Semiconductor Equipment

UMC Targets Automotive IC Vendors

27 May 2015

United Microelectronics Corp. has introduced an automotive technology platform the company hopes will lure automotive chip vendors to its foundry business.

The platform consists of a range of automotive AEC-Q100 qualified technology options for manufacturing in the 0.5 micron to 28 nanometer nodes in UMC’s automotive qualified fabs. The automotive platform includes multiple manufacturing certifications for security, reliability and robustness as well as certified design models, intellectual property and design kits to help customers keep pace with the rapidly changing automotive industry supply chain.

UMC says the platform can be utilized to help automotive chip designers capture new opportunities in the Internet of Things and the increased use of sensors in vehicles.

Po Wen Yen, CEO of UMC, says in a statement that the rise in silicon content within each new vehicle is leading the automotive IC sector to grow faster than other semiconductor segments.

UMC has been bolstering its automotive offerings, signing an agreement to expand its manufacturing partnership with Infineon to include automotive-qualified smart power manufacturing semiconductors. UMC has also been increasing its manufacturing capabilities in automotive and has taken a 9.3% stake in Fujitsu’s 300mm Mie prefecture independent foundry subsidiary in order to garner more business from Japanese chip firms. It also recently gained New Japan Radio Co. Ltd.’s (NJR) analog automotive semiconductor business that will be used by a non-Japanese, Tier-1 automotive OEM.

UMC currently manufactures electronic components used in vehicles including advanced driver assistance systems (ADAS), safety, body control, infotainment and under-hood applications for customers including Freescale, ON Semiconductor, Infineon, Renesas, STMicroelectronics, NJR and others.

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