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<title>Electronics360</title>
<link>https://electronics360.globalspec.com/</link>
<description><![CDATA[Recent content from Electronics360]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Tue, 10 Nov 2026 07:00:00 EST</pubDate>
<generator>https://electronics360.globalspec.com</generator>
<item>
<title><![CDATA[Drive your next advantage with Fuji Electric]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24233/drive-your-next-advantage-with-fuji-electric?from_rss=1]]></link>
<description><![CDATA[From demanding industrial systems to versatile OEM equipment and compact machines, discover the FRENIC drive that best fits an application.]]></description>
<pubDate>Tue, 10 Nov 2026 07:00:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24233]]></guid>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[Texas wastewater: A new weapon against data center water woes]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24199/texas-wastewater-a-new-weapon-against-data-center-water-woes?from_rss=1]]></link>
<description><![CDATA[The team evaluated two desalination methods: reverse osmosis, which forces water through a semipermeable membrane to remove salt, and thermal treatment, which evaporates water and condenses the vapor.]]></description>
<pubDate>Tue, 10 Nov 2026 05:34:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24199]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[NTU's AI innovation brings new hope for senior safety]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24200/ntu-s-ai-innovation-brings-new-hope-for-senior-safety?from_rss=1]]></link>
<description><![CDATA[The monitoring system features a combination of millimeter-wave radar, thermal sensing and smart plugs, and the data from all three technologies is combined using artificial intelligence (AI) to help identify unusual behavior that might point to deteriorating health or an emergency.]]></description>
<pubDate>Tue, 10 Nov 2026 05:21:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24200]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Consumer Electronics</dc:subject>
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<item>
<title><![CDATA[Flexible drone defies impacts without losing its speed or edge]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24231/flexible-drone-defies-impacts-without-losing-its-speed-or-edge?from_rss=1]]></link>
<description><![CDATA[The design also addresses a key limitation of existing insect-inspired flying robots: their fragile components, which have restricted their ability to operate outside controlled laboratory environments.]]></description>
<pubDate>Mon, 09 Nov 2026 10:25:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24231]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[New flexible drone shrugs off impacts while maintaining blazing speed]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24232/new-flexible-drone-shrugs-off-impacts-while-maintaining-blazing-speed?from_rss=1]]></link>
<description><![CDATA[FlexiQuad can reach speeds of up to 50 mph and achieve linear and angular acceleration comparable to that of traditional quadcopters.]]></description>
<pubDate>Mon, 09 Nov 2026 10:24:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24232]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[Quantum magnetometers could make GPS spoofing irrelevant]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23945/quantum-magnetometers-could-make-gps-spoofing-irrelevant?from_rss=1]]></link>
<description><![CDATA[GPS can be lied to through jamming and spoofing. These sensors are fighting back though the Earth’s magnetic field.]]></description>
<pubDate>Mon, 09 Nov 2026 08:21:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23945]]></guid>
<dc:creator>Tereza Pultarova</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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<title><![CDATA[Advanced thermal and motion solutions for UAV and drone systems]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24229/advanced-thermal-and-motion-solutions-for-uav-and-drone-systems?from_rss=1]]></link>
<description><![CDATA[Pelonis Technologies integrates cooling, heating and motor solutions to enhance UAV thermal management, propulsion efficiency, reliability and performance in demanding environments.]]></description>
<pubDate>Fri, 06 Nov 2026 10:08:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24229]]></guid>
<dc:subject>Consumer Electronics</dc:subject>
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<item>
<title><![CDATA[RadianX launches new dedicated perovskite module production line]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24226/radianx-launches-new-dedicated-perovskite-module-production-line?from_rss=1]]></link>
<description><![CDATA[The company will collaborate with PUT to support commercial-volume production of the solar devices.]]></description>
<pubDate>Fri, 06 Nov 2026 08:46:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24226]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
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<item>
<title><![CDATA[Bluetooth HDT promises faster data speeds, better efficiency]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24228/bluetooth-hdt-promises-faster-data-speeds-better-efficiency?from_rss=1]]></link>
<description><![CDATA[The standard will allow for four times the data transfer than current Bluetooth.]]></description>
<pubDate>Fri, 06 Nov 2026 08:35:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24228]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Audio and Video</dc:subject>
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<item>
<title><![CDATA[TE Connectivity talks better data centers, smarter vehicles]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24227/te-connectivity-talks-better-data-centers-smarter-vehicles?from_rss=1]]></link>
<description><![CDATA[Executives discuss the changing needs in the AI ecosystem and automotive electronics.]]></description>
<pubDate>Fri, 06 Nov 2026 08:15:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24227]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<title><![CDATA[TechInsights Teardown: Hypershell Hyper X Carbon exoskeleton]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24223/techinsights-teardown-hypershell-hyper-x-carbon-exoskeleton?from_rss=1]]></link>
<description><![CDATA[A partial deep dive into the mobility device.]]></description>
<pubDate>Fri, 06 Nov 2026 08:10:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24223]]></guid>
<dc:creator>TechInsights</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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<title><![CDATA[Momentus space launch targets better global 5G IoT coverage]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24224/momentus-space-launch-targets-better-global-5g-iot-coverage?from_rss=1]]></link>
<description><![CDATA[OQ Technology’s 5G NB-IoT will be carried by Momentus’ Vigoride-9 orbital service vehicle in 2027.]]></description>
<pubDate>Thu, 05 Nov 2026 08:38:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24224]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Wired Connectivity</dc:subject>
</item>
<item>
<title><![CDATA[Will SpaceX challenge telecoms after Qualcomm chip deal?]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24225/will-spacex-challenge-telecoms-after-qualcomm-chip-deal?from_rss=1]]></link>
<description><![CDATA[Qualcomm’s cellular infrastructure platforms will power Starlink Mobile’s nationwide terrestrial 5G network.]]></description>
<pubDate>Thu, 05 Nov 2026 08:24:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24225]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Broadband</dc:subject>
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<title><![CDATA[Improving measurement sensitivity for nanoscale device characterization]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24213/improving-measurement-sensitivity-for-nanoscale-device-characterization?from_rss=1]]></link>
<description><![CDATA[As semiconductor devices shrink, signal levels decline, driving the need for advanced characterization techniques to support next-generation nanoscale technologies and performance.]]></description>
<pubDate>Thu, 05 Nov 2026 07:00:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24213]]></guid>
<dc:subject>Consumer Electronics</dc:subject>
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<title><![CDATA[This home robot will clean the litter box after a 30-minute lesson]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24174/this-home-robot-will-clean-the-litter-box-after-a-30-minute-lesson?from_rss=1]]></link>
<description><![CDATA[Owners can teach new household chores in about 30 minutes in a process that requires no coding.]]></description>
<pubDate>Thu, 05 Nov 2026 04:21:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24174]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[Developing better car computers for software-defined vehicles]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24220/developing-better-car-computers-for-software-defined-vehicles?from_rss=1]]></link>
<description><![CDATA[Infineon and Qualcomm collaborate to deploy central car computers.]]></description>
<pubDate>Wed, 04 Nov 2026 08:24:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24220]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Rohde & Schwarz unveils new 5-channel power supply for test]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24218/rohde-schwarz-unveils-new-5-channel-power-supply-for-test?from_rss=1]]></link>
<description><![CDATA[Each channel can be configured individually or connected in series.]]></description>
<pubDate>Wed, 04 Nov 2026 08:09:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24218]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
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<title><![CDATA[Keysight’s XR3 brings better measurement capacity to test racks]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24219/keysight-s-xr3-brings-better-measurement-capacity-to-test-racks?from_rss=1]]></link>
<description><![CDATA[The 14-bit, four-channel device allows engineers to pack measurement and analysis capability in dense equipment racks.]]></description>
<pubDate>Wed, 04 Nov 2026 08:06:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24219]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
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<title><![CDATA[Off-planet data centers: How to put AI in space]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24217/off-planet-data-centers-how-to-put-ai-in-space?from_rss=1]]></link>
<description><![CDATA[AI-ready infrastructure in orbit has its own significant challenges that startups and hyperscalers are seeking to solve.]]></description>
<pubDate>Tue, 03 Nov 2026 08:15:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24217]]></guid>
<dc:creator>Shannon Cuthrell</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
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<title><![CDATA[5 cybersecurity threats in automated systems]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24194/5-cybersecurity-threats-in-automated-systems?from_rss=1]]></link>
<description><![CDATA[Industrial automation faces rising cyber threats, from ransomware and phishing to hardware attacks, legacy vulnerabilities and state-sponsored supply-chain compromises.]]></description>
<pubDate>Tue, 03 Nov 2026 08:00:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24194]]></guid>
<dc:creator>Isaac Shahran</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[Silicon photonics in the age of AI]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24095/silicon-photonics-in-the-age-of-ai?from_rss=1]]></link>
<description><![CDATA[As AI compute and interconnects demand more bandwidth and lower latency, how will these technologies improve efficiency?]]></description>
<pubDate>Mon, 02 Nov 2026 08:16:00 EST</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24095]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
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<title><![CDATA[Watch: Impressive household robot automates soiled laundy]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24170/watch-impressive-household-robot-automates-soiled-laundy?from_rss=1]]></link>
<description><![CDATA[Dyna Robotics' Dyna 2.1 can handle an entire laundry workflow, from operating machines to folding and shelving finished towels.]]></description>
<pubDate>Sat, 31 Oct 2026 04:23:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24170]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[Report: Marvell to boost optical transceiver portfolio with Lumentum]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24215/report-marvell-to-boost-optical-transceiver-portfolio-with-lumentum?from_rss=1]]></link>
<description><![CDATA[The deal would continue its data center interconnect push.]]></description>
<pubDate>Fri, 30 Oct 2026 08:36:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24215]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
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<title><![CDATA[Video: Nordic to demonstrate Bluetooth HDT in silicon]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24214/video-nordic-to-demonstrate-bluetooth-hdt-in-silicon?from_rss=1]]></link>
<description><![CDATA[The technology will increase data rates for the wireless connectivity standard.]]></description>
<pubDate>Fri, 30 Oct 2026 08:23:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24214]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Wired Connectivity</dc:subject>
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<title><![CDATA[Video: Chinese robot hand pushes boundaries with stunning embroidery skills]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24191/video-chinese-robot-hand-pushes-boundaries-with-stunning-embroidery-skills?from_rss=1]]></link>
<description><![CDATA[The system coordinated its fingers to manipulate the delicate strands while keeping the silk taut enough for embroidery.]]></description>
<pubDate>Fri, 30 Oct 2026 07:09:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24191]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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