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Sensors Converge 2024: First Wi-Fi passive backscatter RF chip unveiled
The battery-free, low-power device is powered by ambient light.
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What are 3D processors? What do they mean for wireless communication?
Transistors simply won’t function predictably beyond a few nanometers in size, not without strange quantum effects throwing an atomically scaled wrench in the works.
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Chip materials maker Entegris latest to receive CHIPS Act funding
The $74 million will help it develop a new facility in Colorado Springs, Colorado.
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Intel demos fully integrated OCI chiplet
It is co-packaged with an Intel CPU and was running live data. It is co-packaged with an Intel CPU and was running live data.
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Ulefone introduces the Armor 25T Pro: A 5G rugged smartphone with leading thermal imaging and night vision
The Armor 25T Pro promises to be the most cost-effective 5G rugged smartphone sporting thermal imaging and infrared night vision capabilities on the market.
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Tektronix’s battery testers a step toward cleaner future
The bipolar architecture reduces lead usage by 40%.
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EDA firms unveil reference flows for Intel Foundry’s EMIB tech
The tools from Ansys, Cadence, Siemens and Synopsys allow users to access Intel’s process and packaging technologies.
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Renesas expands GaN power semiconductor offerings
The Japanese company introduces 15 GaN related reference designs.
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Sensors Converge 2024: Sensor partner program launched by TDK
The goal is to accelerate time to market for IoT, wearables, hearables and other applications.
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SiFive upgrades RISC-V IP
This includes improved performance, power efficiency and flexibility.
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Decoding ultrafast light dynamics with atomic force microscopy
An improved technique for analyzing single-atom defect structures and minor electron behavior disturbance in semiconductor and other materials has been demonstrated.
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Onsemi to build $2 billion SiC fab in Czech Republic
The fab will build power semiconductors for EVs and renewable energy.
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BAE, GF agree to semiconductor supply deal
The agreement will seek to boost national security programs and advancing domestic fabrication and packaging of secure chips.
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Two paths for meeting rising power requirements
Advantest and B&K Precision unveil new devices to meet power testing challenges.
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Power Integrations revs up motor-drive offering with BridgeSwitch-2 BLDC IC family
The brushless DC motor hardware-software combo slashes inverter sleep-mode consumption to less than 10 mW and expands output power to 1 HP.
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Testing trions by gold nanowire spectroscopy
The instrument uses gold nanowires, which have excellent optical properties and can confine light to extremely small dimensions, making them ideal for investigating the behavior of these quasiparticles.
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ECIA: Slip in sales sentiment for electronic components
However, May still delivered the fourth consecutive positive month.
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Anritsu’s dual analyzer designed for cable and antennas
It applies to the telecom, aerospace, satellite and defense sectors.
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Will existing equipment meet new smart device labeling regulations?
Keysight unveils new EEI testing platform.
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pSemi Introduces New High-Power, High-Linearity SP4T RF Switch
PE42447 supports frequency range from 10 MHz to 8 GHz for post-PA hybrid analog beamforming and in 5G massive MIMO applications.
