Supply Chain
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Menlo Microsystems to manufacture the Ideal Switch in upstate New York
The launch of its first domestic production facility will help consolidate the supply chain of the company's Ideal Switch.
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Packaging is the next roadblock to passing 224G
Components operating at 224G data rates require a specific approach to packaging that ensures sufficient channel bandwidth.
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Extended capabilities support next-generation RF testing
NI’s VST combines RF signal generator, RF signal analyzer and FPGA on a single module.
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Tilted CT improves X-ray inspection of flat or high density components
This X-ray laminography inspection method uses an angled axis of rotation to improve voxel resolution for inspecting components with a high aspect ratio.
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ECOC 2023: 200G PAM-4 DSP PHY unveiled for AI networks
The 5 nm device was unveiled by Broadcom at a recent tradeshow.
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MCU line launched for power tools, motor control
Renesas has expanded its RL78 series.
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CHIPS Act funding creates 8 innovation hubs
The $240 million is the largest award to date from the law.
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US updates semiconductor supply chain alert system
The system aims to prevent issues like the chip shortage that heavily impacted the industry recently.
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Vishay increases power density for POL converters with the industry’s smallest 6 A, 20 A, and 25 A buck regulator modules
Offered in 10.6 mm by 6.5 mm by 3 mm package, microBRICK devices are up to 69% smaller than competing solutions and feature wide input voltage ranges from 4.5 V to 60 V.
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Upgrades to Innodisk DRAM PRO series to excel in aerospace and in-vehicle environments
With a wide operating temperature range, the Ultra Temperature module provides long-term stability, making it an ideal choice for industries such as aerospace and mission critical applications.
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Cleanrooms and contaminants: Protocols for keeping ICs pristine
There are multiple types of contaminants, each of which has its own impact on semiconductor manufacturing. Roughly, these are grouped into particulate, biological and chemical contamination pathways.
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GF begins 28 nm embedded flash memory production
The Microchip non-volatile memory solution is geared for MCUs, smart cards and IoT.
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Newark strikes magnetic device deal with Bourns
The deal will include both standard and custom devices.
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TSMC unveils 3Dblox 2.0 open standard
And unlocks OIP 3DFabric Alliance achievements.
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Rambus MACsec-IP-361 is certified ASIL-B ready
This plug-and-play solution is designed for adding Media Access Control security (MACsec) to automotive Ethernet networks.
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Synopsys and TSMC collaborate for software-defined vehicles
The EDA vendor’s interface and foundation IP qualified for the foundry’s N5A process.
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Eliminating LED flicker in automotive cameras
OmniVision unveils new CMOS image sensor for ADAS.
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GF awarded $3.1 billion, 10-year DoD contract
The government will have access to domestically manufactured semiconductors.
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Alliance Memory expands eMMC offering with new 32 GB, 64 GB and 128 GB solutions
These solutions simplify designs and save space in consumer, industrial and networking applications and feature TLC NAND flash technology for increased reliability.
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ECIA: Growth in IC sales sentiment in August
The index for electronic components jumps 7.3 points over the July survey.
