company’s EDA SoC design creation capabilities.]]></description>
<pubDate>Wed, 22 Jul 2026 08:22:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24032]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronic Design Automation</dc:subject>
</item>
<item>
<title><![CDATA[The industry’s smallest fixed attenuators]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24025/the-industry-s-smallest-fixed-attenuators?from_rss=1]]></link>
<description><![CDATA[Housed in an ultra-compact two-lead, 1 mm × 1 mm quad flat no-lead (QFN) package, these attenuators enable significant PCB space savings for next-generation high-density designs.]]></description>
<pubDate>Wed, 22 Jul 2026 08:15:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24025]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Micron signs agreements with automotive ecosystem partners]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24033/micron-signs-agreements-with-automotive-ecosystem-partners?from_rss=1]]></link>
<description><![CDATA[The deals will provide visibility into memory and storage that will be important for current and future vehicle production.]]></description>
<pubDate>Wed, 22 Jul 2026 08:08:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24033]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Memory and Storage</dc:subject>
</item>
<item>
<title><![CDATA[Vishay Intertechnology standard-level 40 V MOSFETs prevent false triggering and reduce noise in motor control circuits]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23979/vishay-intertechnology-standard-level-40-v-mosfets-prevent-false-triggering-and-reduce-noise-in-motor-control-circuits?from_rss=1]]></link>
<description><![CDATA[The high minimum gate-source threshold voltage of the devices prevents false MOSFET triggering induced by the gate in motor control circuits.]]></description>
<pubDate>Wed, 22 Jul 2026 08:08:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23979]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[xMEMS introduces smallest active micro fan for AR/XR glasses]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24015/xmems-introduces-smallest-active-micro-fan-for-ar-xr-glasses?from_rss=1]]></link>
<description><![CDATA[It is called a world’s first.]]></description>
<pubDate>Tue, 21 Jul 2026 08:28:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24015]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Allegro MicroSystems unveils industry's first safety PMIC to integrate a wheel-speed sensor interface for electromechanical braking]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23975/allegro-microsystems-unveils-industry-s-first-safety-pmic-to-integrate-a-wheel-speed-sensor-interface-for-electromechanical-braking?from_rss=1]]></link>
<description><![CDATA[The new device provides electromechanical braking designers with a substantially simplified, single-chip power and sensing foundation for next-generation brake-by-wire systems.]]></description>
<pubDate>Mon, 20 Jul 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23975]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Intel’s Panther Lake using ASML’s High NA EUV lithography]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24020/intel-s-panther-lake-using-asml-s-high-na-euv-lithography?from_rss=1]]></link>
<description><![CDATA[The company said it shows the technology’s readiness in a production environment.]]></description>
<pubDate>Thu, 16 Jul 2026 08:42:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24020]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[New York becomes first state to halt data center growth]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24021/new-york-becomes-first-state-to-halt-data-center-growth?from_rss=1]]></link>
<description><![CDATA[Gov. Kathy Hochul signed an executive order imposing a pause of up to one year to allow the state to develop a regulatory framework aimed at protecting ratepayers, the environment and the energy grid.]]></description>
<pubDate>Thu, 16 Jul 2026 08:31:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24021]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Computer Electronics</dc:subject>
</item>
</channel>
</rss>
