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<title>Electronics360</title>
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<description><![CDATA[Recent content from Electronics360]]></description>
<copyright>Copyright 2026</copyright>
<pubDate>Thu, 01 Oct 2026 08:46:00 EDT</pubDate>
<generator>https://electronics360.globalspec.com</generator>
<item>
<title><![CDATA[IKEA will be among Kodiak's first driverless freight customers]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24163/ikea-will-be-among-kodiak-s-first-driverless-freight-customers?from_rss=1]]></link>
<description><![CDATA[The company will launch service in 2026 after logging more than 750,000 miles with a safety driver.]]></description>
<pubDate>Thu, 01 Oct 2026 08:46:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24163]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Kill the signal, kill the drone? Not anymore]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23768/kill-the-signal-kill-the-drone-not-anymore?from_rss=1]]></link>
<description><![CDATA[Frequency hopping, multi-band radios and 802.11be are closing the gap on battlefield jamming. Ukraine is the proof of concept.]]></description>
<pubDate>Thu, 01 Oct 2026 08:41:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23768]]></guid>
<dc:creator>Tereza Pultarova</dc:creator>
<dc:subject>Aerospace</dc:subject>
</item>
<item>
<title><![CDATA[Momentus, NASA complete orbital rendezvous demo]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24162/momentus-nasa-complete-orbital-rendezvous-demo?from_rss=1]]></link>
<description><![CDATA[The demo was designed to validate commercial technologies for in-space transportation, service and logistics.]]></description>
<pubDate>Thu, 01 Oct 2026 08:19:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24162]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>MEMS and Sensors</dc:subject>
</item>
<item>
<title><![CDATA[AI data centers: The grid wasn't built for this]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23950/ai-data-centers-the-grid-wasn-t-built-for-this?from_rss=1]]></link>
<description><![CDATA[“When you turn off or on a 100 MW load, it isn’t as simple as a light bulb.”]]></description>
<pubDate>Thu, 01 Oct 2026 08:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23950]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
</item>
<item>
<title><![CDATA[Living muscle gives a paper-thin robot a powerful new lease on life]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24161/living-muscle-gives-a-paper-thin-robot-a-powerful-new-lease-on-life?from_rss=1]]></link>
<description><![CDATA[MIT engineers developed a 2D robot, made of a hydrogel skeleton and bio-engineered muscle cells, that propel the device forward when exposed to light.]]></description>
<pubDate>Wed, 30 Sep 2026 14:35:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24161]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
</item>
<item>
<title><![CDATA[Q&A: Life after Intel is good, says Altera]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24157/q-a-life-after-intel-is-good-says-altera?from_rss=1]]></link>
<description><![CDATA[One year after Intel sold off its majority stake, Altera’s Mike Fitton says independence has meant faster decisions, more focus and room to work with everyone.]]></description>
<pubDate>Wed, 30 Sep 2026 08:19:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24157]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Processors</dc:subject>
</item>
<item>
<title><![CDATA[Cobots — Bridging the gap between man and machine]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/23867/cobots-bridging-the-gap-between-man-and-machine?from_rss=1]]></link>
<description><![CDATA[As we enter the second quarter of the twenty-first century, cobots, short for collaborative robots, are changing the rules of robot-human separation.]]></description>
<pubDate>Mon, 28 Sep 2026 06:00:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/23867]]></guid>
<dc:creator>Jeremy Cook</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
</item>
<item>
<title><![CDATA[Blakcro’s paraglider takes covert missions to new heights]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24143/blakcro-s-paraglider-takes-covert-missions-to-new-heights?from_rss=1]]></link>
<description><![CDATA[Blakcro’s glider was designed primarily for military use and can be transported in a rucksack-sized case and assembled in under eight minutes.]]></description>
<pubDate>Mon, 28 Sep 2026 05:21:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24143]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
</item>
<item>
<title><![CDATA[Geely's EV charger touts a 97% charge in 9 minutes]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24156/geely-s-ev-charger-touts-a-97-charge-in-9-minutes?from_rss=1]]></link>
<description><![CDATA[The Chinese automotive technology vendor calls it the fastest charging performance to date.]]></description>
<pubDate>Fri, 25 Sep 2026 08:40:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24156]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Bye Aerospace successfully conducts first all-electric plane flight]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24155/bye-aerospace-successfully-conducts-first-all-electric-plane-flight?from_rss=1]]></link>
<description><![CDATA[The plane is designed for flight training market.]]></description>
<pubDate>Fri, 25 Sep 2026 08:16:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24155]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Aerospace</dc:subject>
</item>
<item>
<title><![CDATA[China’s new humanoid robot packs 93% accuracy into crop pollination]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24142/china-s-new-humanoid-robot-packs-93-accuracy-into-crop-pollination?from_rss=1]]></link>
<description><![CDATA[The GEAIR (Genome Editing combined with AI-based Robotics) 2.0 can operate in complex crop environments without constant human control to autonomously perform tasks associated with hybrid pollination.]]></description>
<pubDate>Fri, 25 Sep 2026 07:09:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24142]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
</item>
<item>
<title><![CDATA[There are now 150 million LoRaWAN devices deployed globally]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24154/there-are-now-150-million-lorawan-devices-deployed-globally?from_rss=1]]></link>
<description><![CDATA[The LoRa Alliance reports a CAGR of 25% for the wireless IoT networks.]]></description>
<pubDate>Wed, 23 Sep 2026 08:12:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24154]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Wired Connectivity</dc:subject>
</item>
<item>
<title><![CDATA[Tektronix expands 8-channel oscilloscope portfolio]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24153/tektronix-expands-8-channel-oscilloscope-portfolio?from_rss=1]]></link>
<description><![CDATA[The testing tool gives added flexibility for RF, sensing and other high-speed digital applications.]]></description>
<pubDate>Wed, 23 Sep 2026 08:09:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24153]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Semiconductor Equipment</dc:subject>
</item>
<item>
<title><![CDATA[ECIA: Electronic components moderation continues in August]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24152/ecia-electronic-components-moderation-continues-in-august?from_rss=1]]></link>
<description><![CDATA[And September will continue that trend.]]></description>
<pubDate>Tue, 22 Sep 2026 08:35:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24152]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Application Forecasts and Market Shares</dc:subject>
</item>
<item>
<title><![CDATA[Why foldable phones are the next smartphone battleground]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24151/why-foldable-phones-are-the-next-smartphone-battleground?from_rss=1]]></link>
<description><![CDATA[With the release of the Apple iPhone Duo, other vendors in the sector will likely be forced to reassess strategies.]]></description>
<pubDate>Tue, 22 Sep 2026 08:22:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24151]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Consumer Peripherals</dc:subject>
</item>
<item>
<title><![CDATA[Flexible semiconductors move toward practical use]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24113/flexible-semiconductors-move-toward-practical-use?from_rss=1]]></link>
<description><![CDATA[New materials and manufacturing methods are enabling semiconductors that can bend, with applications in wearables, portable electronics and industrial sensors.]]></description>
<pubDate>Mon, 21 Sep 2026 08:33:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24113]]></guid>
<dc:creator>Seth Price</dc:creator>
<dc:subject>Semiconductor Value Chain</dc:subject>
</item>
<item>
<title><![CDATA[From fragile eggs to heavy bottles: Gripper handles all]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24130/from-fragile-eggs-to-heavy-bottles-gripper-handles-all?from_rss=1]]></link>
<description><![CDATA[To develop a material capable of such tasks, the KAIST team used artificial intelligence (AI) to create a recipe for making 3D-printed products as stretchable as rubber without clogging printers.]]></description>
<pubDate>Sun, 20 Sep 2026 05:34:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24130]]></guid>
<dc:creator>Marie Donlon</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
</item>
<item>
<title><![CDATA[This sensor knows where 10 people are in a room]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24147/this-sensor-knows-where-10-people-are-in-a-room?from_rss=1]]></link>
<description><![CDATA[Aqara’s mmWave radar-based device improves human presence detection in smart homes but securely.]]></description>
<pubDate>Fri, 18 Sep 2026 08:43:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24147]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Audio and Video</dc:subject>
</item>
<item>
<title><![CDATA[TechInsights Teardown: DJI Mini 5 Pro drone]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24124/techinsights-teardown-dji-mini-5-pro-drone?from_rss=1]]></link>
<description><![CDATA[A partial deep dive into the unmanned aerial vehicle.]]></description>
<pubDate>Fri, 18 Sep 2026 08:35:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24124]]></guid>
<dc:creator>TechInsights</dc:creator>
<dc:subject>Aerospace</dc:subject>
</item>
<item>
<title><![CDATA[Verizon makes world’s first AI-based crowd detection field trial]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24149/verizon-makes-world-s-first-ai-based-crowd-detection-field-trial?from_rss=1]]></link>
<description><![CDATA[The successful testing provides a path to future 6G use cases.]]></description>
<pubDate>Fri, 18 Sep 2026 08:30:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24149]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Broadband</dc:subject>
</item>
<item>
<title><![CDATA[Nordic’s new multi-protocol SoC targets smart home, asset trackers]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24148/nordic-s-new-multi-protocol-soc-targets-smart-home-asset-trackers?from_rss=1]]></link>
<description><![CDATA[The chip supports BLE, Bluetooth Channel Sounding, Thread, Zigbee and Matter.]]></description>
<pubDate>Fri, 18 Sep 2026 08:21:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24148]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Home Appliances</dc:subject>
</item>
<item>
<title><![CDATA[Infineon furthers its core growth drivers with memory sale]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24150/infineon-furthers-its-core-growth-drivers-with-memory-sale?from_rss=1]]></link>
<description><![CDATA[The company will sell its NOR flash and F-RAM business to Winbond.]]></description>
<pubDate>Fri, 18 Sep 2026 08:20:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24150]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Analog/Mixed Signal</dc:subject>
</item>
<item>
<title><![CDATA[Arrow Electronics and ST Microelectronics accelerate industrial AMR development with a new reference platform]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24031/arrow-electronics-and-st-microelectronics-accelerate-industrial-amr-development-with-a-new-reference-platform?from_rss=1]]></link>
<description><![CDATA[The reference platform is designed to shorten the path from concept to deployment for professional service robots.]]></description>
<pubDate>Fri, 18 Sep 2026 08:05:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24031]]></guid>
<dc:creator>Electronics360 News Desk</dc:creator>
<dc:subject>Discrete and Process Automation</dc:subject>
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<item>
<title><![CDATA[EVgo plans 400 new EV charging stalls across US]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24144/evgo-plans-400-new-ev-charging-stalls-across-us?from_rss=1]]></link>
<description><![CDATA[The infrastructure build out comes through a collaboration with Regency Centers Corp.]]></description>
<pubDate>Thu, 17 Sep 2026 08:36:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24144]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Electronics and Semiconductors</dc:subject>
</item>
<item>
<title><![CDATA[Fujitsu targets AI data center market in Japan, Europe]]></title>
<link><![CDATA[https://electronics360.globalspec.com/article/24146/fujitsu-targets-ai-data-center-market-in-japan-europe?from_rss=1]]></link>
<description><![CDATA[The company has developed both the Monaka CPU and a server for multiple sectors.]]></description>
<pubDate>Thu, 17 Sep 2026 08:23:00 EDT</pubDate>
<guid><![CDATA[https://electronics360.globalspec.com/article/24146]]></guid>
<dc:creator>Peter Brown</dc:creator>
<dc:subject>Data Center and Critical Infrastructure</dc:subject>
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