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Switching Technology Improves SiC MOSFET Performance
AgileSwitch, LLC is patenting its Augmented Turn-Off (ATOff) switching technique, which will be incorporated into gate drivers for 62 mm SiC MOSFETs.
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Thermoelectric Assembly Precisely Regulates CO2 Incubators
Highly efficient thermoelectric assemblies and bi-polar temperature controllers replace bulky, costly compressor-based systems in compact CO2 incubators.
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Tiny Device Uses Light to Manipulate Mechanical Properties
The device has potential applications in GPS, computers, and wristwatches, as a new frequency reference to accurately keep time
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How Laser Engraving Can Spruce Up Your Home
From nifty throw rugs to fluffy pillows, DIY enthusiasts can use laser engravers like the Epilog Zing to decorate almost every corner of their homes.
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A 3-D Printed Excavator Could Raise the Bar for Large-Scale Metal Printing
Hailed as the world’s first 3-D printed excavator, this machine taking shape at Oak Ridge National Laboratory could lead to new uses for additive manufacturing. During the nine-month printing process, researchers will explore the feasibility of printing with low-cost metal alloys. This research could lead to 3-D printing of low-volume, high-complexity components for motor vehicles and large machinery.
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Huawei Smartphone Use Synaptics Touch Products
Synaptics’ touch and display driver integration (TDDI) technology was selected for the?Huawei nova smartphone.
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GM Celebrates 50th Anniversary of the World's First Hydrogen-Fuel Cell Vehicle
Fifty years later, the company has invested more than $2.5 billion in hydrogen fuel cell technology and has been collaborating with Honda since 2013 to develop a next-generation system that will be much more powerful.
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Z-Axis Transponder Coil Fits Car Access Systems
TDK’s EPCOS z-axis transponder coils are designed for passive entry, passive start car access systems.
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Control Optimizes Lighting and Power Usage
Easy installation of modular system saves owners and builders money, time and energy.
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Low-Power AFE Shrinks Size of Wearables
Analog Devices’ AD8233 analog front-end enables designers to shrink the size of wearable devices.
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Samsung to Acquire Open Artificial Intelligence Platform
The acquisition indicates Samsung’s desire to incorporate virtual personal assistants and deliver an AI-based open ecosystem across all of its devices and services.
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Q&A: CEO Discusses Using Smart Protocols and Radio Waves To Send Messages Off-Grid
goTenna CEO discusses how building a product that addresses a real market is critical to start-up success, as well as her company's newest low-power product that people can use to communicate regardless of cell towers, Wi-Fi or satellites.
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New Product: Power-Supply IC
There are general-purpose power-converter ICs as well as ones such as the TI TPS54116-Q1, which targets a specific end-user application and environment.
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RF Power Transistors to Advance Cellular Infrastructure for Smart Cities
Transistors meet the stringent requirements for macro base stations operating between 1805 and 2690 MHz.
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Demo Board Helps Evaluate IXYS MOSFET Gate Driver
The DVRFD615X2 MOSFET demonstration board simplifies evaluation of the IXRFD615X2 dual-high-speed MOSFET gate driver.
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NASA Tests Camera That Will Land The 2020 Mars Rover
According to NASA, a Lander Vision System-equipped mission will open up opportunities to land within more challenging environments and pursue new Mars terrain.
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New Wavelength Converter is the Future of Quantum Tech
The wavelength converter, built on a chip, would allow quantum bits to be manipulated and then transmit that same information over long distances.
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Connector Eliminates Separate Header
TE Connectivity’s SmartSeal connector mates directly to an over-molded PCB ECU housing, eliminating the need for a separate PCB header and sealed enclosure.
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Moving Intelligence to the Edge
Latency and a shortage of bandwidth prevent mission-critical, cloud-based applications from delivering on the promise of the Internet of Things. Fog computing may be able to counter this.
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Enhanced Security Solution Protects Personal Data for Payment, eGovernment Services
NXP adds PUF Anti-Cloning technology to its next-generation SmartMX2 microcontroller, enabling electronic identification solutions.
