RSS
Supply Chain
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SK Hynix assembles its first High NA EUV system
The system will be used to develop next-generation DRAM at its M16 fab in South Korea.
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Debugging backside power delivery
The technology shifts power interconnects to the bottom side of a chip, creating new test and debug challenges.
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Chipmakers balk at government equity for CHIPS Act funding
TSMC and GF both seem unwilling to make similar deals.
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SK Hynix’s 321-layer 2 TB NAND flash now in production
It is called a world’s first.
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xMEMS to unveil slimmer, lighter, more AI-capable smart glasses
The eyewear will include its MEMS loudspeaker and in-frame active cooling technology.
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Advantech’s rolls robotics development kit with Nvidia’s Jetson Thor
This gives machines the ability to sense, understand and act with real-time reasoning.
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Ambiq Micro’s SoC family targets edge AI applications
The chip includes a 48 MHz network processor and BLE 5.4 radio.
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xMEMS unveils AI glasses prototypes featuring MEMS technologies
Prototypes featuring the Sycamore loudspeaker and µCooling fan-on-a-chip enable thinner, lighter and cooler AI glasses.
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MWIR: The heat vision powering tomorrow’s battlespace
From drones to destroyers, mid-wave infrared (MWIR) sensors deliver unmatched thermal clarity across land, sea, air and space.
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DIVA Labs announces three major product developments that reinforce its commitment to high-performance imaging solutions
Industry-first 55-inch and 65-inch optical bonding surgical displays enter mass production and the new QDII OTS platform and OLED display for ultrasound imaging are launched.
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GF, Cirrus Logic seek to advance US-based chipmaking
The companies will also collaborate on GaN chip manufacturing.
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US eyes 10% Intel stake in state-backed tech shift
And Softbank invests $2 billion in the American chipmaker.
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Qualcomm brings SATCOM to wearables
The devices will be able to call for SOS without any cell connection.
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China’s Hua Hong expands legacy chip capacity
Amid U.S. export restrictions, the deal for HLMC will help meet continuing demand for mature process nodes.
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Report: TSMC to phase out 6-inch wafers
It will also consolidate 8-inch capacity.
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TDK targets OIS with new IMU sensors
The stabilization technology is designed for a range of applications like smartphones, tablets and cameras.
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Infineon’s acquisition of Marvell’s automotive business complete
The deal expands Infineon’s automotive chip portfolio.
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GF completes MIPS acquisition
The deal will strengthen GF’s chip manufacturing capabilities in AI, edge computing and more.
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Astute Group ushers in a new era of distributed intelligence
Discover a new generation of artificial intelligence (AI) accelerators and microcontrollers that deliver generative AI in power-constrained environments.
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ECIA: Strong electronic component sales sentiment continues in July
The meteoric gains made in June remained strong in July and the August forecast looks good too.
