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Supply Chain
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Embedded SIM technology critical for mass rollout of cellular IoT
The technology also supports 5G-ready LTE-M and NB-IoT modules.
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Tessent Connect DFT methodology speeds up IC design testing
Mentor Graphics Corporation has announced Tessent Connect, a new design-for-test (DFT) methodology that enables IC designers to hit manufacturing test goals faster and using fewer resources than traditional DFT methods.
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Tiny wake-up chip could extend battery life for IoT devices
The wake-up chip only wakes up a device when it needs to communicate and perform its function and keeps the device dormant the rest of the time, thereby reducing power use.
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Xilinx expands automotive-grade programmable SoC portfolio
Xilinx Inc. is growing its portfolio of devices that meet the safety, quality and reliability requirements for automotive products ranging from small devices powering edge sensors to devices for centralized domain controllers.
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Bel Magnetic Solutions introduces a series of press-fit ICMs
These ICMs are designed for applications that require a connector that can be pressed onto the PCBA instead of traditional soldering techniques.
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TSMC and Globalfoundries settle disputes
Both companies also agreed to a cross-patent agreement.
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Transphorm ships over half a million GaN power devices for multi-kilowatt class applications
Customers in the broad industrial, infrastructure and IT and PC gaming markets have publicly announced in-production devices built with Transphorm’s GaN technology.
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New surface-mount fully integrated current sensors offer easy handling and layout for high current density applications
The ACS772/3 family expands to include through-hole and surface-mount CB package options with enhanced working isolation voltage.
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Bluetooth system-on-chip extends wireless connectivity to IoT devices
The extended range could be used for both consumer electronics and healthcare devices.
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Air velocity sensors with digital I2C output
Unlike thermistor-based solutions, the PAV3000 has a MEMS sensor core that is minimally affected by ambient temperature changes and provides real-time feedback on proper air flow at critical locations.
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Video: Smart development center produces 50 TB of data daily
Intel’s so-called “smartest building in the world” uses AI to make decisions and is highly automated.
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Three-phase brushless motor control driver for appliances and pumps
The chip eliminates the need for an external MCU.
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50W, 750 V DC input railway converter delivers high conversion efficiency and power density
The railway DC-DC converter taps silicon carbide semiconductor technology to deliver high conversion efficiency and high power density.
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Mobile World Congress 2019: Nvidia introduces edge supercomputing platform
Early adopters include Walmart, BMW, Samsung, NTT and MiTAC.
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Mobile World Congress 2019: Accelerating virtualized 5G radio access networks
Nvidia and Ericsson collaborate to create networks comparable to traditional RANs.
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On Semiconductor ships 100 million image sensors for ADAS applications
The company has installed the chips in Subaru vehicles and others.
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Intel acquires cloud edge computing platform for 5G expansion
The platform will focus on a $65 million silicon addressable market by 2023.
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Low noise and speed benefits of a new bolometer
The nanoscale radiation detector is 100 times faster than its predecessors, and can function without interruption.
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USB-C controller comes to high-volume markets
Cypress Semiconductor has introduced a new semiconductor for mainstream and entry-level notebooks.
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Dialog acquires IoT chip vendor Creative Chips
The $80 million deal will help Dialog to push into IIoT opportunities.
