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<title>Electronics360</title>
<link>https://electronics360.globalspec.com/</link>
<description><![CDATA[Recent content from Electronics360]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Thu, 09 Jul 2026 08:15:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
<item>
<title><![CDATA[Quantum battery tech charges ahead]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23882/quantum-battery-tech-charges-ahead?from_rss=1]]></link>
<description><![CDATA[Researchers in Australia have engineered a proof-of-concept microcavity quantum battery that can charge, store and discharge energy.]]></description>
<pubDate>Thu, 09 Jul 2026 08:15:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23882]]></guid>
<dc:creator>S. Himmelstein</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Infineon introduces the AIROC UWB TSL100 for precise positioning and smart presence detection on a single chip]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23965/infineon-introduces-the-airoc-uwb-tsl100-for-precise-positioning-and-smart-presence-detection-on-a-single-chip?from_rss=1]]></link>
<description><![CDATA[These devices combine precise positioning and smart presence detection on a single chip, addressing growing demand across automotive, consumer and industrial markets.]]></description>
<pubDate>Thu, 09 Jul 2026 07:40:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23965]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<item>
<title><![CDATA[Ecolab closes $4.75B CoolIT acquisition to corner AI data center cooling]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23980/ecolab-closes-4-75b-coolit-acquisition-to-corner-ai-data-center-cooling?from_rss=1]]></link>
<description><![CDATA[The deal will extend its water technologies to AI infrastructure and computing market.]]></description>
<pubDate>Wed, 08 Jul 2026 20:55:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23980]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Infineon opens largest power chip/logic fab in Germany]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23981/infineon-opens-largest-power-chip-logic-fab-in-germany?from_rss=1]]></link>
<description><![CDATA[It is called one of the largest investment projects in the country.]]></description>
<pubDate>Wed, 08 Jul 2026 08:42:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23981]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[New lidar method can measure small objects]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23982/new-lidar-method-can-measure-small-objects?from_rss=1]]></link>
<description><![CDATA[It could help in high precision systems for manufacturing.]]></description>
<pubDate>Wed, 08 Jul 2026 08:25:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23982]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Novarc launches NovAI Autonomy as part of NovAI suite]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23971/novarc-launches-novai-autonomy-as-part-of-novai-suite?from_rss=1]]></link>
<description><![CDATA[The company has introduced an advanced solution that brings machine vision and real-time adaptation to robotic welding, and its Enterprise Welding Intelligence platform.]]></description>
<pubDate>Wed, 08 Jul 2026 08:12:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23971]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[Mitsubishi Electric Automation, Inc. releases CNC with advanced control functions to support high-speed, high-accuracy machining]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23926/mitsubishi-electric-automation-inc-releases-cnc-with-advanced-control-functions-to-support-high-speed-high-accuracy-machining?from_rss=1]]></link>
<description><![CDATA[The series combines fast, high-quality machining with advanced control technologies to reduce cycle time, extend tool life and support complex machining applications.]]></description>
<pubDate>Wed, 08 Jul 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23926]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[SK Telecom seeks to be an AI infrastructure hub in Asia]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23983/sk-telecom-seeks-to-be-an-ai-infrastructure-hub-in-asia?from_rss=1]]></link>
<description><![CDATA[The company will build an AI data center with a scale of up to 15 GW.]]></description>
<pubDate>Wed, 08 Jul 2026 08:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23983]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Fusion rocket test paves way for superfast interplanetary travel]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23767/fusion-rocket-test-paves-way-for-superfast-interplanetary-travel?from_rss=1]]></link>
<description><![CDATA[Pulsar Fusion’s ‘first plasma’ success seen as the first step toward a sustained fusion reaction.]]></description>
<pubDate>Tue, 07 Jul 2026 08:34:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23767]]></guid>
<dc:creator>Tereza Pultarova</dc:creator>
<dc:subject>Aerospace</dc:subject>
</item>
<item>
<title><![CDATA[China unveils heavy-duty welding robot with 30-ton capacity]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23907/china-unveils-heavy-duty-welding-robot-with-30-ton-capacity?from_rss=1]]></link>
<description><![CDATA[According to its developers, the robot is capable of handling specialized offshore components, like module nodes, buckle rings and deepwater jacket strengthening rings.]]></description>
<pubDate>Tue, 07 Jul 2026 03:09:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23907]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
</item>
<item>
<title><![CDATA[No-code explosion-proof cobot brings automated painting to manufacturers]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23973/no-code-explosion-proof-cobot-brings-automated-painting-to-manufacturers?from_rss=1]]></link>
<description><![CDATA[The Cobot Painter is designed for metal fabricators and manufacturers seeking a flexible, high-mix, low-volume alternative to manual spray painting and traditional automated finishing systems.]]></description>
<pubDate>Sun, 05 Jul 2026 20:36:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23973]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<item>
<title><![CDATA[Intel Foundry breaks ground on Santa Clara facility]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23970/intel-foundry-breaks-ground-on-santa-clara-facility?from_rss=1]]></link>
<description><![CDATA[It points to continued momentum for the company’s semiconductor manufacturing prowess.]]></description>
<pubDate>Thu, 02 Jul 2026 08:48:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23970]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[GM secures a supply of memory, storage chips from Micron]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23969/gm-secures-a-supply-of-memory-storage-chips-from-micron?from_rss=1]]></link>
<description><![CDATA[The agreement also includes a collaboration for future memory and storage needs for GM’s vehicle roadmap.]]></description>
<pubDate>Thu, 02 Jul 2026 08:31:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23969]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Faster charging for EV batteries]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23824/faster-charging-for-ev-batteries?from_rss=1]]></link>
<description><![CDATA[Speedier battery charging can be realized by relying on interfacial anion-reduction catalysis technology.]]></description>
<pubDate>Thu, 02 Jul 2026 08:15:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23824]]></guid>
<dc:creator>S. Himmelstein</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<title><![CDATA[Siemens to expand electrical switchgear capacity for data centers]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23968/siemens-to-expand-electrical-switchgear-capacity-for-data-centers?from_rss=1]]></link>
<description><![CDATA[The company will invest about $341 million at its German plants.]]></description>
<pubDate>Thu, 02 Jul 2026 08:14:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23968]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[FPT enters the top three of Europe’s certified high-voltage battery producers with TÜV SÜD recognition]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23925/fpt-enters-the-top-three-of-europe-s-certified-high-voltage-battery-producers-with-tüv-süd-recognition?from_rss=1]]></link>
<description><![CDATA[The certification covers the design, development and manufacturing process of the FPT eBS 37 EVO high-voltage battery for light commercial vehicles, minibuses and pleasure boating applications.]]></description>
<pubDate>Thu, 02 Jul 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23925]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Orbital wants 100,000 data center satellites in space]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23964/orbital-wants-100-000-data-center-satellites-in-space?from_rss=1]]></link>
<description><![CDATA[Each satellite would function as one high-density rack in orbit.]]></description>
<pubDate>Wed, 01 Jul 2026 08:29:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23964]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Computer Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Flir launches the fixed Si2a PD acoustic imaging camera for continuous partial discharge monitoring]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23963/flir-launches-the-fixed-si2a-pd-acoustic-imaging-camera-for-continuous-partial-discharge-monitoring?from_rss=1]]></link>
<description><![CDATA[The fixed-mount acoustic imaging camera designed to deliver continuous, always-on monitoring of partial discharge (PD) in medium to high-voltage utility and industrial environments.]]></description>
<pubDate>Wed, 01 Jul 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23963]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[PPTC: Compact protection for maximum reliability]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23936/pptc-compact-protection-for-maximum-reliability?from_rss=1]]></link>
<description><![CDATA[The devices provide reliable resettable overcurrent and overtemperature protection for modern electronic applications.]]></description>
<pubDate>Wed, 01 Jul 2026 07:56:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23936]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[ECIA: 5 year high for electronic components market sentiment]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23959/ecia-5-year-high-for-electronic-components-market-sentiment?from_rss=1]]></link>
<description><![CDATA[But July may falter slightly.]]></description>
<pubDate>Tue, 30 Jun 2026 08:52:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23959]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[Another big SATCOM deal as Rocket Lab buys Iridium]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23958/another-big-satcom-deal-as-rocket-lab-buys-iridium?from_rss=1]]></link>
<description><![CDATA[The $8 billion deal continues a big year of expansion in satellite communications.]]></description>
<pubDate>Tue, 30 Jun 2026 08:39:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23958]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[New UCIe routing approach in package substrates]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23941/new-ucie-routing-approach-in-package-substrates?from_rss=1]]></link>
<description><![CDATA[UCIe provides wide channels with high signal counts, and a new transmission line structure could help keep layer counts reasonable as bump count scales up in IC substrates.]]></description>
<pubDate>Tue, 30 Jun 2026 08:36:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23941]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>LED</dc:subject>
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<title><![CDATA[SEMI: AI boosts 300 mm memory fab equipment investment past $50 billion]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23957/semi-ai-boosts-300-mm-memory-fab-equipment-investment-past-50-billion?from_rss=1]]></link>
<description><![CDATA[It is the first time it has hit this dollar mark.]]></description>
<pubDate>Tue, 30 Jun 2026 08:25:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23957]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
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<title><![CDATA[Data center cabling for the AI era]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23879/data-center-cabling-for-the-ai-era?from_rss=1]]></link>
<description><![CDATA[A complete rethinking of traditional data center design, including cable components, is required to deploy future artificial intelligence (AI)-driven applications.]]></description>
<pubDate>Tue, 30 Jun 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23879]]></guid>
<dc:creator>N. Mughees</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
</item>
<item>
<title><![CDATA[Emerson unveils AI-ready test automation platform]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23812/emerson-unveils-ai-ready-test-automation-platform?from_rss=1]]></link>
<description><![CDATA[NI Nigel AI has been expanded across the Emerson test software portfolio, introducing new prompt-based code generation and offering an integrated, artificial intelligence (AI)-ready test automation platform.]]></description>
<pubDate>Tue, 30 Jun 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23812]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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