Trade organization SEMI forecasts that the glass core substrate market is expected to grow substantially from 2028 to 2040 with a compound annual growth rate (CAGR) of 67.2%.
The demand for these glass substrates is due to emerging AI and high-performance computing (HPC) demand for advanced packaging technologies.
SEMI’s new report in collaboration with Global Net Corp. (GNC) focuses on how glass core substrates may potentially be the next-generation packaging technology for these AI and HPC applications.
“As chipmakers look for new ways to improve system performance beyond traditional device scaling, advanced packaging has become a critical area of innovation,” said Clark Tseng, senior director of Market Intelligence at SEMI. “Glass core substrates are being evaluated as one possible solution for future high-end packages because they may help support larger package sizes, finer interconnects, and improved dimensional stability compared to conventional package-substrate materials.”
According to the companies, investment in glass core substrates is accelerating as companies prepare for the next phase of advanced packaging. Initial production could begin about 2028 in selected high-performance applications with adoption following in the next few years.
The report, entitled Glass Core Substrate Market and Development Trends, found that the CAGR of 67.2% is based on the average of the positive, base and negative scenarios of the glass core substrate forecast.
