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<title>Electronics360</title>
<link>https://electronics360.globalspec.com/</link>
<description><![CDATA[Recent content from Electronics360]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Thu, 10 Sep 2026 09:12:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
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<title><![CDATA[Verizon secures 80+ million miles of fiber in Corning deal]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24134/verizon-secures-80-million-miles-of-fiber-in-corning-deal?from_rss=1]]></link>
<description><![CDATA[The wires will be used for home broadband, enterprise services and AI backbone.]]></description>
<pubDate>Thu, 10 Sep 2026 09:12:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24134]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
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<title><![CDATA[AMSL expands High NA lithography adoption]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24131/amsl-expands-high-na-lithography-adoption?from_rss=1]]></link>
<description><![CDATA[The company is collaborating with TSMC, Intel and Samsung on new semiconductor manufacturing technology.]]></description>
<pubDate>Thu, 10 Sep 2026 08:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24131]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
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<title><![CDATA[Tual deploys first EV chargers to UK]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24133/tual-deploys-first-ev-chargers-to-uk?from_rss=1]]></link>
<description><![CDATA[The company’s technology combines battery storage with fast-charging capabilities for EV fleets.]]></description>
<pubDate>Thu, 10 Sep 2026 08:24:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24133]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<title><![CDATA[Factors affecting power connector reliability]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24018/factors-affecting-power-connector-reliability?from_rss=1]]></link>
<description><![CDATA[Power connectors, though seemingly simple, significantly influence the reliability, efficiency and safety of an electrical system.]]></description>
<pubDate>Thu, 10 Sep 2026 08:18:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24018]]></guid>
<dc:creator>N. Mughees</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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<title><![CDATA[Rohde & Schwarz presents new software for three-phase power analysis on MXO series oscilloscopes]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24044/rohde-schwarz-presents-new-software-for-three-phase-power-analysis-on-mxo-series-oscilloscopes?from_rss=1]]></link>
<description><![CDATA[The software combines key power measurements with full waveform visibility, enabling users to quickly correlate power behavior with real signal events and troubleshoot issues faster.]]></description>
<pubDate>Thu, 10 Sep 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24044]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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<title><![CDATA[New Infineon Optireg TLE9744QK power management IC integrates power and safety for hybrid and electric vehicle traction inverters]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24129/new-infineon-optireg-tle9744qk-power-management-ic-integrates-power-and-safety-for-hybrid-and-electric-vehicle-traction-inverters?from_rss=1]]></link>
<description><![CDATA[Infineon Technologies AG has introduced the Optireg PMIC TLE9744QK, a fully integrated power management IC (PMIC) specifically designed for high-voltage traction inverter applications in electric and hybrid vehicles. It consolidates complete power-supply functions, resolver excitation, and a]]></description>
<pubDate>Wed, 09 Sep 2026 09:34:32 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24129]]></guid>
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<title><![CDATA[Introducing Omnis IC: The new benchmark in ion chromatography]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24128/introducing-omnis-ic-the-new-benchmark-in-ion-chromatography?from_rss=1]]></link>
<description><![CDATA[Introducing Omnis IC 
Metrohm USA has launched Omnis IC, an ion chromatography system that automates much of the manual preparation and routine monitoring involved in daily analysis. Built on the Omnis platform, it brings modular hardware, automated workflows and continuous system checks together in]]></description>
<pubDate>Wed, 09 Sep 2026 09:31:02 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24128]]></guid>
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<title><![CDATA[Sensata Technologies introduces OmniNode, an off-the-shelf high-voltage power distribution solution for commercial vehicles]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24127/sensata-technologies-introduces-omninode-an-off-the-shelf-high-voltage-power-distribution-solution-for-commercial-vehicles?from_rss=1]]></link>
<description><![CDATA[Sensata's OmniNode is an off-the-shelf integrated power distribution solution designed to help commercial vehicle manufacturers simplify high-voltage charging and vehicle architecture. 
Sensata Technologies today introduced its OmniNode, a patent-pending, off-the-shelf power distribution solution]]></description>
<pubDate>Wed, 09 Sep 2026 09:19:32 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24127]]></guid>
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<title><![CDATA[Advanced nuclear has what AI data centers need. Can it arrive in time?]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23942/advanced-nuclear-has-what-ai-data-centers-need-can-it-arrive-in-time?from_rss=1]]></link>
<description><![CDATA[From SMRs to fusion, the technology is promising. The supply chains, skilled labor and construction timelines are another story.]]></description>
<pubDate>Sat, 05 Sep 2026 08:11:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23942]]></guid>
<dc:creator>Shannon Cuthrell</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
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<title><![CDATA[Krytar announces new family of compact Ultra+ 2-way power dividers cover 0.5 to 40 GHz]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24126/krytar-announces-new-family-of-compact-ultra-2-way-power-dividers-cover-0-5-to-40-ghz?from_rss=1]]></link>
<description><![CDATA[With seven new models offered, Krytar's new Ultra+ high-performance two-way power dividers offer the tightest specifications in the industry and lend themselves to emerging wireless ultra-broadband designs and many test and measurement applications including emerging mmWave and 6G markets.]]></description>
<pubDate>Fri, 04 Sep 2026 13:57:30 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24126]]></guid>
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<title><![CDATA[SECO introduces end-to-end AI solutions at embedded world North America 2026]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24125/seco-introduces-end-to-end-ai-solutions-at-embedded-world-north-america-2026?from_rss=1]]></link>
<description><![CDATA[From rapid prototyping and Physical AI to deployed intelligent systems, SECO will demonstrate how its hardware, software, and engineering capabilities help OEMs bring Edge AI products from concept to industrial scale faster]]></description>
<pubDate>Fri, 04 Sep 2026 13:43:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24125]]></guid>
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<title><![CDATA[Zoox robotaxi deployment begins in Las Vegas]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24123/zoox-robotaxi-deployment-begins-in-las-vegas?from_rss=1]]></link>
<description><![CDATA[The company will start driverless ride-hailing services at Harry Reid International Airport.]]></description>
<pubDate>Fri, 04 Sep 2026 08:25:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24123]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<title><![CDATA[Everspin advances MRAM in aerospace, defense applications]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24120/everspin-advances-mram-in-aerospace-defense-applications?from_rss=1]]></link>
<description><![CDATA[Teledyne HiRel will add the memory technology to its technology portfolio.]]></description>
<pubDate>Fri, 04 Sep 2026 08:13:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24120]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Aerospace</dc:subject>
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<title><![CDATA[GaN foundries aligning efforts around system-level solutions]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24093/gan-foundries-aligning-efforts-around-system-level-solutions?from_rss=1]]></link>
<description><![CDATA[A shakeup in market players is not slowing the growth of the technology.]]></description>
<pubDate>Fri, 04 Sep 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24093]]></guid>
<dc:creator>Don Dingee</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
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<title><![CDATA[Bean-inspired robot astonishingly moves without motors or code]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24118/bean-inspired-robot-astonishingly-moves-without-motors-or-code?from_rss=1]]></link>
<description><![CDATA[The robot, aptly named BeanBot, is capable of moving without motors, batteries, electronics or onboard computing.]]></description>
<pubDate>Fri, 04 Sep 2026 05:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24118]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[Sivers expands InP manufacturing capabilities in Scotland]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24121/sivers-expands-inp-manufacturing-capabilities-in-scotland?from_rss=1]]></link>
<description><![CDATA[The company will invest $30 million in expanding the facility.]]></description>
<pubDate>Fri, 04 Sep 2026 01:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24121]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Processors</dc:subject>
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<title><![CDATA[Bunker brings AI to smart home security]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24116/bunker-brings-ai-to-smart-home-security?from_rss=1]]></link>
<description><![CDATA[IC Realtime’s platform was built using Nvidia’s Jetson edge computing technology.]]></description>
<pubDate>Wed, 02 Sep 2026 08:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24116]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Audio and Video</dc:subject>
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<title><![CDATA[Lam Research breaks ground on new Oregon lab]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24115/lam-research-breaks-ground-on-new-oregon-lab?from_rss=1]]></link>
<description><![CDATA[It will expand cleanroom lab space by more than 50%.]]></description>
<pubDate>Wed, 02 Sep 2026 08:35:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24115]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
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<title><![CDATA[Amazon drones soaring to 500 cities by year-end]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24117/amazon-drones-soaring-to-500-cities-by-year-end?from_rss=1]]></link>
<description><![CDATA[It is a sixfold increase from its current delivery footprint.]]></description>
<pubDate>Wed, 02 Sep 2026 08:16:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24117]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Aerospace</dc:subject>
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<title><![CDATA[Light-powered soft robots unlock never-ending jumps]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24114/light-powered-soft-robots-unlock-never-ending-jumps?from_rss=1]]></link>
<description><![CDATA[The so-called 'ring leaper' design uses torsion to store elastic energy and then releases that energy all at once, which means the robots do not need to reset between jumps, but repeat themselves instead.]]></description>
<pubDate>Tue, 01 Sep 2026 11:48:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24114]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[High-bandwidth flash in AI memory architectures]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23943/high-bandwidth-flash-in-ai-memory-architectures?from_rss=1]]></link>
<description><![CDATA[HBF provides high capacity to AI processors for storing model weights for inference tasks.]]></description>
<pubDate>Tue, 01 Sep 2026 08:29:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23943]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
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<title><![CDATA[Samtec releases 1.85 mm 30° angled launch connectors]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24038/samtec-releases-1-85-mm-30-angled-launch-connectors?from_rss=1]]></link>
<description><![CDATA[The connectors deliver precision radio frequency performance through 67 GHz while solving common mechanical and routing challenges found in dense, millimeter wave lab test and evaluation environments.]]></description>
<pubDate>Tue, 01 Sep 2026 08:10:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24038]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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<title><![CDATA[Infrastructure-led electrification: How battery chargers support efficiency and mixed fleets]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24091/infrastructure-led-electrification-how-battery-chargers-support-efficiency-and-mixed-fleets?from_rss=1]]></link>
<description><![CDATA[These strategies are also helping with vehicle uptime at a broader, facility level.]]></description>
<pubDate>Mon, 31 Aug 2026 08:31:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24091]]></guid>
<dc:creator>Anton Clark, senior product strategy manager, Enatel</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<title><![CDATA[Could fuel cells power robotics?]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23858/could-fuel-cells-power-robotics?from_rss=1]]></link>
<description><![CDATA[There are many types of fuel cell technologies, but perhaps the most common and safest (temperature wise) would be the hydrogen-fueled proton exchange membrane (PEM).]]></description>
<pubDate>Fri, 28 Aug 2026 08:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23858]]></guid>
<dc:creator>John Palmisano</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[IoT satellite market set for explosive growth]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24112/iot-satellite-market-set-for-explosive-growth?from_rss=1]]></link>
<description><![CDATA[Connections are forecast to hit 197.7 million by 2035.]]></description>
<pubDate>Thu, 27 Aug 2026 08:45:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24112]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Wired Connectivity</dc:subject>
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