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Supply Chain
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Self-Propelling Liquid Metal Brings Us Closer to Future Elastic Electronics
Researchers have just laid the foundation needed to move past solid state electronics toward flexible and dynamically reconfigurable soft circuit systems.
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Integrated Power Module Solution Suits Next-Generation Automotive BLDC Systems
Highly integrated module featuring 30 A, 40 V MOSFETs enables development of more compact, streamlined motor drives exhibiting elevated degrees of reliability.
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LED Power Supplies Withstand Outdoor Use
The DBFE Series constant-current LED power supplies come in 18 W and 30 W versions, and are suited for outdoor applications.
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High-Performance Data Processing Technology Increases Data Analytics Speed by Up to 100 Times
Real-time analytics system prototype helps realize self-service data analytics.
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Wearable Electronics Measure How Much You’ve Had to Drink
Recently it was proven that blood–alcohol concentration can also be estimated by measuring alcohol levels in insensible sweat—perspiration that occurs before it is perceived as moisture on the skin.
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Ultra-Miniature Color, Ambient Light, Proximity Sensor Debuts
With a 4 mm x 1.75 mm footprint, ams considers its TMD3700 to be the smallest optical sensor combining color, ambient light and proximity sensing.
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Thick Film Chip Resistors Are AEC-Q200 Qualified
The Vishay Draloric RCS e3 thick-film chip resistors are AEC-Q200-qualified and provide enhanced pulse load performance and ESD surge characteristics compared to standard chip resistors.
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Future Electronics to Distribute TE Connectivity’s DEUTSCH Aerospace Products
Future Electronics has expanded its inventory of DEUTSCH products for the aerospace and transportation markets from TE Connectivity (TE).
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1000 W Module Cuts Cost of Configurable Power Supply
Artesyn’s new 1000 watt module for its next generation?MicroMP (µMP)?configurable power supply replaces four discrete modules with a single three-slot module.
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Researchers Develop Interactive Dynamic Video for Touching VR Objects
In real life, we can reach out and touch objects—poke them, push them, prod them—then watch them react as a result. In a video, it does not quite work like that, unless you are dealing with a new simulation system like the one developed at MIT's Computer Science and Artificial Intelligence Lab.
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Columbia Engineers Developing Functional 3-D Food Printer for All
The final prototype should be done by the end of the year, and the hope is that as it cooks it prints a variety of new edible items.
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Locking Plug Meets Board-To-Board Apps
The 70-9159 Series locking plug contact has positive latching mechanism that eliminates the need for costly thermal adhesives and hand soldering.
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UMC Qualifies 0.18um BCD Process for Automotive-Grade Semiconductors
The pure-play foundry says it is ready for mass production of ICs based on this process.
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How Smartwatches Can Make Nursing Homes Safer
A team of engineers has developed a smartwatch application that can help certified nursing assistants (CNAs) respond to alerts more quickly and help prevent falls.
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Nanoco and Merck Sign Cadmium-Free Quantum Dot Agreement
The non-exclusive deal would have Merck marketing Nanoco’s material supply and the ability to build its own production facility.
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MicroQSFP connector offers increased density and better thermal performance.
The microQSFP connector offers 33% increased density over the QSFP connector and better thermal performance than other pluggable solutions.
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TDK Acquires Tronics Microsystems to Expand Sensor Portfolio
TDK’s subsidiary EPCOS has expanded its sensor portfolio with the acquisition of European sensor manufacturer Tronics Microsystems.
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Voltage Variable Attenuators Cover Range From 400 MHz to 18 GHz
Pasternack’s line of voltage variable attenuators?offer up to 60 dB of attenuation across a 400 MHz to 18 GHz range.
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DC/DC Converter Drives Gate Circuits
Murata’s MGJ1 DC/DC converter is designed to drive high and low-side gate circuits such as those using IGBTs and SiC MOSFETs.
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Electrolithography: A Breakthrough in Nano-patterning Process from Indian Scientists.
Scientists at the Indian Institute of Science, Bangalore have discovered a new method to lay circuits in electronic chips that is both cost-effective and energy-efficient.
