Industrial Electronics

Rosenberger reveals new interconnect series (SMPS) in collaboration with MultiLane

06 February 2024

Rosenberger North America (RNA), a regional subsidiary of the Rosenberger Group, has announced the launch of its Subminiature Push-On Submicro (SMPS) interconnect series for 224 Gbps/lane applications. MultiLane and Rosenberger collaborated to help accelerate the development and deployment of the SMPS product series.

The strict requirements of artificial intelligence (AI) network infrastructures have put pressure onSource: Rosenberger North AmericaSource: Rosenberger North America semiconductor and system vendors to secure as much design flexibility as possible to meet tighter timelines and costs.

“We are very excited to bring our SMPS interconnects to this partnership with Rosenberger,” said Toufic Hatem, interconnect manager at MultiLane. “MultiLane was first to develop this leading 224 Gbps/lane-ready solution, and working with Rosenberger ensures that together, we will be able to scale up production and meet the industry’s demand.”

“Rosenberger is proud to reveal the SMPS product family, enabling 224 Gbps connectivity for the ever-increasing performance and specifications that are required with today's applications in semiconductor, automated test equipment and other markets/applications,” said Neal Rambhia, test and measurement vice president at RNA. “The SMPS product family will be greatly complimentary to Rosenberger's existing product portfolio.”

Rosenberger’s SMPS series supports a frequency range of up to 110 GHz and are extremely versatile, providing customers options for board-to-board, cable-to-board, or cable-to-cable connections. View the Rosenberger SMPS series and product catalog.

To contact the author of this article, email GlobalSpecEditors@globalspec.com


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