Supply Chain


    HEADLINES ARCHIVE

  • Microchip Rolls MCU for Touch-Sensing

    New member of PIC12/16 family targeted at applications in the consumer electronics, automotive and industrial markets.

  • Cadence CTO Rowen Forecasts Processor Design Split

    Mammals, insects, data, energy and diversity were the topics of a high-level discussion about the future of system-on-chip processor architectures and design provided recently by Cadence Fellow Chris Rowen.

  • TriQuint, RF Micro Merger Renamed Qorvo

    Merged entity will reemerge under a new banner meant to convey that its customers are at the center of what the company will do.

  • Microsemi Ships 22nm FinFET ASICs

    Microsemi, a signup for Intel's 22nm FinFET foundry offering, has said the initiative has started producing ASIC revenue while it starts to think about what to do with 14nm FinFET.

  • Why UMC is Boosting Automotive Chip Business

    Foundry pushing to increase automotive semiconductor participation in order to take advantage of a changing marketplace shifting to one of the largest growing chip markets.

  • New Spin-charge Converter for Spintronics

    An international team of researchers has developed a spin-charge converter made of GaAs, with efficiency comparable to one made of platinum.

  • Micron Targets Tablets, Ultrabooks with New SSD

    Memory chip maker's new solid state drive targets compute platforms needing a low power device but with the high performance of NAND flash.

  • Mouser, Eurotech Ink Distribution Deal

    Catalog distributor Mouser Electronics has signed a global distribution agreement with Eurotech, a manufacturer of embedded products and systems.

  • Avnet Signs TrueUC Solutions

    Avnet Embedded has signed a distribution agreement with TrueUC Solutions and will carry the company’s TrueUConnect, TrueContact and TrueCapture communications software.

  • Intel Acquires 1,400 Telecom Patents

    Chip vendors agrees to buy patent trove from the Gores Group for undisclosed amount.

  • SMIC Develops Flash Process As Step To 3D-NAND

    SMIC reckons its internally-developed 38nm NAND flash manufacturing process is going to help it serve fabless customers with custom memories in both 2D and 3D component formats.

  • TSMC Shrinks 28nm CMOS Process

    Despite rumors of that is producing a 20nm application processor for Apple, TSMC is touting a tweaked 28nm CMOS process as the way forward for smartphone, tablet computer and TV chips.

  • Digi-Key Signs Inventek; Mouser Expands Switch Sensor Line

    Digi-Key has signed a global distribution agreement with Inventek and will carry the company’s entire line of Wi-Fi and GPS modules and antennas.

  • Fab Tool Sales Rise in Q2

    Semiconductor manufacturing equipment sales increased 28 percent to $9.6 billion in the second quarter compared to the second quarter of 2013, according to trade association SEMI

  • Flextronics to Build Micromem’s 'Lab-on-a-Chip'

    Flextronics has signed an agreement with Micromem Technologies Inc. to build the company’s “lab-on-a-chip”used in vehicles to measure oil levels, temperature and oil condition.

  • Chip Equipment Spending to Rise 20% in 2015

    Front-end fab equipment spending will increase 20 percent to $42 billion in 2015, after rising 21 percent in 2014, according to trade association SEMI.

  • ST Introduces MEMS-based IMU for Wearables, IoT

    STMicroelectronics (ST) has rolled out an always-on, high performance inertial measurement unit that combines a 6-axis accelerometer with a 6-axis gyroscope targeted at wearable devices and new products involving the Internet of Things.

  • Toshiba Begins 3D-NAND Fab Construction

    Toshiba may seek profit rather market share as it goes forward with 3D-NAND wafer fab construction in Yokkaichi.

  • Tunnel FETs to Save Power by 2017, Says Toshiba

    Toshiba has high hopes for tunnel FET transistors that it has succeeded in implementing in silicon thereby providing CMOS compatibility for devices that could operate at below 0.5V.

  • Apple Could Be Driving TSMC's Record Sales

    TSMC's sales racing 25 percent ahead of where they were a year ago appears to provide evidence that its is being well paid for the millions of application processors that were required for the launch of the iPhone 6.

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