Memory and Storage

Micron invests $3 billion in GlobalWafers

10 July 2026

Micron Technology Inc. plans to invest up to $3 billion to secure a long-term supply of raw silicon wafers for semiconductor memory manufacturing with GlobalWafers Co. Ltd.

Under the deal, Micron will invest $500 million in strategic financial support to advance the development and manufacturing capabilities of GlobalWafers 300 mm raw silicon wafer facility in Sherman, Texas. Additionally, Micron has entered into a 10-year supply agreement that will provide the memory giant with access to raw silicon wafers to meets it memory manufacturing plans and bolster chipmaking in the U.S. ecosystem.

The move continues Micron’s $200 billion investment in U.S. semiconductor manufacturing that has included building two leading-edge memory fabs in Idaho, up to four fabs in New York, expansion of its Virginia fab, advanced packaging capabilities and future R&D. All told, Micron said the investments could generate 9,000 jobs in the U.S.

According to Micron, the investment reflects long-term planning and flexibility to support the company’s growing demand for memory and storage solutions driven by AI and other data-intensive applications. Additionally, it continues Micron’s investment in domestic U.S. chip manufacturing.

"Securing a reliable supply of critical input materials is essential to supporting Micron’s long-term growth and technology roadmap," said Ben Tessone, senior VP and chief procurement officer at Micron Technology. "Micron’s strategic investment in the U.S. semiconductor ecosystem and GlobalWafers' raw silicon wafer manufacturing facility reflects our commitment to strengthening supply assurance, deepening collaboration with key suppliers, and supporting the expansion of the semiconductor supply chain and manufacturing infrastructure in the United States."

GlobalWafers said the investment will allow the company to meet market demand for semiconductor wafers but also strengthen its local manufacturing capabilities and supply chain resilience.

The companies will also collaborate on next-generation wafer technologies and process innovations to support future semiconductor manufacturing needs.

To contact the author of this article, email PBrown@globalspec.com


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