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<title>Electronics360: Electronics Supply Chain News &amp; Analysis</title>
<link>https://electronics360.globalspec.com/supply-chain</link>
<description><![CDATA[Recent content from Electronics360: Electronics Supply Chain News & Analysis]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Fri, 10 Jul 2026 08:50:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
<item>
<title><![CDATA[Report: Japanese foundry Rapidus takes aim at TSMC]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23992/report-japanese-foundry-rapidus-takes-aim-at-tsmc?from_rss=1]]></link>
<description><![CDATA[The company will price its 2 nm semiconductor manufacturing wafers competitively.]]></description>
<pubDate>Fri, 10 Jul 2026 08:50:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23992]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Another SATCOM deal as York Space acquires All.Space]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23993/another-satcom-deal-as-york-space-acquires-all-space?from_rss=1]]></link>
<description><![CDATA[The deal continues the consolidation in the space communications market taking place in 2026.]]></description>
<pubDate>Fri, 10 Jul 2026 08:41:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23993]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Processors</dc:subject>
</item>
<item>
<title><![CDATA[Micron invests $3 billion in GlobalWafers]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23994/micron-invests-3-billion-in-globalwafers?from_rss=1]]></link>
<description><![CDATA[The deal will include a long-term raw silicon wafer supply and R&D investment.]]></description>
<pubDate>Fri, 10 Jul 2026 08:23:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23994]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Memory and Storage</dc:subject>
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<item>
<title><![CDATA[Infineon introduces the AIROC UWB TSL100 for precise positioning and smart presence detection on a single chip]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23965/infineon-introduces-the-airoc-uwb-tsl100-for-precise-positioning-and-smart-presence-detection-on-a-single-chip?from_rss=1]]></link>
<description><![CDATA[These devices combine precise positioning and smart presence detection on a single chip, addressing growing demand across automotive, consumer and industrial markets.]]></description>
<pubDate>Thu, 09 Jul 2026 07:40:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23965]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<item>
<title><![CDATA[Ecolab closes $4.75B CoolIT acquisition to corner AI data center cooling]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23980/ecolab-closes-4-75b-coolit-acquisition-to-corner-ai-data-center-cooling?from_rss=1]]></link>
<description><![CDATA[The deal will extend its water technologies to AI infrastructure and computing market.]]></description>
<pubDate>Wed, 08 Jul 2026 20:55:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23980]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
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<item>
<title><![CDATA[Infineon opens largest power chip/logic fab in Germany]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23981/infineon-opens-largest-power-chip-logic-fab-in-germany?from_rss=1]]></link>
<description><![CDATA[It is called one of the largest investment projects in the country.]]></description>
<pubDate>Wed, 08 Jul 2026 08:42:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23981]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[New lidar method can measure small objects]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23982/new-lidar-method-can-measure-small-objects?from_rss=1]]></link>
<description><![CDATA[It could help in high precision systems for manufacturing.]]></description>
<pubDate>Wed, 08 Jul 2026 08:25:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23982]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Fusion rocket test paves way for superfast interplanetary travel]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23767/fusion-rocket-test-paves-way-for-superfast-interplanetary-travel?from_rss=1]]></link>
<description><![CDATA[Pulsar Fusion’s ‘first plasma’ success seen as the first step toward a sustained fusion reaction.]]></description>
<pubDate>Tue, 07 Jul 2026 08:34:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23767]]></guid>
<dc:creator>Tereza Pultarova</dc:creator>
<dc:subject>Aerospace</dc:subject>
</item>
<item>
<title><![CDATA[Intel Foundry breaks ground on Santa Clara facility]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23970/intel-foundry-breaks-ground-on-santa-clara-facility?from_rss=1]]></link>
<description><![CDATA[It points to continued momentum for the company’s semiconductor manufacturing prowess.]]></description>
<pubDate>Thu, 02 Jul 2026 08:48:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23970]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[GM secures a supply of memory, storage chips from Micron]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23969/gm-secures-a-supply-of-memory-storage-chips-from-micron?from_rss=1]]></link>
<description><![CDATA[The agreement also includes a collaboration for future memory and storage needs for GM’s vehicle roadmap.]]></description>
<pubDate>Thu, 02 Jul 2026 08:31:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23969]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[ECIA: 5 year high for electronic components market sentiment]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23959/ecia-5-year-high-for-electronic-components-market-sentiment?from_rss=1]]></link>
<description><![CDATA[But July may falter slightly.]]></description>
<pubDate>Tue, 30 Jun 2026 08:52:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23959]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Another big SATCOM deal as Rocket Lab buys Iridium]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23958/another-big-satcom-deal-as-rocket-lab-buys-iridium?from_rss=1]]></link>
<description><![CDATA[The $8 billion deal continues a big year of expansion in satellite communications.]]></description>
<pubDate>Tue, 30 Jun 2026 08:39:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23958]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[New UCIe routing approach in package substrates]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23941/new-ucie-routing-approach-in-package-substrates?from_rss=1]]></link>
<description><![CDATA[UCIe provides wide channels with high signal counts, and a new transmission line structure could help keep layer counts reasonable as bump count scales up in IC substrates.]]></description>
<pubDate>Tue, 30 Jun 2026 08:36:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23941]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>LED</dc:subject>
</item>
<item>
<title><![CDATA[SEMI: AI boosts 300 mm memory fab equipment investment past $50 billion]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23957/semi-ai-boosts-300-mm-memory-fab-equipment-investment-past-50-billion?from_rss=1]]></link>
<description><![CDATA[It is the first time it has hit this dollar mark.]]></description>
<pubDate>Tue, 30 Jun 2026 08:25:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23957]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[EPC announces EPC2378 25 V, 410 µO eGaN in mass production for high-density DC-DC conversion]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23923/epc-announces-epc2378-25-v-410-µo-egan-in-mass-production-for-high-density-dc-dc-conversion?from_rss=1]]></link>
<description><![CDATA[The transistor enables high-density power system designers to achieve higher efficiency, faster switching and greater power density in demanding DC-DC conversion applications.]]></description>
<pubDate>Tue, 30 Jun 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23923]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Littelfuse launches ultra-low power omnipolar TMR switch sensor]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23935/littelfuse-launches-ultra-low-power-omnipolar-tmr-switch-sensor?from_rss=1]]></link>
<description><![CDATA[The switch sensor enables high-sensitivity magnetic field sensing with 1.5 µA current draw for always-on, battery-powered designs.]]></description>
<pubDate>Mon, 29 Jun 2026 08:17:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23935]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Export controls slowed China's chip ambitions. They didn't stop them]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23873/export-controls-slowed-china-s-chip-ambitions-they-didn-t-stop-them?from_rss=1]]></link>
<description><![CDATA[From advanced chip design to domestic equipment mandates, China's semiconductor ecosystem is building momentum — even without ASML.]]></description>
<pubDate>Mon, 29 Jun 2026 08:15:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23873]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
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<item>
<title><![CDATA[STMicroelectronics introduces secure mobile chip quantum cryptography chip]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23949/stmicroelectronics-introduces-secure-mobile-chip-quantum-cryptography-chip?from_rss=1]]></link>
<description><![CDATA[It is called a world’s first.]]></description>
<pubDate>Fri, 26 Jun 2026 08:19:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23949]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Financial and ID Technologies</dc:subject>
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<item>
<title><![CDATA[Nokia expands test and packaging operations in Pennsylvania]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23946/nokia-expands-test-and-packaging-operations-in-pennsylvania?from_rss=1]]></link>
<description><![CDATA[The site will increase productivity by up to 10 times its current level.]]></description>
<pubDate>Thu, 25 Jun 2026 08:42:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23946]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[New 650 V ICeGaN device for automotive applications from CGD helps increase EV range]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23866/new-650-v-icegan-device-for-automotive-applications-from-cgd-helps-increase-ev-range?from_rss=1]]></link>
<description><![CDATA[The device enables engineers to realize smaller, lighter inverters that help extend electric vehicle (EV) range.]]></description>
<pubDate>Wed, 24 Jun 2026 07:40:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23866]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Gallery: IMS 2026 in Boston]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23918/gallery-ims-2026-in-boston?from_rss=1]]></link>
<description><![CDATA[GlobalSpec caught up with customers and exhibitors at the show to see just how they have been making waves this year.]]></description>
<pubDate>Fri, 19 Jun 2026 00:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23918]]></guid>
<dc:creator>Emily Councilor</dc:creator>
<dc:subject>Industrial &amp; Medical Technology</dc:subject>
</item>
<item>
<title><![CDATA[Chip revenues to reach $2 trillion by 2027]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23911/chip-revenues-to-reach-2-trillion-by-2027?from_rss=1]]></link>
<description><![CDATA[It will take AI just one year to double semiconductor values.]]></description>
<pubDate>Thu, 18 Jun 2026 08:53:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23911]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[GPUs get the glory. Storage is what's slowing AI down]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23913/gpus-get-the-glory-storage-is-what-s-slowing-ai-down?from_rss=1]]></link>
<description><![CDATA[IDC says enterprise storage is back to double-digit growth. Solidigm says GPUs are only as fast as the data feeding them. Both are pointing at the same problem.]]></description>
<pubDate>Thu, 18 Jun 2026 08:44:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23913]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Coherent, SandboxAQ get CHIPS funding]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23912/coherent-sandboxaq-get-chips-funding?from_rss=1]]></link>
<description><![CDATA[The investments will bolster InP semiconductor production and AI-driven materials discovery platforms.]]></description>
<pubDate>Thu, 18 Jun 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23912]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Computer Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Renesas expands cloud-based software system with Pictorus deal]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23914/renesas-expands-cloud-based-software-system-with-pictorus-deal?from_rss=1]]></link>
<description><![CDATA[The company will be integrated into Renesas 365 cloud native platform.]]></description>
<pubDate>Thu, 18 Jun 2026 08:18:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23914]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
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