MEMS and Sensors

Computex 2026: Nvidia and TSMC are bringing AI into the fab itself

03 June 2026
In a deal with Nvidia, TSMC’s semiconductor and manufacturing lifecycles will be infused with Nvidia AI chips and software. Source: Nvidia

Nvidia and the world’s largest foundry TSMC are collaborating to speed up semiconductor design and manufacturing.

Under the deal, TSMC will use Nvidia’s AI and computing chips across its semiconductor design and manufacturing lifecycle to improve turnaround time, energy efficiency, yield and operational productivity in fabs.

“NVIDIA and TSMC have worked together for nearly three decades to push the limits of computing,” said Jensen Huang, founder and CEO of NVIDIA. “TSMC is bringing NVIDIA AI and accelerated computing into the fab itself, tackling some of the world’s most complex design and manufacturing challenges with simulation, optimization and AI to improve speed, efficiency and yield for the next generation of chips.”

The companies said the AI and computing chips will provide support for:

  • Computational lithography
  • Transistor simulation
  • Process control
  • Wafer inspection

In terms of computational lithography, TSMC is using Nvidia cuLitho, a GPU-accelerated library for lithography, which delivers 20% to 50% improvement in cost effectiveness or cycle time compared to CPU-based computational lithography.

In transistor simulation, TSMC is using Nvidia cuEST, a CPU-accelerated electronic structure simulation library for 50 times faster chemistry simulations, Nvidia said.

TSMC is using Nvidia CuML machine learning library for advanced process control for large-scale analytics on Nvidia GPUs. This will allow the foundry to speed algorithms and generate hundreds of thousands of process parameters spanning thousands of steps for precision inputs for machine learning models.

Finally, TSMC is using CUDA-power computation on Nvidia H200 GPUs to enhance its capability to manage complex constraints and streamlines production paths and fab productivity.

Defect detection

Additionally, TSMC is using Nvidia Metropolis with Nvidia Tao toolkit for defect classification that will utilize vision AI to find chip defects at nanometer scale. The companies said this will improve inspection while reducing repeated labeling and process conditions.

TSMC is also exploring Nvidia Omniverse libraries to build a FabTwin, or a virtual fab environment for evaluating process tools and simulation workflows. This will help the foundry to compare configurations with more flexibility and identify constraints earlier.

To contact the author of this article, email PBrown@globalspec.com


Powered by CR4, the Engineering Community

Discussion – 0 comments

By posting a comment you confirm that you have read and accept our Posting Rules and Terms of Use.
Engineering Newsletter Signup
Get the GlobalSpec
Stay up to date on:
Features the top stories, latest news, charts, insights and more on the end-to-end electronics value chain.
Advertisement
Weekly Newsletter
Get news, research, and analysis
on the Electronics industry in your
inbox every week - for FREE
Sign up for our FREE eNewsletter
Advertisement