The Applied Power Electronics Conference 2020 is set to tackle the next-generation packaging needs for high power density applications with a session on 3D power packaging.
The Power Sources Manufacturers Association (PSMA) is sponsoring the session entitled “Packaging Power Circuits to Make Small and Reliable Products” with speakers presenting a current and future look at packaging and manufacturing technologies using high-density 3D packaging.
According to PSMA, manufacturers need power sources in their products for smaller solutions that support higher density, higher reliability and higher frequency operation. 3D packaging uses embedded components combined with manufacturing technologies to provide a more reliable solution compared to current solutions. The packaging offers fast time to market and increased power density in a smaller footprint. The technology is already in production in semiconductor, component and power supply designs, PSMA said.
The session will feature seven experts that will give real-world examples of implementation and comprehensive analysis of the challenges of high power in small packages. Attendees will get a realistic understanding of the challenges such as 5G base stations and automotive motor drives.
APEC 2020 takes place on March 15-19 in New Orleans.
