At the upcoming Embedded World 2026, Seco will introduce system-on-modules (SOMs) designed to provide on-device AI and generative AI at the edge for industrial and medical applications.
The SOMs, called Trizeps-X-Genio360/360P, combine a CPU and integrated MediaTek NPU that delivers more than 8 tera operations per second (TOPS) of AI performance. This allows the modules to perform on-device AI and generative AI at the edge, the company said.
The SOM also features:
- 4K displays
- Camera interfaces
- Industrial connectivity
- Low-cost, robust SODIMM connector
- High level of long-term pin and software compatibility
- Typical power envelope below 5 W
- Industrial temperature range: -40° C to 85° C (industrial version)
The modules will target applications like human-machine interfaces (HMIs), mobile and handheld devices, smart appliances and AI-enabled edge systems.
Embedded World takes place from March 10-13 in Nuremberg, Germany.
