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Breakthrough Opens New Doors for Developing the First Zero-waste Cell Phone
The UBC researchers have perfected the process to separate fiberglass and resin, a big step towards creating a zero-waste cell phone.
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Liquid-Repelling Coating Could Save Your Phone, Gadgets and More from Clumsy Kids
A new coating has the ability to repel water, oils, alcohols, peanut butter and juice. You name it, the coating repels it.
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Watch: AI Sleep Mask Uses EEG to Read Your Mind and Help You Sleep
LUUNA is the first intelligent sleep mask that is tailored to your sleep schedule.
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Enterprise OEMs Add FPGAs to Their Server Lineups
Dell EMC is using the FPGAs for a new type of data center computer.
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The First Biosensor Based on Copper and Graphene Developed With Exceptional Sensitivity
Researchers from the Moscow Institute of Physics and Technology developed biosensor chips that have the most sensitivity ever developed, and they are made of copper.
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Metamaterial for Sonar Applications Redirects and Reflects Sound Perfectly
Duke University researchers have created a thin material that controls the redirection of soundwaves almost perfectly.
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THz Radiation Emitters: A Safe Alternative to X-ray Security Scanners
Physicists are formulating a safe and efficient 'paint' that can reveal, with terahertz (THz) radiation, the contents of luggage or objects hidden in clothing.
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Patch for Diabetes Can Read Glucose Levels Without Being Invasive
The newest development in diabetes management is an adhesive patch that can measure glucose levels through a patient’s skin without having to prick a finger or carry around a clunky test kit.
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Premier Farnell Signs Extension to Nordic Semiconductor Agreement
The company is now stocking a key range of wireless devices.
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New Funding for Carbon Nanotube Memory Startup Nantero
The funding will support current and future customers in development of NRAM.
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Researchers are One Step Closer to Lead-Free Double Perovskites in Solar Cells
High-quality films based on double perovskites are promising properties for solar cells.
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The Benefits of Copper Clip Over Wire Bond Packaging
To meet demand for improved product performance, copper clip technology is fast becoming the preferred interconnect.
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Leti Silicon Photonics Design Kit Available for Synopsys OptoDesigner PIC Design Solution
The kit contains design rules and building blocks for multi-project wafers and custom runs on Leti's Si310 Platform.
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System Can Analyze the Surface of Irregular 3D Printed Shapes for the Medical Field
Researchers are taking 3D printing analyzation one step further by combining a robotic arm and mass spectrometry.
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RFMates Ultralite Cable Lightens the Load
Keeping an aircraft’s weight within its design specification is often a challenge for airframers, not just in forward-fit, but in retrofit as well. A pound saved in wiring is a pound that can be used for increasing payload and decreasing fuel consumption.
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New 3D Printing Smart Ink Creates Shape and Color Shifting Objects
This new development adds a whole new level of innovation and functionality to the 3D-printing industry.
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Next-generation Miniature IR Receivers Provide Improved Sensitivity, Noise Suppression and Pulse-width Accuracy
New Vishay IR receivers from New Yorker Electronics offer increased robustness to optical and RF emissions without sacrificing sensitivity in remote control applications.
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Intel’s Core i9 Microprocessor Comes to Laptops
Intel has also ported its Optane memory across all of its 8th Generation MPUs.
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New Material for Smartphones Eliminates the Threat of Overheating
Researchers have developed composites that can conduct heat significantly better than the composites currently used in smartphones.
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Mentor and SamacSys Team to Expand Component Finding Platform
Free PCB symbols, footprints and 3D models will be integrated into Mentor’s PartQuest system.
