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<title>Electronics360: Electronics Supply Chain News &amp; Analysis</title>
<link>https://electronics360.globalspec.com/supply-chain</link>
<description><![CDATA[Recent content from Electronics360: Electronics Supply Chain News & Analysis]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Tue, 09 Jun 2026 10:48:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
<item>
<title><![CDATA[PCIM 2026: TI unveils battery monitor chip for EVs, energy storage]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23856/pcim-2026-ti-unveils-battery-monitor-chip-for-evs-energy-storage?from_rss=1]]></link>
<description><![CDATA[The chip supports 26 cells per device, allowing fewer chips per battery pack and lower system costs.]]></description>
<pubDate>Tue, 09 Jun 2026 10:48:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23856]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[One module, two data center problems solved]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23877/one-module-two-data-center-problems-solved?from_rss=1]]></link>
<description><![CDATA[Lotus Microsystems’ module tackles power efficiency and heat management in one device.]]></description>
<pubDate>Tue, 09 Jun 2026 08:48:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23877]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Intel, Hon Hai to jointly develop AI infrastructure]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23871/intel-hon-hai-to-jointly-develop-ai-infrastructure?from_rss=1]]></link>
<description><![CDATA[The companies will work on silicon, rack, system and application layers.]]></description>
<pubDate>Fri, 05 Jun 2026 08:56:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23871]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Bringing co-packaged optics to rack-scale AI infrastructure]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23872/bringing-co-packaged-optics-to-rack-scale-ai-infrastructure?from_rss=1]]></link>
<description><![CDATA[Ayar Labs joins Nvidia’s NVLink Fusion platform.]]></description>
<pubDate>Fri, 05 Jun 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23872]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Compact SWIR spectroscopy modules improve signal quality for accessible material analysis]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23789/compact-swir-spectroscopy-modules-improve-signal-quality-for-accessible-material-analysis?from_rss=1]]></link>
<description><![CDATA[The upgraded MEMS FPI design delivers higher signal to noise ratio and improved stray light suppression.]]></description>
<pubDate>Fri, 05 Jun 2026 07:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23789]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Indium Corporation to feature precision gold-based die-attach preforms at IMS]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23870/indium-corporation-to-feature-precision-gold-based-die-attach-preforms-at-ims?from_rss=1]]></link>
<description><![CDATA[High-reliability, gold-based precision die-attach preforms will be showcased at the event.]]></description>
<pubDate>Fri, 05 Jun 2026 07:25:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23870]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Cosmic brings its latest high-power semiconductor testing platforms to PCIM Europe 2026]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23865/cosmic-brings-its-latest-high-power-semiconductor-testing-platforms-to-pcim-europe-2026?from_rss=1]]></link>
<description><![CDATA[Innovations that advance semiconductor testing capabilities will be highlighted.]]></description>
<pubDate>Fri, 05 Jun 2026 07:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23865]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Direct to cell users to rise to 133 million by 2031]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23855/direct-to-cell-users-to-rise-to-133-million-by-2031?from_rss=1]]></link>
<description><![CDATA[Up from just 17.4 million in 2026.]]></description>
<pubDate>Wed, 03 Jun 2026 08:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23855]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Critical Communications</dc:subject>
</item>
<item>
<title><![CDATA[GF has the photonic chip. Now it has a light source]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23852/gf-has-the-photonic-chip-now-it-has-a-light-source?from_rss=1]]></link>
<description><![CDATA[Sivers’ laser arrays can now be integrated into reference designs built on the foundry’s photonics platform.]]></description>
<pubDate>Wed, 03 Jun 2026 08:43:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23852]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Computex 2026: Nvidia and TSMC are bringing AI into the fab itself]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23853/computex-2026-nvidia-and-tsmc-are-bringing-ai-into-the-fab-itself?from_rss=1]]></link>
<description><![CDATA[Under a new deal, Nvidia will supply computing and AI chips across its semiconductor design and manufacturing lifecycle.]]></description>
<pubDate>Wed, 03 Jun 2026 08:16:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23853]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Keysight unveils RF signal analyzers for wireless design and validation]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23854/keysight-unveils-rf-signal-analyzers-for-wireless-design-and-validation?from_rss=1]]></link>
<description><![CDATA[The goal is to get systems faster to market.]]></description>
<pubDate>Wed, 03 Jun 2026 08:07:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23854]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[Qorvo to showcase proven RF solutions with live demos and technical leadership at IMS2026]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23844/qorvo-to-showcase-proven-rf-solutions-with-live-demos-and-technical-leadership-at-ims2026?from_rss=1]]></link>
<description><![CDATA[The company will demonstrate how its technologies enable real-world radio frequency (RF) performance across SATCOM, 5G, internet of things (IoT) and defense applications.]]></description>
<pubDate>Wed, 03 Jun 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23844]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[MEMPHIS Electronic brings 35 years of memory expertise to Hardware Pioneers in London]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23811/memphis-electronic-brings-35-years-of-memory-expertise-to-hardware-pioneers-in-london?from_rss=1]]></link>
<description><![CDATA[The event provides an ideal platform for MEMPHIS to engage with customers facing increasing uncertainty and complexity in the semiconductor memory market.]]></description>
<pubDate>Wed, 03 Jun 2026 07:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23811]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[SIA: AI data center chips could hit $1.2 trillion by 2029]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23839/sia-ai-data-center-chips-could-hit-1-2-trillion-by-2029?from_rss=1]]></link>
<description><![CDATA[Data center racks are projected to derive 95% of their value from semiconductors.]]></description>
<pubDate>Tue, 02 Jun 2026 08:41:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23839]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Computex 2026: CoolIT pushes single-phase DLC to 15 kW]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23837/computex-2026-coolit-pushes-single-phase-dlc-to-15-kw?from_rss=1]]></link>
<description><![CDATA[It also makes the case for cold plates through 2030.]]></description>
<pubDate>Tue, 02 Jun 2026 08:31:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23837]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Computex 2026: Nvidia’s Vera Rubin data center platform ramps to full production]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23836/computex-2026-nvidia-s-vera-rubin-data-center-platform-ramps-to-full-production?from_rss=1]]></link>
<description><![CDATA[The systems could also be used in AI labs or cloud farms.]]></description>
<pubDate>Tue, 02 Jun 2026 08:30:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23836]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Application Forecasts and Market Shares</dc:subject>
</item>
<item>
<title><![CDATA[Plasma for high-quality power modules]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23792/plasma-for-high-quality-power-modules?from_rss=1]]></link>
<description><![CDATA[At PCIM Europe, Plasmatreat will display solutions for atmospheric and low-pressure plasma treatment of power modules.]]></description>
<pubDate>Tue, 02 Jun 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23792]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Toward scalable single molecule biosensing using carbon nanotube FETs]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23723/toward-scalable-single-molecule-biosensing-using-carbon-nanotube-fets?from_rss=1]]></link>
<description><![CDATA[Imec achieves real-time biomolecule detection using a wafer-scale bioFET approach, marking a promising step toward high-throughput sensing for genomics and proteomics.]]></description>
<pubDate>Mon, 01 Jun 2026 08:56:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23723]]></guid>
<dc:creator>Lijun Liu and Koen Martens for imec</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[EPC showcases GaN power solutions for robotics, drones and AI servers at PCIM Europe 2026]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23793/epc-showcases-gan-power-solutions-for-robotics-drones-and-ai-servers-at-pcim-europe-2026?from_rss=1]]></link>
<description><![CDATA[The company will demonstrate how its Gen 7 gallium nitride (GaN) platform enables compact, production-ready power architectures for next generation intelligent motion systems and artificial intelligence (AI) power delivery.]]></description>
<pubDate>Mon, 01 Jun 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23793]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Fire dozers are now rolling sensor platforms]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23829/fire-dozers-are-now-rolling-sensor-platforms?from_rss=1]]></link>
<description><![CDATA[A NASA-developed thermal alert system doubles as a canopy-level fire data collector.]]></description>
<pubDate>Fri, 29 May 2026 08:43:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23829]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Access Control and Fire</dc:subject>
</item>
<item>
<title><![CDATA[First 6G connections to arrive in 2029]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23828/first-6g-connections-to-arrive-in-2029?from_rss=1]]></link>
<description><![CDATA[U.S., South Korea expected to lead early commercialization.]]></description>
<pubDate>Fri, 29 May 2026 08:40:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23828]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Broadband</dc:subject>
</item>
<item>
<title><![CDATA[Synopsys, Samsung Foundry expand manufacturing deal]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23820/synopsys-samsung-foundry-expand-manufacturing-deal?from_rss=1]]></link>
<description><![CDATA[The new tools will be used for AI-enabled semiconductors.]]></description>
<pubDate>Thu, 28 May 2026 13:15:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23820]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronic Design Automation</dc:subject>
</item>
<item>
<title><![CDATA[Polar to manufacture power MOSFETs from Nexperia]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23818/polar-to-manufacture-power-mosfets-from-nexperia?from_rss=1]]></link>
<description><![CDATA[The deal guarantees a supply of the chips and Polar expands its discrete portfolio]]></description>
<pubDate>Thu, 28 May 2026 08:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23818]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[SEMI: Glass core substrates to grow 67.2% CAGR]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23819/semi-glass-core-substrates-to-grow-67-2-cagr?from_rss=1]]></link>
<description><![CDATA[From 2028 to 2040, the advanced packaging option is set to grow alongside AI and HPC chips.]]></description>
<pubDate>Thu, 28 May 2026 08:11:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23819]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Mouser now shipping new Sensirion SFM3505 high-performance digital mass flow meters for medical and industrial applications]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23775/mouser-now-shipping-new-sensirion-sfm3505-high-performance-digital-mass-flow-meters-for-medical-and-industrial-applications?from_rss=1]]></link>
<description><![CDATA[The compact gas flow sensors deliver ultra-low noise, exceptional accuracy and minimal pressure drop for inspiratory flow measurement in medical and industrial applications.]]></description>
<pubDate>Thu, 28 May 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23775]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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