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Supply Chain
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What packaging feature size is needed to pass 100 Gbps?
Getting past the hump of 100 Gbps data rates means specific package sizes and materials are needed to ensure channels have enough bandwidth and low dispersion.
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Vishay Intertechnology 10 MBd optocouplers combine a low supply current of 5 mA with a wide voltage supply range of 2.7 V to 5.5 V
These high-speed devices save energy in industrial applications while enabling usage with low voltage microcontrollers and inter-integrated circuit bus systems.
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DC-DC converters for EVs
With the advent of power semiconductors and integrated circuits, the transformer-based DC power supply that uses high-frequency AC input to modulate voltage has emerged as the clear winner in electric vehicle (EV) applications.
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Mouser now stocks 15,000 electronic components from Würth Elektronik
The semiconductors support automotive, IoT, monitoring and thermal management sectors.
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Littelfuse launches the first automotive grade PolarP P-Channel enhancement mode power MOSFET
The device is an ideal solution for demanding high-voltage automotive and industrial applications.
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Littelfuse announces 800 V N-Channel Depletion Mode MOSFET in modified SOT-223-2L package
The devices are ideal for power mains applications in industrial, energy, telecommunications and LED lighting markets.
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Largest US outsourced packaging facility to be built in Arizona
Amkor Technology’s $2 billion investment will expand its U.S. supply chain footprint.
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Securing ASICs, SoCs and FPGAs with QSE IP
Rambus’ quantum-level security technology is now available.
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Vishay releases industry-first standard rectifier and TVS two-in-one solution
The space-saving device combines 3 A, 600 V standard rectifier and 200 W TRANSZORB TVS in a compact FlatPAK 5 x 6 package.
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DigiKey ranked #121 on Forbes’ 2023 list of America’s Largest Private Companies
This is the second consecutive year the company has been included on the list.
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TI expands wide bandgap portfolio for AC/DC power conversion
The devices address thermal design challenges to keep adapters cooler.
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First switch with on-chip neural network
Broadcom’s device doubles bandwidth and reduces less power than previous generations.
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Joint networking SoC solution bridges gap between pre- and post-silicon verification
Spirent communications and Cadence Collaborate on new testing technology.
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New driver package addresses test automation shortcomings
Spirent communications and Cadence Collaborate on new testing technology.
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TDK noise filters improve sound quality in smartphones
The small devices extend the FM band to the cellular band.
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MediaTek introduces 5G RedCap chipset
The chipmaker has unveiled the first 6 nm RFSOC single die for the technology.
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ECIA: Underperforming electronic components continue to plague supply chain
However, November looks to improve into the growth territory.
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IDC: Chip revenue to rise 20% in 2024
The year-over-year growth will happen after a dramatic 2023 downturn.
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Heterogeneous integration means companies can take chip designs in-house
Companies can now take the lead on SiP designs and advanced packages thanks to heterogeneous integration.
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Alliance Memory introduces new 4 Mb and 16 Mb 3 V multiple I/O serial NOR flash memory solutions
The devices deliver enhanced performance with fast read, program and erase times.
