<?xml version="1.0" encoding="UTF-8"?>
<rss version="2.0" xmlns:dc="http://purl.org/dc/elements/1.1/">
<channel>
<title>Electronics360: Electronics Supply Chain News &amp; Analysis</title>
<link>https://electronics360.globalspec.com/supply-chain</link>
<description><![CDATA[Recent content from Electronics360: Electronics Supply Chain News & Analysis]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Fri, 04 Sep 2026 08:13:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
<item>
<title><![CDATA[Everspin advances MRAM in aerospace, defense applications]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24120/everspin-advances-mram-in-aerospace-defense-applications?from_rss=1]]></link>
<description><![CDATA[Teledyne HiRel will add the memory technology to its technology portfolio.]]></description>
<pubDate>Fri, 04 Sep 2026 08:13:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24120]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Aerospace</dc:subject>
</item>
<item>
<title><![CDATA[GaN foundries aligning efforts around system-level solutions]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24093/gan-foundries-aligning-efforts-around-system-level-solutions?from_rss=1]]></link>
<description><![CDATA[A shakeup in market players is not slowing the growth of the technology.]]></description>
<pubDate>Fri, 04 Sep 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24093]]></guid>
<dc:creator>Don Dingee</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Sivers expands InP manufacturing capabilities in Scotland]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24121/sivers-expands-inp-manufacturing-capabilities-in-scotland?from_rss=1]]></link>
<description><![CDATA[The company will invest $30 million in expanding the facility.]]></description>
<pubDate>Fri, 04 Sep 2026 01:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24121]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Processors</dc:subject>
</item>
<item>
<title><![CDATA[Lam Research breaks ground on new Oregon lab]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24115/lam-research-breaks-ground-on-new-oregon-lab?from_rss=1]]></link>
<description><![CDATA[It will expand cleanroom lab space by more than 50%.]]></description>
<pubDate>Wed, 02 Sep 2026 08:35:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24115]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[High-bandwidth flash in AI memory architectures]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23943/high-bandwidth-flash-in-ai-memory-architectures?from_rss=1]]></link>
<description><![CDATA[HBF provides high capacity to AI processors for storing model weights for inference tasks.]]></description>
<pubDate>Tue, 01 Sep 2026 08:29:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23943]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[TI's new coreless sensor reads two-axis fields]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24109/ti-s-new-coreless-sensor-reads-two-axis-fields?from_rss=1]]></link>
<description><![CDATA[The Hall-effect device is targeted at HEV/EV.]]></description>
<pubDate>Thu, 27 Aug 2026 08:25:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24109]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Micron builds first US-dedicated memory research hub]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24107/micron-builds-first-us-dedicated-memory-research-hub?from_rss=1]]></link>
<description><![CDATA[Micron Research Labs will be created through an investment of $10 billion over the next decade.]]></description>
<pubDate>Wed, 26 Aug 2026 08:15:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24107]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Memory and Storage</dc:subject>
</item>
<item>
<title><![CDATA[How sensors make subsea cables SMART]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23991/how-sensors-make-subsea-cables-smart?from_rss=1]]></link>
<description><![CDATA[Sensors integrated into commercially standard telecommunication cables can monitor ocean bottom conditions for climate study and early warning systems for tsunamis and earthquakes,]]></description>
<pubDate>Tue, 25 Aug 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23991]]></guid>
<dc:creator>N. Mughees</dc:creator>
<dc:subject>Financial and ID Technologies</dc:subject>
</item>
<item>
<title><![CDATA[Packaging materials may be the next AI roadblock]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24022/packaging-materials-may-be-the-next-ai-roadblock?from_rss=1]]></link>
<description><![CDATA[ABF still corners the market in semiconductor packaging, but new material sets for PCBs, substrates and SLPs are being brought to market.]]></description>
<pubDate>Mon, 24 Aug 2026 08:36:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24022]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[The status of in-circuit testing and functional testing]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24029/the-status-of-in-circuit-testing-and-functional-testing?from_rss=1]]></link>
<description><![CDATA[Explore the differences between in-circuit and functional testing as applied to printed circuit board design and manufacturing.]]></description>
<pubDate>Mon, 24 Aug 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24029]]></guid>
<dc:creator>N. Mughees</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Dirac Labs' quantum sensors head to field trials]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24103/dirac-labs-quantum-sensors-head-to-field-trials?from_rss=1]]></link>
<description><![CDATA[With $1.8 million in pre-seed funding, Dirac Labs will test diamond-based sensors for GPS-free navigation underground and underwater.]]></description>
<pubDate>Fri, 21 Aug 2026 08:49:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24103]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Video: IBM takes a big step toward its Starling quantum computer]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24102/video-ibm-takes-a-big-step-toward-its-starling-quantum-computer?from_rss=1]]></link>
<description><![CDATA[The company has successfully joined and cooled down two cryogenic modules into a single environment.]]></description>
<pubDate>Fri, 21 Aug 2026 08:13:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24102]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Computer Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Lam Research to invest $3 billion on R&D lab network]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24098/lam-research-to-invest-3-billion-on-r-d-lab-network?from_rss=1]]></link>
<description><![CDATA[The investment will be spread out over the next five years.]]></description>
<pubDate>Thu, 20 Aug 2026 08:39:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24098]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[Rad-tolerant atomic clock unveiled for new space applications]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24099/rad-tolerant-atomic-clock-unveiled-for-new-space-applications?from_rss=1]]></link>
<description><![CDATA[Microchip’s expanding portfolio of space ICs targets SATCOM, alternative navigation and Earth imaging.]]></description>
<pubDate>Thu, 20 Aug 2026 08:36:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24099]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[ECIA: Summer slump hits electronic component sales]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24101/ecia-summer-slump-hits-electronic-component-sales?from_rss=1]]></link>
<description><![CDATA[But July still beat sales expectations.]]></description>
<pubDate>Thu, 20 Aug 2026 08:12:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24101]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Application Forecasts and Market Shares</dc:subject>
</item>
<item>
<title><![CDATA[Improving physical AI speech clarity through MEMS and beamforming]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24100/improving-physical-ai-speech-clarity-through-mems-and-beamforming?from_rss=1]]></link>
<description><![CDATA[A new collaboration between sensiBel and Aizip will target large language model natural human-AI interactions.]]></description>
<pubDate>Thu, 20 Aug 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24100]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Hamamatsu Photonics Europe strengthens advanced imaging solutions with Fairchild Imaging CMOS sensor technologies]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24036/hamamatsu-photonics-europe-strengthens-advanced-imaging-solutions-with-fairchild-imaging-cmos-sensor-technologies?from_rss=1]]></link>
<description><![CDATA[These high-performance complementary metal–oxide–semiconductor (CMOS) image sensors are engineered for demanding X-ray, medical, scientific, space-qualified and other advanced imaging environments.]]></description>
<pubDate>Thu, 20 Aug 2026 07:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24036]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Microchip revises Ethernet sensor bridge for edge AI systems]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24092/microchip-revises-ethernet-sensor-bridge-for-edge-ai-systems?from_rss=1]]></link>
<description><![CDATA[The revision comes as a push for smaller form factors is becoming the norm.]]></description>
<pubDate>Tue, 18 Aug 2026 08:38:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24092]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Rice to develop advanced antennas for future Army systems]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24079/rice-to-develop-advanced-antennas-for-future-army-systems?from_rss=1]]></link>
<description><![CDATA[The university will create a dedicated research center for sensing, imaging and communication.]]></description>
<pubDate>Fri, 07 Aug 2026 08:22:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24079]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[200 W smart amplifier module purpose-built for critical C-UAS and EW applications]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24017/200-w-smart-amplifier-module-purpose-built-for-critical-c-uas-and-ew-applications?from_rss=1]]></link>
<description><![CDATA[Compact form factor and high power density make it ideal for mobile, airborne, shipboard and ground-based defense platforms where space, weight and reliability are critical.]]></description>
<pubDate>Fri, 07 Aug 2026 08:12:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24017]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Programmable clock generator improves spacecraft timing systems]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24071/programmable-clock-generator-improves-spacecraft-timing-systems?from_rss=1]]></link>
<description><![CDATA[The device generates clean, phase-aligned frequencies form a single source.]]></description>
<pubDate>Thu, 06 Aug 2026 08:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24071]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[Video: Amphenol’s fiber panel supports 192 LC connections]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24072/video-amphenol-s-fiber-panel-supports-192-lc-connections?from_rss=1]]></link>
<description><![CDATA[The need for more connections comes as data centers are fighting for more space per rack.]]></description>
<pubDate>Thu, 06 Aug 2026 08:29:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24072]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Clearfield expands fiber optic sensing portfolio]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24066/clearfield-expands-fiber-optic-sensing-portfolio?from_rss=1]]></link>
<description><![CDATA[The technology allows data centers, telecoms and other network infrastructure users to continuously monitor outside fiber routes.]]></description>
<pubDate>Wed, 05 Aug 2026 08:46:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24066]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Power</dc:subject>
</item>
<item>
<title><![CDATA[Samsung to begin construction on second fab in Texas]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24063/samsung-to-begin-construction-on-second-fab-in-texas?from_rss=1]]></link>
<description><![CDATA[The Korean electronics giant plans to start at the end of 2026.]]></description>
<pubDate>Wed, 05 Aug 2026 08:04:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24063]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Value Chain</dc:subject>
</item>
<item>
<title><![CDATA[GE Appliances is TI's first named GaN customer in appliances]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24065/ge-appliances-is-ti-s-first-named-gan-customer-in-appliances?from_rss=1]]></link>
<description><![CDATA[The deal marks the first time TI has named a customer for its GaN motor drive technology in the appliance market.]]></description>
<pubDate>Wed, 05 Aug 2026 08:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24065]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Home Appliances</dc:subject>
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</channel>
</rss>
