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<title>Electronics360: Electronics Supply Chain News &amp; Analysis</title>
<link>https://electronics360.globalspec.com/supply-chain</link>
<description><![CDATA[Recent content from Electronics360: Electronics Supply Chain News & Analysis]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Thu, 22 Oct 2026 08:02:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
<item>
<title><![CDATA[Altera now has defense-grade FPGAs for aerospace, defense sectors]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24197/altera-now-has-defense-grade-fpgas-for-aerospace-defense-sectors?from_rss=1]]></link>
<description><![CDATA[The variants are designed to operate under extreme conditions.]]></description>
<pubDate>Thu, 22 Oct 2026 08:02:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24197]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[NY Creates bets big on high NA EUV access]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24193/ny-creates-bets-big-on-high-na-euv-access?from_rss=1]]></link>
<description><![CDATA[The research hub also talks about the rise of regional ecosystems.]]></description>
<pubDate>Wed, 21 Oct 2026 08:06:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24193]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[xMEMS fan-on-a-chip now in mass production]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24177/xmems-fan-on-a-chip-now-in-mass-production?from_rss=1]]></link>
<description><![CDATA[The technology is targeted thermal management in a compact form factor for AI smart glasses, smartphones and other edge systems.]]></description>
<pubDate>Tue, 20 Oct 2026 08:32:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24177]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Consumer Peripherals</dc:subject>
</item>
<item>
<title><![CDATA[DigiKey to double down on same-day fulfillment]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24185/digikey-to-double-down-on-same-day-fulfillment?from_rss=1]]></link>
<description><![CDATA[The company will invest $100 million to expand capacity and automation in its product distribution center.]]></description>
<pubDate>Fri, 16 Oct 2026 08:18:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24185]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[Infineon shores up SiC supply security with Wolfspeed]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24189/infineon-shores-up-sic-supply-security-with-wolfspeed?from_rss=1]]></link>
<description><![CDATA[An agreement will transform the existing relationship from 150 mm wafers to 200 mm substrate technology.]]></description>
<pubDate>Fri, 16 Oct 2026 08:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24189]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[Wirepas mesh now connects 500,000 self-storage locks]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24186/wirepas-mesh-now-connects-500-000-self-storage-locks?from_rss=1]]></link>
<description><![CDATA[The company’s IoT technology works in areas without cellular connectivity or weak Wi-Fi.]]></description>
<pubDate>Fri, 16 Oct 2026 08:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24186]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Semicon West 2026: Teradyne launches edge AI automated test platform]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24184/semicon-west-2026-teradyne-launches-edge-ai-automated-test-platform?from_rss=1]]></link>
<description><![CDATA[The 24-slot system is built for both engineering and production use.]]></description>
<pubDate>Thu, 15 Oct 2026 08:34:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24184]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[Applied Materials unveils its $5 billion EPIC Center]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24183/applied-materials-unveils-its-5-billion-epic-center?from_rss=1]]></link>
<description><![CDATA[It is called the world’s largest facility dedicated to collaborative semiconductor process technology and manufacturing equipment R&D.]]></description>
<pubDate>Thu, 15 Oct 2026 08:22:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24183]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Value Chain</dc:subject>
</item>
<item>
<title><![CDATA[Video: TDK now offers 9-axis sensor with on-chip fusion]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24176/video-tdk-now-offers-9-axis-sensor-with-on-chip-fusion?from_rss=1]]></link>
<description><![CDATA[The sensor is available through electronics distributors.]]></description>
<pubDate>Tue, 13 Oct 2026 08:19:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24176]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Why is the war department investing $1.5B in Wolfspeed?]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24179/why-is-the-war-department-investing-1-5b-in-wolfspeed?from_rss=1]]></link>
<description><![CDATA[The loan comes amid a national push to strengthen the domestic silicon-carbide manufacturing and stave off competition from China.]]></description>
<pubDate>Mon, 12 Oct 2026 10:58:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24179]]></guid>
<dc:creator>Amy Neff Roth, Utica Observer Dispatch/Observer-Dispatch via Reuters</dc:creator>
<dc:subject>Semiconductors and Components</dc:subject>
</item>
<item>
<title><![CDATA[Fabric sensors drive vehicles beyond presence detection]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24159/fabric-sensors-drive-vehicles-beyond-presence-detection?from_rss=1]]></link>
<description><![CDATA[Occupancy classification needs weight, position and movement data. Automotive sensors offer a low-power way to supply it.]]></description>
<pubDate>Mon, 12 Oct 2026 08:43:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24159]]></guid>
<dc:creator>Tony Pallone</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Using GaN FET devices in power electronics]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24094/using-gan-fet-devices-in-power-electronics?from_rss=1]]></link>
<description><![CDATA[These electronic components are changing the design calculus for power electronics in digital systems, embedded systems and power electronics.]]></description>
<pubDate>Mon, 05 Oct 2026 08:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24094]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Kill the signal, kill the drone? Not anymore]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23768/kill-the-signal-kill-the-drone-not-anymore?from_rss=1]]></link>
<description><![CDATA[Frequency hopping, multi-band radios and 802.11be are closing the gap on battlefield jamming. Ukraine is the proof of concept.]]></description>
<pubDate>Thu, 01 Oct 2026 08:41:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23768]]></guid>
<dc:creator>Tereza Pultarova</dc:creator>
<dc:subject>Aerospace</dc:subject>
</item>
<item>
<title><![CDATA[Momentus, NASA complete orbital rendezvous demo]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24162/momentus-nasa-complete-orbital-rendezvous-demo?from_rss=1]]></link>
<description><![CDATA[The demo was designed to validate commercial technologies for in-space transportation, service and logistics.]]></description>
<pubDate>Thu, 01 Oct 2026 08:19:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24162]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Q&A: Life after Intel is good, says Altera]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24157/q-a-life-after-intel-is-good-says-altera?from_rss=1]]></link>
<description><![CDATA[One year after Intel sold off its majority stake, Altera’s Mike Fitton says independence has meant faster decisions, more focus and room to work with everyone.]]></description>
<pubDate>Wed, 30 Sep 2026 08:19:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24157]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Processors</dc:subject>
</item>
<item>
<title><![CDATA[Tektronix expands 8-channel oscilloscope portfolio]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24153/tektronix-expands-8-channel-oscilloscope-portfolio?from_rss=1]]></link>
<description><![CDATA[The testing tool gives added flexibility for RF, sensing and other high-speed digital applications.]]></description>
<pubDate>Wed, 23 Sep 2026 08:09:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24153]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[ECIA: Electronic components moderation continues in August]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24152/ecia-electronic-components-moderation-continues-in-august?from_rss=1]]></link>
<description><![CDATA[And September will continue that trend.]]></description>
<pubDate>Tue, 22 Sep 2026 08:35:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24152]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Application Forecasts and Market Shares</dc:subject>
</item>
<item>
<title><![CDATA[Flexible semiconductors move toward practical use]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24113/flexible-semiconductors-move-toward-practical-use?from_rss=1]]></link>
<description><![CDATA[New materials and manufacturing methods are enabling semiconductors that can bend, with applications in wearables, portable electronics and industrial sensors.]]></description>
<pubDate>Mon, 21 Sep 2026 08:33:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24113]]></guid>
<dc:creator>Seth Price</dc:creator>
<dc:subject>Semiconductor Value Chain</dc:subject>
</item>
<item>
<title><![CDATA[This sensor knows where 10 people are in a room]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24147/this-sensor-knows-where-10-people-are-in-a-room?from_rss=1]]></link>
<description><![CDATA[Aqara’s mmWave radar-based device improves human presence detection in smart homes but securely.]]></description>
<pubDate>Fri, 18 Sep 2026 08:43:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24147]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Audio and Video</dc:subject>
</item>
<item>
<title><![CDATA[Verizon makes world’s first AI-based crowd detection field trial]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24149/verizon-makes-world-s-first-ai-based-crowd-detection-field-trial?from_rss=1]]></link>
<description><![CDATA[The successful testing provides a path to future 6G use cases.]]></description>
<pubDate>Fri, 18 Sep 2026 08:30:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24149]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Broadband</dc:subject>
</item>
<item>
<title><![CDATA[Nordic’s new multi-protocol SoC targets smart home, asset trackers]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24148/nordic-s-new-multi-protocol-soc-targets-smart-home-asset-trackers?from_rss=1]]></link>
<description><![CDATA[The chip supports BLE, Bluetooth Channel Sounding, Thread, Zigbee and Matter.]]></description>
<pubDate>Fri, 18 Sep 2026 08:21:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24148]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Home Appliances</dc:subject>
</item>
<item>
<title><![CDATA[Infineon furthers its core growth drivers with memory sale]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24150/infineon-furthers-its-core-growth-drivers-with-memory-sale?from_rss=1]]></link>
<description><![CDATA[The company will sell its NOR flash and F-RAM business to Winbond.]]></description>
<pubDate>Fri, 18 Sep 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24150]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[Arrow Electronics and ST Microelectronics accelerate industrial AMR development with a new reference platform]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24031/arrow-electronics-and-st-microelectronics-accelerate-industrial-amr-development-with-a-new-reference-platform?from_rss=1]]></link>
<description><![CDATA[The reference platform is designed to shorten the path from concept to deployment for professional service robots.]]></description>
<pubDate>Fri, 18 Sep 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24031]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
</item>
<item>
<title><![CDATA[Fujitsu targets AI data center market in Japan, Europe]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24146/fujitsu-targets-ai-data-center-market-in-japan-europe?from_rss=1]]></link>
<description><![CDATA[The company has developed both the Monaka CPU and a server for multiple sectors.]]></description>
<pubDate>Thu, 17 Sep 2026 08:23:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24146]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Americans’ wireless data obsession hits a new high]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24139/americans-wireless-data-obsession-hits-a-new-high?from_rss=1]]></link>
<description><![CDATA[In 2025 alone, 5G consumers used more data than the entire 4G decade combined.]]></description>
<pubDate>Mon, 14 Sep 2026 14:49:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24139]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Broadband</dc:subject>
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