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Supply Chain
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Cree and ST Microelectronics expand and extend existing silicon carbide wafer supply agreement
The increased wafer supply enables the semiconductor providers to address rapidly growing demand for silicon carbide power devices globally, particularly in automotive and industrial applications.
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Highly stable, slim-line PC screw terminals
Rated for 15 amps, these new devices are ideally suited for high density packaging on a PCB design requiring a low profile, minimal footprint wire-to-board connection.
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Allegro MicroSystems launches first magnetic gear tooth sensor IC designed for traction motors
The gear tooth sensor IC is designed to provide incremental position for electric vehicle traction motors operating up to 30 k RPM.
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Temperature sensor saves power and is accurate in mobile monitoring
ST Microelectronics has introduced the sensor for asset trackers, appliances and smart consumer devices.
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Thermal runaway in Schottky rectifier diodes and how to solve it
Thermal runaway in a Schottky rectifier diode can be a problem, but one that can be mitigated with proper consideration.
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Audio visual processor chipset replaces FPGAs in numerous applications
The chipset could be used for large venue displays, command and control monitoring, medical, eSports, leisure and hospitality, retail and residential AV.
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Vishay Optoelectronics high speed IR emitters now produce greater brightness and intensity
New 850 nm, 890 nm and 940 nm high speed infrared emitters supply 30% higher brightness than prior generation devices, thanks to opaque side walls that eliminate unwanted side emissions.
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Embedded SIM technology critical for mass rollout of cellular IoT
The technology also supports 5G-ready LTE-M and NB-IoT modules.
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Tessent Connect DFT methodology speeds up IC design testing
Mentor Graphics Corporation has announced Tessent Connect, a new design-for-test (DFT) methodology that enables IC designers to hit manufacturing test goals faster and using fewer resources than traditional DFT methods.
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Tiny wake-up chip could extend battery life for IoT devices
The wake-up chip only wakes up a device when it needs to communicate and perform its function and keeps the device dormant the rest of the time, thereby reducing power use.
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Xilinx expands automotive-grade programmable SoC portfolio
Xilinx Inc. is growing its portfolio of devices that meet the safety, quality and reliability requirements for automotive products ranging from small devices powering edge sensors to devices for centralized domain controllers.
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Bel Magnetic Solutions introduces a series of press-fit ICMs
These ICMs are designed for applications that require a connector that can be pressed onto the PCBA instead of traditional soldering techniques.
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TSMC and Globalfoundries settle disputes
Both companies also agreed to a cross-patent agreement.
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Transphorm ships over half a million GaN power devices for multi-kilowatt class applications
Customers in the broad industrial, infrastructure and IT and PC gaming markets have publicly announced in-production devices built with Transphorm’s GaN technology.
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New surface-mount fully integrated current sensors offer easy handling and layout for high current density applications
The ACS772/3 family expands to include through-hole and surface-mount CB package options with enhanced working isolation voltage.
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Bluetooth system-on-chip extends wireless connectivity to IoT devices
The extended range could be used for both consumer electronics and healthcare devices.
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Air velocity sensors with digital I2C output
Unlike thermistor-based solutions, the PAV3000 has a MEMS sensor core that is minimally affected by ambient temperature changes and provides real-time feedback on proper air flow at critical locations.
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Video: Smart development center produces 50 TB of data daily
Intel’s so-called “smartest building in the world” uses AI to make decisions and is highly automated.
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Three-phase brushless motor control driver for appliances and pumps
The chip eliminates the need for an external MCU.
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50W, 750 V DC input railway converter delivers high conversion efficiency and power density
The railway DC-DC converter taps silicon carbide semiconductor technology to deliver high conversion efficiency and high power density.
