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Supply Chain
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SMIC Takes Majority Stake in European Foundry
The $54.4 million deal is the first overseas acquisition for the pure play foundry.
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Corsair Rolls Out LED-lit DRAM Module
The DIMMs come with either red or white LED variants with a performance at 4,333 MHz.
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AEC-Q101-Qualified 12 V and 20 V MOSFETs Suit Synchronous Buck Applications
Vishay Intertechnology, Inc. has introduced reportedly the industry’s first AEC-Q101-qualified 12 V and 20 V MOSFETs in a dual asymmetric power package.
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Bentley Uses Space Technology to Take 53-Billion-Pixel Image of Its Car
If the image was ever reproduced in standard print format, it would be the size of a football field.
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PEI-Genesis Turns 70
Philadelphia-based distributor PEI-Genesis is celebrating its 70th anniversary as a supplier of custom-engineered interconnect solutions.
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This Graphene Adaptation Fuels Flexible Lighting and Screens
GraphExeter, the most transparent, lightweight and flexible material there is to date for conducting electricity, can increase the brightness of flexible lights by up to almost 50%.
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Vesper Demonstrates Commercial Quiescent-Sensing MEMS Device for Consumer Products
Wake-on sound microphone enables always-on listening capability at practically zero power draw.
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Mouser to Sponsor 20th Annual Microchip MASTERs Conference
Global electronic components distributor Mouser Electronics, Inc. will sponsor the 2016 Microchip MASTERs Conference,an in-depth technical conference to be held August 17 to 20 in Phoenix.
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Capacitors Handle Resonant Power Circuits
Illinois Capacitor’s HC and LC Series conduction-cooled capacitors are designed to reliably handle the current and voltage in resonant power circuits.
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Sensorless Three-Phase Controller Drives Automotive Brushless DC Motors?
ON Semiconductor’s LV8907UW three-phase motor controller enables key parameters and functions to be configured via SPI interface and stored in embedded non-volatile (OTP) memory.
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Electronics360 Webinar to Examine Automotive Connectivity
Automotive connectivity will be the focus of a webinar sponsored by Electronics360 scheduled for Thursday, June 30.
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IDT, Cavium Team Up on Data Center Reference Design
IDT’s DDR4 memory interface solutions deployed in low-energy data center platform design based on Cavium’s ThunderX® family of Workload-optimized ARM processors.
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Power Control Unit Allows Parallel Operation
The EPCOS VIP-3-TP control unit from TDK allows three reactive power compensation to be coupled for parallel operation.
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Solar Cells So Thin That They Can Wrap Around a Pencil
The bendy solar cells could have future applications in wearable electronics like fitness trackers and smart glasses.
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Why Do Engineers Care So Much About Graphene?
Graphene, graphene, graphene. Everywhere we turn there is some new engineering or electronics breakthrough involving graphene. What’s so great about graphene, anyway?
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Tiny Nine-Axis Motion Sensor for Wearables Launched by Bosch Sensortec
The MEMS device contains an accelerometer, gyroscope and geomagnetic sensor.
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µModule Power Products Come in Tin – Lead BGA Packages
Linear Technology’s µModule® (micro-module) power products come in reflow solderable tin–lead BGA packages.
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Seven Companies That Will Contribute to Technology at the Rio 2016 Olympic Games
Take a look at these seven major companies to see what their tech role will be in this year’s Olympic Games.
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ST and Qualcomm Team up for Sensor Modules in Smartphones
Software added into the sensors will allow for new low-power, high-performance Snapdragon-based phones.
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Optical Backplane Interconnect Complies With VITA Standards
TE Connectivity’s Ruggedized Optical Backplane interconnect system provides a high-density, blind-mate optical interconnect in a backplane/daughter card configuration.
