MEMS and Sensors

GF, Renesas form multi-billion-dollar chip deal

18 February 2026

Pure-play foundry GlobalFoundries (GF) and Renesas Electronics Corp. have expanded their collaboration in a multi-billion-dollar partnership that gives Renesas more access to GF’s technologies’ differentiated platforms.

Under the agreement, Renesas will gain further access to GF’s portfolio specifically:

  • Fully depleted silicon-on-insulator (FD-SOI)
  • Bipolar-CMOS-DMOS (BCD)
  • CMOS technologies with non-volatile memory

These technologies will support Renesas’ system-on-chips (SoCs), power devices and MCUs capability. Tape-outs under the deal will begin in mid-2026.

Renesas said it will use the expanded access for its vehicle chip portfolio as these cars become more intelligent and electrified.

The expanded partnership includes not just the U.S. manufacturing facilities but GF’s Germany and Singapore fabs as well as its manufacturing partnership in China.

GF said it now manufactures semiconductors from the top three automotive MCU manufacturers globally and this deal will help Renesas and its customers with secure, localized production options.

“The automotive landscape is changing fast,” said Tim Breen, CEO of GlobalFoundries. “Semiconductors are now the foundation of innovation, powering advanced driver assistance, battery management and secure connectivity. These systems demand performance and efficiency under extreme conditions, and GF’s differentiated platforms are built for that. We’re focused on delivering what matters most: reliable supply and the technologies that enable the vehicles of tomorrow.”

To contact the author of this article, email PBrown@globalspec.com


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