Supply Chain


    HEADLINES ARCHIVE

  • Intel Orders 15 EUV Lithography Systems

    A sizable order for ASML lithography systems, worth possibly more than $1 billion, is a milestone that indicates that extreme-ultraviolet lithography has finally overcome technical hurdles and can go on to assist Intel, Samsung and TSMC with commercial chip production.

  • Tensilica Fusion DSP Aims at IoT, Wearables

    Cadence is launching a variant of the Xtensa processor architecture aimed at wearables and IoT applications, where it can provide security, sensor fusion, voice and audio processing capabilities.

  • Apple Wins Place in Top 25 Chip Vendor Ranking

    A change in product categorization by IHS saw Apple break into the top 25 among chip vendors in a strong growth year. Slower growth is expected this year, partly due to sluggish conditions in the memory sector.

  • Microchip Unveils Power Management IC

    Device combines popular power calculations with advanced features for use in high-performance commercial and industrial products.

  • EU Halogen Ban Postponed Until 2018

    Ban, originally planned for September 2016, is part of wider strategy to promote more energy-efficient technologies like compact fluorescent and LED bulbs.

  • Broadcom Rolls Ethernet Switches

    ICs said to offer 30% lower power and double the performance for data center virtualization overlays.

  • Freescale Tips Network Switching Platform

    Platform combines performance and efficiency of a traditional network switch with the manageability, flexibility and security required for software-defined networking, according to the vendor.

  • Synopsys to Buy Software Security Firm

    Deal expected to bring talent, technology and products to expand Synopsys' presence in software security market.

  • Intersil Launches Power Management ICs for Ultrabooks, Tablets

    Power management ICs said to enable industry's first credit card-size motherboards for high-end ultrabook and tablet computers powered by two-cell lithium-ion batteries.

  • Acquisitions Take ARM IP Portfolio into RF

    Intellectual property licensor grabs two U.S. companies and will unite their IP into a portfolio for low-power Bluetooth hardware and software.

  • Moore's Law at 50

    Half a century after Gordon Moore made his prediction that the number transistors per square inch on an IC would double at a constant rate, the eponymous "law" is still with us.

  • Presto, INSIDE Secure Form Manufacturing Partnership

    The companies have formed a contract manufacturing agreement whereas Presto will take over the semiconductor operations and global supply chain from INSIDE Secure.

  • Toshiba Researching Low Power in Wearables

    The Japanese chip vendor is looking to reduce power consumption in multi-sensor wearables by decreasing the mode transitions required when the microcontroller receives data from sensors.

  • Intel Cuts Capital Spending Estimate in Anticipation of Down Year for PCs

    Microprocessor giant says the PC market is due for a poor year and that the company will lean more heavily on its other business units.

  • Andes Wins CPU Role in MediaTek SoCs

    Taiwan processor IP licensor says it won multiple design-ins on the basis of offering the smallest die area and the lowest power consumption among competitive options.

  • Sensor Fusion Growth Creates New Challenges

    Since the humble beginnings of sensors in the Apple iPhone, sensor fusion technology has been integrated into a broad range of applications. But as growth in this market continues, challenges remain.

  • Altera Joins IoT Consortium

    Programmable logic vendor joins Industrial Internet Consortium, an open membership organization looking to accelerate the adoption and use of the Internet of Things.

  • Solantro Raises Funding for Volume Manufacturing

    Renewable power chipmaker has raised $11 million in funding in order to accelerate volume manufacturing of digital power processor chipsets.

  • Why China Is Shopping for Silicon Valley Chip Companies

    Some may put Chinese venture capital shopping for U.S. chip companies down to Chinese plans to become a global technology leader in electronics. A couple of factors driving the trend could be more base and capitalistic—but would lead to same result.

  • Cree Rolls LED Module

    Firm claims drop in replacement for LMH module offers 30 percent better performance than its predecessor.

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