Supply Chain
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ROHM and Suchi Semicon establish a strategic semiconductor manufacturing partnership in India for global and domestic market
The companies aim to build a reliable and scalable manufacturing framework aligned with evolving industry needs.
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United Semiconductors taps Starlab to scale chip crystal growth in space
The company will look to move from demonstrations to commercial-scale, in-space production of materials for semiconductors.
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Smart glasses could drive the next wave of engineered substrates
“Bulk silicon is no longer enough. You need substrates with superpowers.”
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Embedded World 2026: SECO expanding COM, HMI and edge SOMs
The platforms are geared toward industrial systems, smart factories and more.
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Embedded World 2026: ADLINK showcases edge AI modules
The modules will include a Nvidia Thor-based platform, UAV offering and more.
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In-package VRM placement may improve power integrity
Power delivery requirements have only become more stringent over time, requiring lower inductance to ensure stable power delivery.
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How sensors keep an eye on the planet
Sensor tech used to monitor the environment, including CO2 emissions, is constantly evolving.
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Explore Embedded World 2026 (March 10-12)
Embedded systems, such as those that incorporate AI, are rapidly becoming native features. So, a trade show such as Embedded World carries increasing relevance.
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ECIA: Strongest sales sentiment for electronic components in 4.5 years
And February is expected to deliver similar strong results.
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Embedded World 2026: Seco launches edge AI SOM
The modules will be used for industrial and medical applications.
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Rochester provides long-term support for ST25R3912-AWLT NFC/HF reader IC
The device is widely used in payment terminals, kiosks and access systems.
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AI turns oscilloscopes into intelligent diagnostic instruments
Machine-learning algorithms integrated into oscilloscope platforms enable automated waveform analysis, anomaly detection and predictive insight across complex electronic systems.
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Video: Waygate launches inspection camera for confined spaces
The pan-tilt-zoom system combines dual HD camera heads, 4,000-lumen illumination and automated 3D modeling.
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Video: AI-powered radio imaging lets robots see around corners
Penn Engineering’s HoloRadar offers reflections off flat surfaces to reconstruct hidden 3D scenes.
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Keysight introduces next-generation XR8 oscilloscope
The tool is designed for high-speed digital and compliance testing.
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SIA: $1 trillion in chip sales possible in 2026
While 2025 hit sales of nearly $800 billion.
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GF, Renesas form multi-billion-dollar chip deal
The agreement expands Renesas’ access to GF’s manufacturing portfolio.
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This multiprotocol module, now at Mouser, delivers connectivity and scalability in IoT devices
The PIC32WM-BZ6 from Microchip Technology is a highly integrated, low-power module that simplifies development and reduces time-to-market for multiprotocol products.
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Smiths Interconnect to showcase next-generation test solutions at DesignCon 2026
The company will highlight test solutions engineered for the next generation of technology in artificial intelligence (AI) PCs, enterprise data centers, automotive electronics and the internet of things.
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Foundry roundup: TSMC’s customer tariff exemption, SMIC’s revenue growth
Microsoft, Google, Amazon and others could get tariff-free exemptions on imported chips from the largest pure-play foundry.
