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<title>Electronics360</title>
<link>https://electronics360.globalspec.com/</link>
<description><![CDATA[Recent content from Electronics360]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Thu, 22 Oct 2026 03:09:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
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<title><![CDATA[Dürr rolls out four new robots to revolutionize automotive painting]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24168/dürr-rolls-out-four-new-robots-to-revolutionize-automotive-painting?from_rss=1]]></link>
<description><![CDATA[The EcoRS Generation 2 robots provided reaches of up to 3,100 mm and were designed to replace multiple application-specific robot configurations.]]></description>
<pubDate>Thu, 22 Oct 2026 03:09:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24168]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[NY Creates bets big on high NA EUV access]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24193/ny-creates-bets-big-on-high-na-euv-access?from_rss=1]]></link>
<description><![CDATA[The research hub also talks about the rise of regional ecosystems.]]></description>
<pubDate>Wed, 21 Oct 2026 08:06:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24193]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
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<item>
<title><![CDATA[xMEMS fan-on-a-chip now in mass production]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24177/xmems-fan-on-a-chip-now-in-mass-production?from_rss=1]]></link>
<description><![CDATA[The technology is targeted thermal management in a compact form factor for AI smart glasses, smartphones and other edge systems.]]></description>
<pubDate>Tue, 20 Oct 2026 08:32:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24177]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Consumer Peripherals</dc:subject>
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<title><![CDATA[Guide: How to select the ideal electric actuator in the water and wastewater industry]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24190/guide-how-to-select-the-ideal-electric-actuator-in-the-water-and-wastewater-industry?from_rss=1]]></link>
<description><![CDATA[These components must endure high water pressures, flow velocities and environmental exposures such as sunlight, wind, saltwater, rain, snow, sediments and chemicals.]]></description>
<pubDate>Mon, 19 Oct 2026 07:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24190]]></guid>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[Repurposed Rivian batteries now provide 10 MWh storage]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24187/repurposed-rivian-batteries-now-provide-10-mwh-storage?from_rss=1]]></link>
<description><![CDATA[The companies have expanded their agreement to recycle Rivian’s battery scrap.]]></description>
<pubDate>Fri, 16 Oct 2026 08:35:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24187]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<title><![CDATA[Volvo, Nvidia bring AI driving to the real world]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24188/volvo-nvidia-bring-ai-driving-to-the-real-world?from_rss=1]]></link>
<description><![CDATA[The companies will gradually introduce eyes-off and mind-off driving as well.]]></description>
<pubDate>Fri, 16 Oct 2026 08:22:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24188]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<title><![CDATA[DigiKey to double down on same-day fulfillment]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24185/digikey-to-double-down-on-same-day-fulfillment?from_rss=1]]></link>
<description><![CDATA[The company will invest $100 million to expand capacity and automation in its product distribution center.]]></description>
<pubDate>Fri, 16 Oct 2026 08:18:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24185]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
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<title><![CDATA[Infineon shores up SiC supply security with Wolfspeed]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24189/infineon-shores-up-sic-supply-security-with-wolfspeed?from_rss=1]]></link>
<description><![CDATA[An agreement will transform the existing relationship from 150 mm wafers to 200 mm substrate technology.]]></description>
<pubDate>Fri, 16 Oct 2026 08:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24189]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
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<title><![CDATA[Wirepas mesh now connects 500,000 self-storage locks]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24186/wirepas-mesh-now-connects-500-000-self-storage-locks?from_rss=1]]></link>
<description><![CDATA[The company’s IoT technology works in areas without cellular connectivity or weak Wi-Fi.]]></description>
<pubDate>Fri, 16 Oct 2026 08:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24186]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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<title><![CDATA[Semicon West 2026: Teradyne launches edge AI automated test platform]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24184/semicon-west-2026-teradyne-launches-edge-ai-automated-test-platform?from_rss=1]]></link>
<description><![CDATA[The 24-slot system is built for both engineering and production use.]]></description>
<pubDate>Thu, 15 Oct 2026 08:34:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24184]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
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<title><![CDATA[Applied Materials unveils its $5 billion EPIC Center]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24183/applied-materials-unveils-its-5-billion-epic-center?from_rss=1]]></link>
<description><![CDATA[It is called the world’s largest facility dedicated to collaborative semiconductor process technology and manufacturing equipment R&D.]]></description>
<pubDate>Thu, 15 Oct 2026 08:22:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24183]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Value Chain</dc:subject>
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<title><![CDATA[Junkosha's new 1 mm cable targets vacuum chambers]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24182/junkosha-s-new-1-mm-cable-targets-vacuum-chambers?from_rss=1]]></link>
<description><![CDATA[The cable is designed for high vacuum chambers.]]></description>
<pubDate>Thu, 15 Oct 2026 08:18:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24182]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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<title><![CDATA[Video: TDK now offers 9-axis sensor with on-chip fusion]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24176/video-tdk-now-offers-9-axis-sensor-with-on-chip-fusion?from_rss=1]]></link>
<description><![CDATA[The sensor is available through electronics distributors.]]></description>
<pubDate>Tue, 13 Oct 2026 08:19:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24176]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
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<title><![CDATA[Why is the war department investing $1.5B in Wolfspeed?]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24179/why-is-the-war-department-investing-1-5b-in-wolfspeed?from_rss=1]]></link>
<description><![CDATA[The loan comes amid a national push to strengthen the domestic silicon-carbide manufacturing and stave off competition from China.]]></description>
<pubDate>Mon, 12 Oct 2026 10:58:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24179]]></guid>
<dc:creator>Amy Neff Roth, Utica Observer Dispatch/Observer-Dispatch via Reuters</dc:creator>
<dc:subject>Semiconductors and Components</dc:subject>
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<title><![CDATA[Fabric sensors drive vehicles beyond presence detection]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24159/fabric-sensors-drive-vehicles-beyond-presence-detection?from_rss=1]]></link>
<description><![CDATA[Occupancy classification needs weight, position and movement data. Automotive sensors offer a low-power way to supply it.]]></description>
<pubDate>Mon, 12 Oct 2026 08:43:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24159]]></guid>
<dc:creator>Tony Pallone</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
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<title><![CDATA[Robot fleet management systems enhance coordination and productivity]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23988/robot-fleet-management-systems-enhance-coordination-and-productivity?from_rss=1]]></link>
<description><![CDATA[Robotic fleets are groups of autonomous or semi-autonomous mobile robots (AGVs/AMRs) that work together to make operations like warehousing, manufacturing and shipping more efficient.]]></description>
<pubDate>Mon, 12 Oct 2026 08:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23988]]></guid>
<dc:creator>N. Mughees</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<title><![CDATA[The case for urban mining]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24178/the-case-for-urban-mining?from_rss=1]]></link>
<description><![CDATA[The urban mining of e-waste makes increasing sense but more international standards are required to help cities organize it safely and sustainably.]]></description>
<pubDate>Sun, 11 Oct 2026 00:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24178]]></guid>
<dc:creator>Heather McLean, for IEC e-tech</dc:creator>
<dc:subject>Supply Chain Management</dc:subject>
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<title><![CDATA[TechInsights Teardown: Lenovo Legion Go 2]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24172/techinsights-teardown-lenovo-legion-go-2?from_rss=1]]></link>
<description><![CDATA[A partial deep dive into the portable gaming console.]]></description>
<pubDate>Fri, 09 Oct 2026 08:24:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24172]]></guid>
<dc:creator>TechInsights</dc:creator>
<dc:subject>Audio and Video</dc:subject>
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<title><![CDATA[Keeping Ukraine’s robot army connected]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24105/keeping-ukraine-s-robot-army-connected?from_rss=1]]></link>
<description><![CDATA[Companies are developing new ways to allow battlefield robots functional when satellite connectivity falters.]]></description>
<pubDate>Fri, 09 Oct 2026 08:23:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24105]]></guid>
<dc:creator>Tereza Pultarova</dc:creator>
<dc:subject>Industrial Electronics</dc:subject>
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<title><![CDATA[GF, TSMC agree to advanced packaging deal]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24175/gf-tsmc-agree-to-advanced-packaging-deal?from_rss=1]]></link>
<description><![CDATA[The foundries will work together to manufacture at scale silicon transposers for TSMC’s CoWoS technology.]]></description>
<pubDate>Fri, 09 Oct 2026 08:11:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24175]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Value Chain</dc:subject>
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<title><![CDATA[Q&A: Ecolab bets on liquid cooling for AI data center growth]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24164/q-a-ecolab-bets-on-liquid-cooling-for-ai-data-center-growth?from_rss=1]]></link>
<description><![CDATA[The company’s Bob Walicki on the CoolIT acquisition, a November platform launch and the commissioning shortcuts to unclog direct-to-chip cold plates.]]></description>
<pubDate>Wed, 07 Oct 2026 08:33:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24164]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
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<title><![CDATA[Using GaN FET devices in power electronics]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24094/using-gan-fet-devices-in-power-electronics?from_rss=1]]></link>
<description><![CDATA[These electronic components are changing the design calculus for power electronics in digital systems, embedded systems and power electronics.]]></description>
<pubDate>Mon, 05 Oct 2026 08:01:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24094]]></guid>
<dc:creator>Zachariah Peterson</dc:creator>
<dc:subject>Power Semiconductors</dc:subject>
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<title><![CDATA[R&S adds multi-channel pulse analysis to FSWX]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24167/r-s-adds-multi-channel-pulse-analysis-to-fswx?from_rss=1]]></link>
<description><![CDATA[The FSWX analyzes jammer input and output signals simultaneously for a comprehensive assessment of deceptive signal behavior.]]></description>
<pubDate>Fri, 02 Oct 2026 12:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24167]]></guid>
<dc:subject>RF &amp; Microwave</dc:subject>
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<title><![CDATA[Würth Elektronik at electronica 2026]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24166/würth-elektronik-at-electronica-2026?from_rss=1]]></link>
<description><![CDATA[The W&uuml;rth Elektronik Group will showcase its broad range of products and services at electronica in Munich from November 10 to 13, 2026. True to its claim, &ldquo;more than you expect&rdquo;, all three business units are set to emphasize their strong commitment to service, demonstrating how]]></description>
<pubDate>Fri, 02 Oct 2026 12:03:01 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24166]]></guid>
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<title><![CDATA[Qorvo advances C-band radar front ends with BAW-based frequency agility and GaN power]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24165/qorvo-advances-c-band-radar-front-ends-with-baw-based-frequency-agility-and-gan-power?from_rss=1]]></link>
<description><![CDATA[Switchable BAW filtering and high-efficiency GaN PAs give pulsed ESA radars frequency-agile reception and high-power transmission with fewer RF components.]]></description>
<pubDate>Fri, 02 Oct 2026 12:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24165]]></guid>
<dc:subject>RF &amp; Microwave</dc:subject>
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