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US firm introduces high-thrust underwater vehicle capable of 30-day missions
The vehicle, dubbed the Momentum Electric ROV, which can reportedly deliver extended support for drilling, inspection, maintenance and repair (IMR), surveys and construction work scopes, features plug-and-play sensors, 360° vision, automation, strong thrust and high payload capacity.
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Future Electronics and SnapMagic announce CAD model integration to support faster design cycles
Engineers can now download verified symbols, footprints and 3D models directly from supported product pages, enabling a smoother transition from component selection to PCB layout.
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TDK presents embedded solutions for next generation applications at Embedded World 2026
Technologies ranging from sensor solutions, power supplies and embedded motor controllers to flash storage solutions and microphones.
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Emerson launches new software defined radio for radar, satellite and 6G research
The device combines 20-gigahertz frequency range and phase-coherent, multi-channel architecture to accelerate next-generation radio frequency (RF) innovation.
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TASKING unveils industry’s first end-to-end compile, debug and test toolchain for Renesas RH850 microcontrollers, including new RH850/U2C series
With its new RH850-supported compiler, TASKING now provides a seamless environment that enables truly holistic development for automotive and industrial engineers.
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Aetina launches AIP-FR68S edge AI workstation at Embedded World 2026
The enterprise-grade "CXO Solution" artificial intelligence (AI) agent system enables users to achieve C-suite-level automated decision-making capabilities while ensuring complete data privacy in edge environments.
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From chiller to chip: GF and Rittal deliver full-scope polymer cooling infrastructure for next-generation data centers
GF and Rittal have collaborated to deliver a fully integrated cooling solution for NETMOUNTAINS' new co-location data center in Velbert, Germany.
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Tiny robot will inspect 17-mile pipe network in the world’s most powerful particle collider
The “PipelNEER” is a small inspection device capable of inspecting beamline pipes in the Large Hadron Collider (LHC), otherwise known as the world’s most powerful particle accelerator, at CERN.
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KT and Rohde & Schwarz to showcase AI-enhanced radio transmission performance
In a joint 6G AI proof-of-concept demonstration, the CMX500 one-box tester from Rohde & Schwarz shows significant downlink throughput gain in an AI-based wireless transmission compared to conventional non-AI technology.
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Nordic Semiconductor accelerates cellular IoT leadership with major new product releases at MWC 2026
The next-generation portfolio features Cat 1 bis, satellite non-terrestrial network (NTN), advanced LTE-M/NB-internet of things (IoT) with edge artificial intelligence and a clear path to 5G eRedCap delivering secure and resilient connectivity across billions of IoT devices.
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TEC 6UI series: Compact 6 Watt DC/DC converters with an ultra-wide 8:1 input
These next-generation converters are engineered to seamlessly replace and serve as an alternative to existing 2:1 and 4:1 input converter series.
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ROHM and Suchi Semicon establish a strategic semiconductor manufacturing partnership in India for global and domestic market
The companies aim to build a reliable and scalable manufacturing framework aligned with evolving industry needs.
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Rohde & Schwarz demonstrates FR1–FR3 carrier aggregation, advancing 6G readiness
Mobile World Congress Barcelona attendees can experience a live demonstration that aggregates a mid-band channel around 2.5 GHz (FR1) with an upper mid-band channel around 7 GHz (FR3), using 4x4 MIMO on both bands and higher-order modulation.
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Nordic Semiconductor releases reference design for Aliro and Matter-based access control systems
The complete reference design is now available to accelerate the development of next-generation access solutions.
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United Semiconductors taps Starlab to scale chip crystal growth in space
The company will look to move from demonstrations to commercial-scale, in-space production of materials for semiconductors.
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Smart glasses could drive the next wave of engineered substrates
“Bulk silicon is no longer enough. You need substrates with superpowers.”
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Menlo Micro and Purdue University advance commercial cryogenic switching for scalable quantum computing
The research demonstrates a commercial-ready architecture for quantum control and readout electronics at cryogenic temperatures.
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ATGBICS brings industrial and commercial network transceiver and cable expertise to Embedded World 2026
The company will showcase its network connectivity product range and services, designed to support both legacy and next-generation infrastructures.
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Powered by light alone, soft robot jumps 188 times and carries 1,700x its own weight
According to its developers, the soft robot automatically bends, snaps and resets itself without a single electronic component, completing 188 continuous leaps in the lab.
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Virtual safety control now with FSoE certification
The CODESYS Virtual Safe Control SL has been certified according to IEC 61508 SIL3 for use with FSoE (EtherCAT Safety).
