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Supply Chain
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Menlo Micro MM5627: First fully integrated, highly configurable 80 Gbps differential DP3T switch for advanced AI device validation
The switch combines 80 Gbps performance with high configurability, integrated DP3T logic and fully integrated on-chip components.
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Three big semiconductor test probe challenges
This includes mechanical stress, multi-die assemblies and signal switching limits at advanced nodes.
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High dynamic range 2D InGaAs area image sensors for near infrared hyperspectral imaging
These fast, low dark current sensors are engineered specifically for near infrared (NIR) hyperspectral imaging applications.
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At APEC 2026, Alpha and Omega Semiconductor to showcase advanced solutions for AI core power, AI factory and industrial power
Advanced power management solutions that support mounting artificial intelligence (AI) core power, AI factory and industrial power needs will be highlighted.
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Keysight expands digital-layer error performance validation for high-speed 1.6t interconnects in AI data centers
The system delivers digital-layer bit error ratio and forward error correction performance validation for high-speed optical and copper interconnects used in network equipment and production network infrastructures.
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Digitizing the last analog domain — Intelligent tire monitoring
BANF and Silicon Labs create an in-tire sensor solution using Bluetooth for real-time data monitoring of tires.
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Embedded World 2026: MediaTek unveils new IoT processors
The devices will be used for smart home, retail, industrial and commercial applications.
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IBM, Lam Research to collaborate on future logic materials and processes
The goal will further IBM’s logic scaling roadmap.
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Report: Japan plans to boost domestic chip sales by 5x
The country set a goal of $253 billion in annual sales by 2040.
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Report: Full production of Samsung’s Texas fab possibly delayed to 2027
It could impact the production of American-made Tesla AI5 and AI6 chips.
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Everspin seeks to disrupt traditional NOR flash memory
The company’s Unisyst MRAM technology will offer a unified code storage and data memory architecture.
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Applied Materials, Micron working on next-gen AI memory
The companies will work on new materials, architectures and more for DRAM, HBM and NAND.
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Embedded World 2026: Arduino launches Ventuno Q SBC
Powered by Qualcomm’s Dragonwing IQ-8, the single board computer is designed for both traditional and generative devices.
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TI, Nvidia to collaborate on humanoid robot semiconductors
The companies will demonstrate the solution at Nvidia GTC 2026.
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Hitachi Energy and Pakal Technologies join forces in breakthrough silicon power semiconductor for high-voltage modules
The next-generation 3.3 kV power modules are critical to advance rail, renewables, energy storage, artificial intelligence and data center infrastructure.
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GOWIN Semiconductor announces new FPGA families for 2026
New capabilities allow designers to reduce external components, simplify system architecture and optimize board-level efficiency.
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Shimadzu unveils ultrapure water monitoring for chip manufacturing
The TOC analyzer detects urea and other difficult-to-oxidize organic compounds for accurate assessment of water quality.
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Dymax to demonstrate light-curing technologies for electronics assembly at the APEX EXPO 2026
The company will present UV/LED light-curable solutions developed for electronics assembly and printed circuit board manufacturing.
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Nordic Semiconductor expands nRF54L series with entry-level Bluetooth LE SoCs
The series has expanded to cover a wider range of applications, including cost-sensitive Bluetooth LE products.
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TDK presents embedded solutions for next generation applications at Embedded World 2026
Technologies ranging from sensor solutions, power supplies and embedded motor controllers to flash storage solutions and microphones.
