Automated test equipment vendor Teradyne Inc. has expanded its edge AI testing portfolio with a 24-slot system built for both engineering and production use.
Called the UltraFLEXplus S, the automated test machine is engineered to maximize output per square meter and operational efficiency for high-mix, variable-volume chipmaking for edge AI applications.
Teradyne said the automated test tool will fill a need in the supply chain as demand grows for edge AI system, but vendors have different product mixes from those in the data center and cloud applications.
"Floor space is one of the biggest hidden costs in high-mix manufacturing, and UltraFLEXplus S is built to optimize it," said Roy Chorev, VP and GM of the Compute Test division at Teradyne. "As AI moves from the data center to the edge, customers need a platform that fits their facilities today and scales with them tomorrow, without giving up the rigor and reliability they already trust from UltraFLEXplus."
The company said the tool is a compact system to reduce floor space and uses similar existing instrument modules to ease transitions. Additionally it supports both engineering and production test insertions including tri-temperature testing for microcontrollers (MCUs), multimedia and edge AI devices across automotive, industrial and consumer end markets.
Semicon West 2026 takes place this week in San Francisco, California.
