Electronics Industry News & Analysis | Market Outlook & Trends

Harwin launches interactive 3D virtual showroom with augmented reality viewer for high reliability ranges

The virtual showroom includes a built-in augmented reality (AR) viewer that enables users to view products up close and gain insight on their form, scale and design.

AI-powered robot combines 3D mapping and online data to locate lost items

To enable the robot, which resembles a broomstick on wheels with a camera mounted at the top, to locate lost objects, the team combined knowledge from the internet with a spatial map of the robot’s surroundings.

New robot gives humans two extra legs, cutting load effort by 35%

The system, which creates a human-robot hybrid that travels like a four-legged centaur, is designed to walk in sync with a human while supporting part of the load typically carried in a backpack.

High-speed robot bicycle can jump over obstacles

The robotic platform, dubbed Ultra Mobility Vehicle (UMV), is a two-wheeled robot that can execute dynamic maneuvers similar to those performed by skilled human cyclists.

TechInsights Teardown: Apple iPhone Air

A partial deep dive into the popular smartphone.

Digitizing the last analog domain — Intelligent tire monitoring

BANF and Silicon Labs create an in-tire sensor solution using Bluetooth for real-time data monitoring of tires.

Embedded World 2026: MediaTek unveils new IoT processors

The devices will be used for smart home, retail, industrial and commercial applications.

Cellular and LoRaWAN hybrid expands IoT coverage worldwide

1NCE and Netmore’s hybrid technology will address 90% of the LPWAN market globally.

Danisense achieves full ISO/IEC 17025 accreditation for AC calibration services

The in-house laboratory is now fully accredited for AC and DC calibration.

Compact high-density digitizers for scalable systems

These digitizers deliver 10 bit vertical resolution and high sampling rates suited for fast detector signals and measurement environments.

IBM, Lam Research to collaborate on future logic materials and processes

The goal will further IBM’s logic scaling roadmap.

Report: Japan plans to boost domestic chip sales by 5x

The country set a goal of $253 billion in annual sales by 2040.

Report: Full production of Samsung’s Texas fab possibly delayed to 2027

It could impact the production of American-made Tesla AI5 and AI6 chips.

Everspin seeks to disrupt traditional NOR flash memory

The company’s Unisyst MRAM technology will offer a unified code storage and data memory architecture.

Efficiency you can measure

Precise temperature, humidity and other sensors engineered for data centers and the food industry will be on display by E+E Elektronik at MCE 2026 in Milan, Italy.

Applied Materials, Micron working on next-gen AI memory

The companies will work on new materials, architectures and more for DRAM, HBM and NAND.

Absolutely APEC 2026 (March 22-26)

APEC has quickly become one of the pre-eminent events on the electronics industry calendar. Our electronics lead editor, Peter Brown, will attend to gather insights, spot trends and report on key developments.