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Supply Chain
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APEC 2018: Surface Mount Capacitors Introduced for Fast-switching Wide Bandgap Semiconductors
The components can be mounted close to fast-switching semiconductors in high power density applications.
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APEC 2018: Fully Integrated, Eight-channel LED Boost Introduced
Psemi says the component off loads most of the power-conversion work from the inductor to capacitors in the charge pump.
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Mouser Electronics Stocks Evaluation Boards from Cypress Semiconductor
Mouser Electronics Inc. now has the EZ-BT™ WICED dual-mode module evaluation board and the EZ-BLE™ WICED module evaluation board from Cypress Semiconductor.
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APEC 2018: Magnetic Metals Electro-magnetic Cut and Tape Wound Cores Featured
The components are used in the industrial, space and military markets.
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APEC 2018: TT Electronics Showcases Latest Resistors
The company also featured its electric vehicle choke components.
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Gallium-Nitride HEMTs can be Used to Replace Current RF Applications
Mouser Electronics Inc. is now stocking the CG2H40xx and CG2H30070 gallium-nitride (GaN) high-electron-mobility transistors (HEMTs) from Wolfspeed.
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Material to Help Fast Track Mass Production of Flexible Electronics Developed
Researchers from Oregon State University’s College of Engineering have taken a step toward successful fast manufacturing of soft and flexible electronics.
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SiC Foundry at the Scale of Silicon
X-FAB is the first manufacturer to offer 6-inch silicon carbide foundry services.
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APEC 2018: Silicon Labs Unveils New Internet of Things Power Devices
Silicon Labs has introduced a range of products at APEC 2018, including two new Power-over-Ethernet families and an expansion to its Gecko line of microcontrollers.
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GaN Systems Introduces Record-setting 100 V/120 A GaN Power Transistor At APEC 2018
The 100 V, 120 A, 5 mO GaN E-HEMT device is 1.3X the current rating of GaN Systems’ own 90 A part and 2.4X-to-4.6X the current rating of other high current GaN in the industry.
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APEC 2018: TI Expands GaN Portfolio with High-speed FET Additions
The devices are used in light detection and ranging as well as 5G RF envelope tracking.
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BGA SMT Emulation Adapter Set Allows Affordable, Reliable Socketing of Xilinx FF1153 ICs
Users can reuse their Xilinx1153 ICs with easy-to-use ball grid array adapter sets.
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Watch: Stretchable Bio-Electronic Material Can Capture Neural Networks from Within the Body
A new electronic material has been developed to record neural networks over long periods of time has been developed.
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Researchers Develop AI System that Uses Human Learning Techniques
USTA researchers have developed a new, cloud-based, learning platform for artificial intelligence (AI) that can teach computers how to learn.
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New System-On-Chip for Automotive Front Cameras in Level 3 and Level 4 Autonomous Vehicles
The system-on-chip enables AI processing required for automotive front cameras with CNN IP at industry-leading low power levels.
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Leti and Mapper Develop Individualized Chips with Maskless Lithography in CMOS Process
The low-cost cyber-security breakthrough encrypts individual chips with a code.
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Microchip to Buy Microsemi in Mega Deal Worth $8.35 Billion
The deal will expand Microchip’s offerings in the data center, communications, defense and aerospace markets.
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Lots to Experience at the APEC Booth Hosted by Mouser Electronics
Mouser's booth will feature interactive information about the latest power management solutions, new product advancements and component innovations; a chance to win a pair of Bose wireless headphones; and much more.
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Littelfuse to Display Semiconductor Portfolio at APEC 2018
Littelfuse Inc., IXYS Coporation and Monolith Semiconductor Inc., will display their growing power semiconductor portfolio in the Littelfuse booth at the Applied Power Electronics Conference and Exposition.
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First-time APEC Presence for Mitsubishi Electric
MEUS' semiconductor and device division will have its full line of power semiconductor products on display at APEC 2018.
