Power Semiconductors

Intel’s Panther Lake using ASML’s High NA EUV lithography

16 July 2026

In a move ASML Holding N.V. calls a demonstration of high-numerical aperture (High-NA) extreme ultraviolet (EUV) lithography’s readiness in a production environment, Intel has introduced the technology for its Panther Lake processors, which has been built on its 18 A process node.

Panther Lake is the code name for Intel Core Ultra Series 3 processors that are manufactured on Intel’s most advanced process technology in its fabs. ASML said the use of High NA EUV to pattern specific layers of these products provides data to further refine system setup, uptime and manufacturing implementation, the companies said.

Additionally, the use of the technology for Panther Lake paves the way toward broader adoption of the lithography tools, ASML said.

“With increased resolution and better process control, the introduction of High-NA EUV marks a substantial development in semiconductor lithography,” said Christophe Fouquet, president and CEO of ASML. “We are proud to play a role in enabling the smaller, denser patterning that will accelerate advancements in AI and other emerging technologies.”

Intel said that in qualifying the High-NA EUV process option on select 18 A product layers, it will increase output for users and help the company develop future options for high performance, density and manufacturing flexibility on future nodes.

Intel and ASML have been working together on implementing High-NA EUV lithography systems for years now. In April of 2024, the company integrated the industry’s first such lithography system at its Hillsboro, Oregon, facility. Intel has also installed and passed acceptance testing of the second generation, ASML Twinscan EXE:5200B lithography system and is now the first to ship high-volume logic devices using High-NA EUV, ASML said.

To contact the author of this article, email PBrown@globalspec.com


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