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Supply Chain
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Online platform supports semiconductor R&D
An online platform for semiconductor simulations, software, collaboration and workforce development is now accessible.
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Outlook 2024: Semiconductor revenue to grow 17%
Memory chip rebound will lead the way.
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DigiKey stocks new eFuse reference design product from Vishay
The eFuse can operate continuously at maximum current with less than 14 W of losses without requiring active cooling.
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Video: First solid-state haptic buttons for smartphones introduced
Boréas Technologies’ technology replace traditional buttons on devices with touch-based options.
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ECIA: Electronic components continue to struggle as year closes
And December looks on track to continue the stall.
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AI drift: An engineering simulation challenge to be tackled
Siemens HEEDS software aids in testing real-world industrial applications.
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Hyperscale DDoS defense capabilities validated by 400GE test platform
Keysight unveils a high density QSFP-DD network security system.
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Accelerating Open RAN adoption with real-time analytics
Viavi’s XhaulAdvisor helps with 5G emulation and validation.
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Photonic integrated circuits explained
A photonic integrated circuit shares similarities with an electronic integrated circuit but is engineered to manipulate and process light (photons) instead of electrical signals (electrons).
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Lowering the barriers for adoption of wireless charging technology
ST Microelectronics has introduced two evaluation boards for Qi-compliant systems.
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Startup seeks to disrupt lidar market with MEMS-step-scanning tech
Omnitron Sensors is co-founded by those with ties to Tesla and Google.
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Littelfuse launches FDA117 optically isolated photovoltaic driver providing floating power source for isolated switching applications
This innovative product generates a floating power source, making it an exceptional choice for isolated switching applications in a wide range of industries.
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Why system-on-modules are gaining traction among engineers
Vendors look to move from just electronic components to alleviate supply chain constraints.
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Increased processing power translates to higher MSO responsiveness
Tektronix’s 4 series B mixed signal oscilloscope has a 200% increase in responsiveness.
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Taiwan’s chip foundry share to decline by 2027
Due mainly to China and the U.S. increasing semiconductor independence.
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First CHIPS Act funding released to defense contractor
The funding will be used to modernize a factory and help produce chips for the F-35 fighter jet.
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Posifa Technologies introduces new MEMS thermal conductivity sensors for A2L refrigerant leaks
The sensor technology increases safety and efficiency by enabling early detection of leaks while providing long-term reliability of 15 years or more in harsh environments.
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First High NA EUV center to be built in North America
The $10 billion facility will be a collaboration between IBM, Micron, Applied Materials, Tokyo Electron and more.
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What packaging feature size is needed to pass 100 Gbps?
Getting past the hump of 100 Gbps data rates means specific package sizes and materials are needed to ensure channels have enough bandwidth and low dispersion.
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Vishay Intertechnology 10 MBd optocouplers combine a low supply current of 5 mA with a wide voltage supply range of 2.7 V to 5.5 V
These high-speed devices save energy in industrial applications while enabling usage with low voltage microcontrollers and inter-integrated circuit bus systems.
