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Supply Chain
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Silicon photonics device measures arterial stiffness
The point-of-care screening device for cardiovascular disease is based on Laser Doppler Vibrometry.
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Fast digitizer enables breakthrough in cell sorting
The intelligent image-based cell-sorting technology can process cells with enhanced throughput and accuracy.
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Coating helps fiber optics map surrounding media
Polyimide coatings give optical fibers some protection while providing connectivity for ultrasonic waves to complete sensing tasks.
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Latest Vishay E-series MOSFET lowers conduction and switching losses
The device lowers conduction and switching losses for improved efficiency in telecom, industrial and enterprise applications.
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Watch: Microfluidic-based detector sniffs out volatile organic compounds
The detector might be deployed for environmental monitoring, food and beverage quality assessments, and biological and chemical analytical systems.
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Micron EOL 8G DDR3L SDRAMs now available direct from Alliance Memory
Micron Technology Inc. announced that Jan. 13, 2019, is the last-time buy date for several end-of-life 8G DDR3L SDRAMs from Alliance Memory.
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New Yorker Electronics to stock new enhanced capacitors
New Yorker Electronics announced it will carry the new Vishay BC Components' 500 PGP-ST series of aluminum screw-terminal capacitors
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Newark Element 14 expands MEMS portfolio with Tronics
The sensors can be used for applications needing precision navigation, motion tracking and control, and optical stabilization.
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CES 2019: Skyworks enables Sonos’ high-fidelity amp for emerging smart audio applications
Sonos is leveraging several of Skyworks’ front-end solutions to facilitate robust Wi-Fi communications, allowing users to effortlessly transmit high-quality sound throughout the home with their mobile phones.
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Skyworks powers next-gen 4G/5G mobile hotspots
The SkyOne Ultra 3.0 portfolio is being leveraged by Inseego, a developer of 5G and intelligent internet of things device-to-cloud solutions, for their next-generation mobile hotspot.
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TV roundup: LG’s rollable OLED highlights an insane amount of 8K introductions at CES 2019
The massive TVs will cost a lot and won’t have much content, but will be available later this year.
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CES 2019: Motion sensor optimized for OIS, CIS of still images and video
InvenSense has introduced a motion sensor optimized for optical image stabilization (OIS) and computational image stabilization (CIS) applications.
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Wolfspeed introduces next-gen 1700 V SiC Schottky diodes
The 1700 V SiC Schottky diodes and SiC MOSFETs deliver high efficiency and system cost savings for the renewable energy and electric vehicle markets.
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Vishay Intertechnology releases commercial IHLP inductors featuring short lead times
Alternative versions of the company’s commercial-style IHLP devices are now available with shorter lead times of eight to 10 weeks.
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CES 2019: See LG’s massive OLED wall featuring 260 screens
The “LG OLED Falls” welcomes CES visitors to the company’s booth at the annual tradeshow.
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CES 2019: Xiaomi to use Silicon Labs’ Bluetooth mesh tech for smart home devices
The products will include smart LED lighting commanded by voice-activated smart alarm clocks.
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Hybrid protection module guards valuable consumer electronics from sustained overcurrents and overvoltages
The low capacitance solution features a 0201 footprint and extends breakdown voltage range from 3.3 V to 36 V.
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CES 2019: New automotive sensors improve navigation without need for satellite signal
A new line of automotive sensors is designed to enhance the absolute position of a vehicle in environments where GNSS or GPS is unavailable, such as tunnels, parking garages and urban canyons.
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CES 2019: INT Tech aims to transform high-definition head-mounted displays
The UHPD platform provides a high-density, glass-based, RGB active-matrix organic light-emitting diode (AMOLED) display for robotic surgical devices, military head-mounted displays (HMDs) and virtual reality and augmented reality (VR/AR) headsets
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Cinch Connectivity Solutions announces availability of the CIN:APSE stacking connectors
CIN:APSE solderless, high-density, stacking interconnects are for board-to-board, flex-to-board and component-to-board applications.
