Seco will demonstrate its system-on-modules (SOMs) at the upcoming Embedded Systems 2026 trade show including computer-on-module (COM) express modules, industrial human-machine interfaces (HMIs) and edge AI systems.
Powered by Qualcomm’s Dragonwing platform, the SOMs are geared toward industrial systems, smart factories, smart grid and more.
The SOM-COMe-CT6-Dragonwing-IQ-X is designed for industrial PCs, advanced HMIs and AI-driven automation that is powered by 12- or eight-core Qualcomm Oryon CPUs with up to 3.4 GHZ and up to 45 terra operations per second (TOPS) of on-device AI acceleration. This supports:
- Real-time control
- Analytics
- High-resolution visualization
- Fanless design
Seco said part of its Qualcomm Dragonwing series expansion will include the development of SMARC solutions and COM-HPC mini platforms. These devices will support Clea-enabled application and next-generation industrial systems.
The scalable SMARC platforms are based on Dragonwing QCS6490 and the Qualcomm Dragonwing QCS5430 and are geared as the building blocks for embedded and industrial AI systems.
Embedded Systems 2026 takes place March 10-12, 2026, in Nuremberg, Germany.
