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Agentic AI coming to home and broadband networks
Nokia adds these capabilities to its fixed network product lines.
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Flex and Teradyne Robotics expand partnership to scale intelligent automation across global manufacturing
Flex manufactures core robotics components for Teradyne Robotics, enabling scalable production and rapid global deployment of automation solutions.
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ROHM launches an ultra-compact wireless power chipset for wearables
The chipset is compatible with Near Field Communication technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.
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The optical interconnect boom has a manufacturing problem
AI-driven demand for 800G and 1.6T transceivers is tripling the market — and InP laser capacity is struggling to keep pace.
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Sensors Converge 2026: UpbeatTech highlights vibration sensing across use cases
CEO Jerry Chen demonstrated MEMS-based vibration sensing applications spanning drones, headsets, recording devices and industrial monitoring.
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Marki Microwave acquires LintrinsIC Semiconductors to advance high-power RF switching capabilities
FastSwitch silicon-on-insulator CMOS technology enables nanosecond, high-power switching, strengthening Marki Microwave’s ability to deliver complete, system-level radio frequency (RF) signal chain solutions.
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Sensors Converge 2026: Why digital RF could unlock smart glasses adoption
InnoPhase IoT says advances in digital RF design and low-power Wi-Fi connectivity may help overcome key challenges that have limited the adoption of smart glasses since early devices like Google Glass.
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Mitsubishi Electric launches next-generation GOT3000 HMI
The GOT3000 has been engineered to act not only as a machine interface but as a secure gateway between factory equipment and higher-level IT systems.
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Micron now shipping data center 245 TB SSDs
The storage is targeted at AI, cloud, enterprise and hyperscale workloads.
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Tackling the “hidden tax” on AI infrastructure by improving timing errors
SiTime introduces a new timing device for AI data centers.
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EPC releases 5 kW GaN 3-phase inverters for robotics and light EVs
These evaluation platforms enable high-current brushless DC motor control up to 150 Arms using EPC2361 eGaN field-effect transistor technology.
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Avnet opens sixth integration solutions facility in Singapore
The facility will support users in China and APAC.
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Glass substrates in integrated circuit packaging
Glass substrates offer an alternative to organic substrates and interposers in high-density IC packages, including 2.5D and 3D package designs.
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Sensors Converge 2026: AI needs a body, and the sensor industry is building it
AI is moving from the cloud to the edge, the sector is racing to build the physical infrastructure to house it.
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Everspin earns $40 million MRAM deal for defense memory services
The company will provide engineering and foundry services.
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Inseego bets on the wireless home, buys Nokia's FWA business
The acquisition potentially doubles Inseego's revenue as consumers abandon cable for fixed wireless access broadband.
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Microchip expands hydrogen maser atomic clocks manufacturing
The company has opened a new facility to meet demand for the technology in Tuscaloosa, Alabama.
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Building perception chips with low power for consumer devices
Mosaic SoC brings spatial intelligence to smart glasses, smartphones and more.
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Video: A material tweak that could cut computing's energy bill
Rice University researchers engineered a modified multiferroic that runs at room temperature.
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Rohde & Schwarz to host Power Electronics Online Conference “From Design to Validation” in May
The free online event will cover reliable measurement and validation methods for modern power electronic systems — from discrete components to grid-connected converters.
