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Supply Chain
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GF and ST finalize French fab deal
The jointly operating 300 mm facility will expand FD SOI technologies.
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Onsemi signs 10 year SiC agreement with Vitesco
The $1.9 billion deal will help Vitesco ramp up electrification technologies.
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Cadence expands Arm agreement for EDA tool verification
The tools provide a fast path to tapeout.
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LG features digital display tech at InfoComm 2023
The massive booth will show how the technology can be used in many different fields, including education.
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Tech Hubs competition begins under CHIPS Act funding
The goal is to promote innovation and technologies key to economic and national security.
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Siemens to develop 3D verification for fan-out wafer-level packaging
The advanced IC packaging workflow will be deployed across SPIL’s 2.5D and other technologies.
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MediaTek, Nvidia partner for AI-based in-cabin solutions
The automotive portfolios will be used for all vehicle segments from luxury to mainstream.
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Omnivision launches first fully integrated, single chip LCOS panel for smart glasses
The solution will be used for augmented reality, extended reality and mixed reality.
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GlobalFoundries becomes DoD trusted supplier
The accreditation allows the pure play foundry to manufacture secure chips for aerospace and defense applications.
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Wearables, embedded applications get a boost with new OSM SoM
iWave’s new device uses a microprocessor from STMicroelectronics.
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How the 2023 export restrictions could affect electronics sourcing
Electronics export restrictions in 2023 could influence prices and sourcing strategies for components.
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ECIA: Electronic component market decline may be easing
However, April was the second continuous month of lower-than-expected sales.
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First chipset for 5G broadband IoT devices launched
Sequans new chipset supports sub 6 GHz in both SA and NSA formats.
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Applied Materials to build $4 billion research center in Silicon Valley
The facility will include more than 180,000 square feet of cleanroom space.
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Electronics supply chain to return to balance in 2H
Supplyframe sees supply and demand coming more into historical norms.
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Intel unveils new FPGAs
The devices contain the R-Tile chiplet and hard IP support.
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Pros and cons of building custom PCBs for electronics projects
PCBs are preferred over breadboards and perfboards as they are highly durable, resistant to wear and tear, and easier to modify.
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Rambus accelerates AI performance with industry-leading 24 Gb/s GDDR6 PHY
The GDDR6 offering enables cost-efficient, high-bandwidth memory performance for artificial intelligence/machine learning, graphics and networking applications.
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The power of 5G network slicing
The technology has emerged as a solution to grow robust network performance and security.
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3G wireless is dead — What is the impact?
The shutdown of the legacy networks will impact millions directly and indirectly.
