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Supply Chain
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ROHM launches 2-in-1 SiC molded module: DOT-247
The module retains the versatility of the widely adopted TO-247 package while achieving high design flexibility and power density.
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Video: Qualcomm acquires Arduino, launches new SBC
Called the UNO Q, the processor board is the first iteration from the new company.
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Imec launches 300 mm GaN power electronics program
The companies include Aixtron, GlobalFoundries, KLA Corp., Synopsys and Veeco.
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SEMICON West 2025: Qnity launches CMP platform
Called Emblem, the tool offers customization and step-out performance for advanced semiconductor processing nodes.
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From HaLow to LoRaWAN: Choosing the right protocols for factory floors
A tactical mix of radios for specific properties, budgets and data requirements is the best practice.
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Report: AMD rumored in talks with Intel as foundry partner
It is in the early stages and an agreement may not happen.
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Imec debuts beyond-100 GHz C-band SiGe EAM
It is called a world’s first.
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TSMC roundup: Arizona fab update, no chip manufacturing deal
The third fab could be in mass production as early as 2027.
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Veeco-Axcelis merger forms fourth-largest US wafer fab equipment maker
The agreement will increase market opportunities and portfolios.
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OmniVision launches smartphone, action camera CMOS image sensor
The sensor offers an ultra HDR with up to 110 decibels for video
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Critical Manufacturing to demonstrate advanced MES for semiconductor production at SEMICON West
These solutions support semiconductor manufacturers and tackle the pressures of advanced chip production and increasingly complex supply chains.
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ROHM develops ultra-compact CMOS op amp: Delivering lowest operating circuit current
The device is optimized for use as a measurement sensing amplifier in size-constrained applications such as handheld measurement instruments, wearable devices and indoor motion detectors.
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Nordic Semiconductor expands the nRF54L series with a high-memory wireless SoC for advanced Bluetooth LE and Matter applications
The nRF54LM20A is designed for advanced wireless products across markets, including consumer, smart home, commercial and industrial.
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Hydrogen-ready Piezocryst by HBK sensors will help engineers set new benchmarks for net-zero energy generation
The direct measurement solution is built around gallium phosphate to capture high-fidelity pressure signals in the harshest environments.
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Power integrity analysis challenges from package to PCB
PCBs and packages must be considered as complete systems to evaluate power integrity in simulation and measurement.
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Rambus Design Summit returns October 8th
Attendees will explore how memory innovation is enabling the artificial intelligence (AI) revolution from data centers to client devices.
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The Things Conference 2025: Morse Micro SoC pushes Wi-Fi HaLow into mass market
The chip will be used for next-generation IoT and edge AI applications.
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Nordic Semiconductor launches nRF Connect SDK Bare Metal option for nRF54L series
The solution simplifies migration from the legacy nRF5 SDK and nRF52 series to the next-generation nRF54L series.
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Attacking radar: The evolving science of electronic warfare
Combating radar with electronic signals through sensors is a growing field of research - but which country will come to dominate it?
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The rare Earth-for-technology deals are just getting started
The U.S.–China tech-for-minerals swap points to future agreements as both nations seek leverage in technology trade war.
