Electronics Supply Chain News & Analysis

Broadcom Adds Chips, NFC to its IoT Platform

Two offerings into the company’s Wireless Internet Connectivity for Embedded Devices portfolio include a Wi-Fi SoC and software that enables NFC capability for mobile and smart devices.

GaN Systems Signs with Japanese Distributor

Japanese distributor Daitron to sell GaN Systems’ gallium nitride power switching chips in Japan and Korea.

IP Vendor eSilicon Launches Procurement Portal

Web-based tool allows chip designers to specify the requirements of their design and then select a silicon foundry to produce their custom IC was introduced by eSilicon.

WSTS Expects Moderate Chip Growth in 2015

The World Semiconductor Trade Statistics group predicts chip sales will grow 3 percent to reach $344.5 billion in 2015.

Chip Equipment Spending Expected to Grow 15% in 2015

Sales of new semiconductor equipment expected to reach nearly $44 billion in 2015, according to the SEMI trade group.

Freescale Acquires Zenverge to Advance IoT Security

Acquisition expected to enhance Freescale’s media streaming portfolio, specifically in offering secure sharing of HD video and other content in the cloud.

SureCore Raises Funds For SRAM IP

A UK design group has raised a series A round of funding with the aim of being able to license out its leading-edge SRAM IP in the coming months.

Applied Materials, Tokyo Electron Merger Delayed

The formation of Eteris BV, a merger of chipmaking equipment leaders Applied Materials and Tokyo Electron has dragged on for more than a year and sign-off by regulatory authorities on issues such as competition is not yet in sight.

Cypress, Spansion Agree to $4 Billion Merger

All-stock transaction expected to result in firm with $2 billion in annual sales.

MagnaChip Offering 0.18 Micro SOI RF CMOS Process Technology

South Korean chipmaker will target the process technology at RF front-end module devices specifically antenna switching and tuner applications in smartphones and tablets.

Digital Signal Controllers Aim at Harsh Environments

Line of 5V digital signal controllers that allows for easy connection to sensors and noise immunity in appliances, industrial and automotive products.

Infineon to Expand Wafer Fab, Buy Into PCB

Infineon plans to expand a 200mm wafer fab in Kulim Malaysia and is moving closer to a PCB manufacturing partner in Germany through acquisition of a minority share. This after Infineon posted solid quarterly financial results.

Lime Micro Offers Field Programmable RF for 4G, MIMO

A programmable RF dual transceiver could be just the thing for multi-standard software-defined radio systems. Lime has iterated its design and is dropping the price on an earlier implementation.

Fab Tool Orders Fall, Board Orders Rise

Orders and shipments for semiconductor equipment fell in October, while PCB shipments rose slightly year-to-year, according to trade groups.

LED Matrix Manager Drives Auto Headlamp Arrays

LEDs are an increasingly viable option for headlamps, but an array of LEDs is difficult to control on a per-LED basis; the Texas Instruments TPS92661-Q1 is designed to alleviate the problem and enable electronic steering of the light-beam output.

MediaTek, SMIC Help Form $1.7 Billion Chinese Equity Fund

A massive private equity fund formed by SummitView Capital is chartered with the acquisition of global design companies from around the world and helping them prosper within China.

UDI Targets Wearables with Ultra-thin Touch Sensors

Touch panel maker is developing thin touch products in order to meet the demands of consumers that want next-generation wearable mobile devices to be thin but with enhanced performance.

TSMC Orders EUV Lithography Tools For Production

Foundry TSMC has ordered to production scanners for extreme ultraviolet lithography of integrated circuits, according to equipment supplier ASML. The chipmaker looks set to insert the long-awaited production technique in its 10nm FinFET node in 2016.

Intel Tips 256-Gbit 3D-NAND Memory

Intel is getting ready to sell a 256-Gbit 3D-NAND flash memory that could be extended to a 384-Gbit capacity, but it will mainly sell the memory in the form of solid-state drives (SSDs).