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<title>Electronics360: Electronics Supply Chain News &amp; Analysis</title>
<link>https://electronics360.globalspec.com/supply-chain</link>
<description><![CDATA[Recent content from Electronics360: Electronics Supply Chain News & Analysis]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Wed, 23 Sep 2026 08:09:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
<item>
<title><![CDATA[Tektronix expands 8-channel oscilloscope portfolio]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24153/tektronix-expands-8-channel-oscilloscope-portfolio?from_rss=1]]></link>
<description><![CDATA[The testing tool gives added flexibility for RF, sensing and other high-speed digital applications.]]></description>
<pubDate>Wed, 23 Sep 2026 08:09:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24153]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[ECIA: Electronic components moderation continues in August]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24152/ecia-electronic-components-moderation-continues-in-august?from_rss=1]]></link>
<description><![CDATA[And September will continue that trend.]]></description>
<pubDate>Tue, 22 Sep 2026 08:35:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24152]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Application Forecasts and Market Shares</dc:subject>
</item>
<item>
<title><![CDATA[Flexible semiconductors move toward practical use]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24113/flexible-semiconductors-move-toward-practical-use?from_rss=1]]></link>
<description><![CDATA[New materials and manufacturing methods are enabling semiconductors that can bend, with applications in wearables, portable electronics and industrial sensors.]]></description>
<pubDate>Mon, 21 Sep 2026 08:33:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24113]]></guid>
<dc:creator>Seth Price</dc:creator>
<dc:subject>Semiconductor Value Chain</dc:subject>
</item>
<item>
<title><![CDATA[This sensor knows where 10 people are in a room]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24147/this-sensor-knows-where-10-people-are-in-a-room?from_rss=1]]></link>
<description><![CDATA[Aqara’s mmWave radar-based device improves human presence detection in smart homes but securely.]]></description>
<pubDate>Fri, 18 Sep 2026 08:43:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24147]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Audio and Video</dc:subject>
</item>
<item>
<title><![CDATA[Verizon makes world’s first AI-based crowd detection field trial]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24149/verizon-makes-world-s-first-ai-based-crowd-detection-field-trial?from_rss=1]]></link>
<description><![CDATA[The successful testing provides a path to future 6G use cases.]]></description>
<pubDate>Fri, 18 Sep 2026 08:30:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24149]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Broadband</dc:subject>
</item>
<item>
<title><![CDATA[Nordic’s new multi-protocol SoC targets smart home, asset trackers]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24148/nordic-s-new-multi-protocol-soc-targets-smart-home-asset-trackers?from_rss=1]]></link>
<description><![CDATA[The chip supports BLE, Bluetooth Channel Sounding, Thread, Zigbee and Matter.]]></description>
<pubDate>Fri, 18 Sep 2026 08:21:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24148]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Home Appliances</dc:subject>
</item>
<item>
<title><![CDATA[Infineon furthers its core growth drivers with memory sale]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24150/infineon-furthers-its-core-growth-drivers-with-memory-sale?from_rss=1]]></link>
<description><![CDATA[The company will sell its NOR flash and F-RAM business to Winbond.]]></description>
<pubDate>Fri, 18 Sep 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24150]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[Arrow Electronics and ST Microelectronics accelerate industrial AMR development with a new reference platform]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24031/arrow-electronics-and-st-microelectronics-accelerate-industrial-amr-development-with-a-new-reference-platform?from_rss=1]]></link>
<description><![CDATA[The reference platform is designed to shorten the path from concept to deployment for professional service robots.]]></description>
<pubDate>Fri, 18 Sep 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24031]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
</item>
<item>
<title><![CDATA[Fujitsu targets AI data center market in Japan, Europe]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24146/fujitsu-targets-ai-data-center-market-in-japan-europe?from_rss=1]]></link>
<description><![CDATA[The company has developed both the Monaka CPU and a server for multiple sectors.]]></description>
<pubDate>Thu, 17 Sep 2026 08:23:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24146]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Americans’ wireless data obsession hits a new high]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24139/americans-wireless-data-obsession-hits-a-new-high?from_rss=1]]></link>
<description><![CDATA[In 2025 alone, 5G consumers used more data than the entire 4G decade combined.]]></description>
<pubDate>Mon, 14 Sep 2026 14:49:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24139]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Broadband</dc:subject>
</item>
<item>
<title><![CDATA[ADI boosts physical AI portfolio with Alif buy]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24137/adi-boosts-physical-ai-portfolio-with-alif-buy?from_rss=1]]></link>
<description><![CDATA[The $1.35 billion acquisition will combine technologies to accelerate on-device physical AI systems.]]></description>
<pubDate>Fri, 11 Sep 2026 08:16:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24137]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[D-Wave finalizes $100 million CHIPS Act funding]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24132/d-wave-finalizes-100-million-chips-act-funding?from_rss=1]]></link>
<description><![CDATA[The investment will accelerate R&D development and scaling of annealing and gate-model quantum systems.]]></description>
<pubDate>Thu, 10 Sep 2026 20:49:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24132]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[Verizon secures 80+ million miles of fiber in Corning deal]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24134/verizon-secures-80-million-miles-of-fiber-in-corning-deal?from_rss=1]]></link>
<description><![CDATA[The wires will be used for home broadband, enterprise services and AI backbone.]]></description>
<pubDate>Thu, 10 Sep 2026 09:12:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24134]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[AMSL expands High NA lithography adoption]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24131/amsl-expands-high-na-lithography-adoption?from_rss=1]]></link>
<description><![CDATA[The company is collaborating with TSMC, Intel and Samsung on new semiconductor manufacturing technology.]]></description>
<pubDate>Thu, 10 Sep 2026 08:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24131]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[Everspin advances MRAM in aerospace, defense applications]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24120/everspin-advances-mram-in-aerospace-defense-applications?from_rss=1]]></link>
<description><![CDATA[Teledyne HiRel will add the memory technology to its technology portfolio.]]></description>
<pubDate>Fri, 04 Sep 2026 08:13:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24120]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Aerospace</dc:subject>
</item>
<item>
<title><![CDATA[GaN foundries aligning efforts around system-level solutions]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24093/gan-foundries-aligning-efforts-around-system-level-solutions?from_rss=1]]></link>
<description><![CDATA[A shakeup in market players is not slowing the growth of the technology.]]></description>
<pubDate>Fri, 04 Sep 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24093]]></guid>
<dc:creator>Don Dingee</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Sivers expands InP manufacturing capabilities in Scotland]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24121/sivers-expands-inp-manufacturing-capabilities-in-scotland?from_rss=1]]></link>
<description><![CDATA[The company will invest $30 million in expanding the facility.]]></description>
<pubDate>Fri, 04 Sep 2026 01:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24121]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Processors</dc:subject>
</item>
<item>
<title><![CDATA[Lam Research breaks ground on new Oregon lab]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24115/lam-research-breaks-ground-on-new-oregon-lab?from_rss=1]]></link>
<description><![CDATA[It will expand cleanroom lab space by more than 50%.]]></description>
<pubDate>Wed, 02 Sep 2026 08:35:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24115]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[High-bandwidth flash in AI memory architectures]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23943/high-bandwidth-flash-in-ai-memory-architectures?from_rss=1]]></link>
<description><![CDATA[HBF provides high capacity to AI processors for storing model weights for inference tasks.]]></description>
<pubDate>Tue, 01 Sep 2026 08:29:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23943]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[TI's new coreless sensor reads two-axis fields]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24109/ti-s-new-coreless-sensor-reads-two-axis-fields?from_rss=1]]></link>
<description><![CDATA[The Hall-effect device is targeted at HEV/EV.]]></description>
<pubDate>Thu, 27 Aug 2026 08:25:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24109]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Micron builds first US-dedicated memory research hub]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24107/micron-builds-first-us-dedicated-memory-research-hub?from_rss=1]]></link>
<description><![CDATA[Micron Research Labs will be created through an investment of $10 billion over the next decade.]]></description>
<pubDate>Wed, 26 Aug 2026 08:15:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24107]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Memory and Storage</dc:subject>
</item>
<item>
<title><![CDATA[How sensors make subsea cables SMART]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23991/how-sensors-make-subsea-cables-smart?from_rss=1]]></link>
<description><![CDATA[Sensors integrated into commercially standard telecommunication cables can monitor ocean bottom conditions for climate study and early warning systems for tsunamis and earthquakes,]]></description>
<pubDate>Tue, 25 Aug 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23991]]></guid>
<dc:creator>N. Mughees</dc:creator>
<dc:subject>Financial and ID Technologies</dc:subject>
</item>
<item>
<title><![CDATA[Packaging materials may be the next AI roadblock]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24022/packaging-materials-may-be-the-next-ai-roadblock?from_rss=1]]></link>
<description><![CDATA[ABF still corners the market in semiconductor packaging, but new material sets for PCBs, substrates and SLPs are being brought to market.]]></description>
<pubDate>Mon, 24 Aug 2026 08:36:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24022]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[The status of in-circuit testing and functional testing]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24029/the-status-of-in-circuit-testing-and-functional-testing?from_rss=1]]></link>
<description><![CDATA[Explore the differences between in-circuit and functional testing as applied to printed circuit board design and manufacturing.]]></description>
<pubDate>Mon, 24 Aug 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24029]]></guid>
<dc:creator>N. Mughees</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Dirac Labs' quantum sensors head to field trials]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24103/dirac-labs-quantum-sensors-head-to-field-trials?from_rss=1]]></link>
<description><![CDATA[With $1.8 million in pre-seed funding, Dirac Labs will test diamond-based sensors for GPS-free navigation underground and underwater.]]></description>
<pubDate>Fri, 21 Aug 2026 08:49:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24103]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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