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Cloud Light to manufacture SiLC’s vision sensors
The silicon photonics technology will provide new benefits to lidar.
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Cruise approved to charge for driverless ride-hailing in San Francisco
It is the first time a company will operate autonomous service without a safety driver in a major U.S. city.
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Rohde & Schwarz enhances R&S RTP high-performance oscilloscope for better signal integrity in real time
Featuring an enhanced user interface and a larger display, the result is an even more flexible oscilloscope in a compact format that delivers high-performance signal integrity in real time.
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Monitoring neonate health with a smarter pacifier
A bioelectronic pacifier can be used to eliminate the blood draws needed to monitor the electrolyte levels of infants.
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Curtiss-Wright launches Exlar GTW series actuator for automotive weld-gun applications
These actuators can support high duty cycles for increased productivity and energy efficiency in automotive manufacturing.
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Foxconn to expand automotive IC capacity by 2023
The move is expected to help the ongoing chip shortage.
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Case study: Keyence wide-area CMM helps machine shop diversify into aerospace market
The coordinate measuring machine (CMM) simplifies the extensive geometric dimensioning and tolerancing requirements associated with the machining of aerospace components.
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Report: Taiwan looks to strengthen IC relationship with Europe
The regions will work together to help fight against the ongoing chip shortage.
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Video: Toyota develops portable hydrogen cartridge
The prototype could one day be used to power a range of daily life applications in and outside the home.
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Despite challenges, chip sales to jump 11% in 2022
Strong growth from MPU sales and cellular processors help push past these challenges.
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New Yorker Electronics to distribute Vishay’s highest energy density wet tantalum capacitors
The device offers industry-high capacitance and mechanical robustness for military and avionics applications.
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Smartphone shipments to falter in 2022
Weaker demand will cause a 3.5% decline.
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Trouble-free electric print and apply labeling systems
These modular systems are available with various applicators for the best end-of-line labeling solutions.
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Sony and Ligado to develop 5G mobile satellite chipsets
The chipsets will enable private networks with satellite and terrestrial connections to extend coverage and increase redundancy.
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First city-wide drone delivery network planned for Switzerland
Matternet will take over the operations from Swiss Post in the region.
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Teledyne FLIR 2022 mono and color sensor reviews
The reviews provide explanations to help select the right sensor type and cover differences in optical format, readout and pixel structure.
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First pneumatic valve system with integrated open platform communications unified architecture
The digital twin solution solves interoperability challenges while improving productivity and efficiency.
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Komline-Sanderson acquires the Wyssmont Company, expands specialty drying capabilities
The strategic acquisition will add Wyssmont’s flagship product, the TURBO-DRYER, to Komline’s product line.
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The Fischer family launches new technology group: Conextivity
The new group will extend its expertise and innovation capabilities across the entire connectivity value chain.
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Newport Wafer Fab gets another potential suitor
The U.K. government may be pursuing an alternate bid from a U.S.-based consortium.
