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Video: A material tweak that could cut computing's energy bill
Rice University researchers engineered a modified multiferroic that runs at room temperature.
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Rohde & Schwarz to host Power Electronics Online Conference “From Design to Validation” in May
The free online event will cover reliable measurement and validation methods for modern power electronic systems — from discrete components to grid-connected converters.
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Optical computing system runs billion-parameter LLMs in real time
Lumai successfully demonstrates how a light-based server can run large-scale AI inference workloads.
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Direct-to-cell satellite technology to grow 50% in 2026
TrendForce sees more deals coming as the market reaches $7.6 billion this year.
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Optris expands the CTi series for glass and plastics processing
With optimized spectral ranges, fast response times and extensive interface options, the new pyrometers enable precise and reliable non-contact temperature measurement across a wide variety of applications.
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Intel gaining momentum in foundry business
More equipment orders, closer ties with Terafab and advanced packaging are gaining significant interest.
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Marvell adds to optical portfolio with Polariton acquisition
Its plasmonics-based modulation technology will be combined with Marvell’s silicon photonics and DSP capabilities.
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Advanced Chip and Circuit Materials introduces negative and near-zero CTE materials to eliminate thermomechanical constraints for large-format AI chips
These dielectric materials address thermomechanical mismatch problems encountered while scaling large-scale chips for artificial intelligence (AI) circuits.
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The unglamorous layer beneath fab cleanrooms is getting its first research lab
ISRL USA and AI Infrastructure Partners are partnering to build the industry's first dedicated subfab R&D facility.
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Bosch bets big on SiC as market turmoil creates opening
With Wolfspeed's bankruptcy and Chinese competition upending the SiC market, Bosch eyes leadership in the wide bandgap sector.
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Advantest joins Applied Materials EPIC platform
The collaboration will strengthen the ecosystem between front-end manufacturing and back-end testing of chips.
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Rohde & Schwarz joins FormFactor’s MeasureOne partner program
The partnership focuses on on-wafer radio frequency (RF) component characterization.
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ECIA: Best sales environment for electronic components in 5 years
And it will continue into April.
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Wooptix starts construction on Spanish semiconductor cleanroom
The facility will be a hub for innovation as well as for testing, validation and demonstration activities.
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Sub-$1 global asset tracking without RFID
Hubble Network and Inplay collaborate on sensor and location data systems.
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SONOTEC as co-organizer of the 50th European CMP and WET Users Group Meeting
The specialist for ultrasonic flow measurement will participate in the conference as an exhibitor and speaker.
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EPC expands the offering of 100 V integrated GaN power stages optimized for motor drives with improved control and protection
The devices simplify implementation and improve operational robustness in real-world environments while preserving the efficiency and power-density advantages typical of integrated gallium nitride (GaN) technology.
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Report: 2 nm AI chip in prototype verification by Chinese startup
Dishan Technology is looking to enter commercial deployment in 2028 or 2029.
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Cirrus Logic enters the commercial imaging market
The company has introduced new imaging chips for anything from home scanners to flatbed systems and machine vision platforms.
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Advantest opens two innovation centers
The centers are designed to collaborate on next generation test solutions.
