RSS
Home
-
Wearable sensor uses sweat to monitor body functions
It could help in the detection of healthcare issues or monitor athletic performance.
-
Altech Corp.’s expanded DIN enclosure range offers comprehensive solutions for electronic packaging
These enclosures are ideal for housing a wide array of devices, including relays, sensing and monitoring devices, timers and transducers, as well as printed circuit boards.
-
Online event: Spectral thermography — Basics and applications
Learn about the advantages and challenges of spectral infrared thermography for precise temperature measurement.
-
X-FAB ramps up GaN production ahead of TSMC’s exit
The company is accelerating its technology at its 8-inch fab in Dresden, Germany.
-
IFA 2025: ShiftCam’s 10x lens brings distant shots closer
The new 240 mm LensUltra Explorer series pairs long-range optics with pocket-sized storage.
-
Surveyors get street view precision with GeoCue’s lidar tool
The company’s LP360 lets professionals measure, rotate and walk through scan data in real time.
-
Rohde & Schwarz extends the broadband amplifier range to 18 GHz
The new BBA series features higher field strengths for critical test environments up to 18 GHz.
-
IFA 2025: Aqara shows next-gen smart home gear
Smart thermostats, security cameras and prototypes.
-
SK Hynix assembles its first High NA EUV system
The system will be used to develop next-generation DRAM at its M16 fab in South Korea.
-
Time-based mobility of RF systems in Wireless InSite Release 4.0
Watch this webinar to learn about the next generation of Wireless InSite, featuring a robust mobility framework that accurately models the movement of transceivers and objects within a user-defined scene.
-
Securing the future of Terabit Ethernet: introducing the Rambus Multi-Channel Engine MACsec-IP-364 (+363)
The solution delivers full line-rate MACsec and optional IPsec support for 1.6T and 3.2T Ethernet ports, offering a highly scalable and configurable solution for securing high-speed data traffic.
-
Debugging backside power delivery
The technology shifts power interconnects to the bottom side of a chip, creating new test and debug challenges.
-
Renesas USB-C power solution with innovative three-level topology improves performance and reduces system size
The three-level buck converter topology enabled by the new IC delivers exceptional efficiency and significantly reduces the required inductance for regulating the output voltage.
-
Cyborg combat suit lets soldiers hurl drones
The exoskeleton features mechanical leg supports, a modular backpack, a head-mounted display and drone-launch capability.
-
Beetle-inspired tech detects missiles 20,000 times faster than US Iron Dome
With the potential to outperform the U.S. military’s planned “Golden Dome” missile defense shield, the new sensor is reportedly 20,000 times faster than existing technologies and capable of detecting motion and heat in extreme environments such as smoke, dust or fog.
-
Chipmakers balk at government equity for CHIPS Act funding
TSMC and GF both seem unwilling to make similar deals.
-
TechInsights Teardown: Hesai ATX Lidar
A partial deep dive into the automotive sensing unit.
-
European vendors team for GaN-based 6G power amplifiers
The project will focus on the 7 GHz to 15 GHz frequency range.
-
Murrelektronik to showcase MVK Fusion at PACK EXPO 2025
The event will launch the MVK Fusion Common Industrial Protocol Safety (CIP) Safety system, a new hybrid I/O device designed specifically for Ethernet/IP applications.
-
Swarming autonomous munitions promise to enhance warfighter capabilities in hostile zones
These networked munitions, the researchers explained, are capable of being deployed from the air, the ground or maritime platforms to support joint all-domain operations.
