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Supply Chain
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New Vishay Intertechnology 890 nm IR emitting diode offers high typical radiant intensity, fast switching times
The device offers high typical radiant intensity of 235 mW/sr at a 100 mA drive current, which is 50% higher than previous-generation solutions.
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DOD chipmaking hub in Texas gets federal funding
University of Texas at Austin will build an open access R&D and prototyping fab for defense systems.
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Metrology acquisition expands Merck’s chipmaking capability
The German company intends to buy French startup Unity-SC.
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How green powered reshoring is key to sustainable manufacturing
Bringing jobs back to the U.S. could contribute to decarbonization reduction potential of 25% to 50%.
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Teledyne e2v double capacity space qualified 8 GB DDR4 memory chip targets high reliability space-based applications
The ultra-compact, resilient memory chip increases size, weight and power for advanced missions targeting communications, Earth observation, scientific and edge compute satellite roles.
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ECIA: Two-month decline erases yearly gains for electronic components
Overall sales sentiment falls below the 100-point threshold.
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Onsemi unveils SiC MOSFET roadmap through 2030
The company has also unveiled new SiC platforms.
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NXP single-chip NFC solution certified for digital keys
The Car Connectivity Consortium seeks to accelerate use of the technology for future automobiles.
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Video: How HMI is enabling new capabilities in engineering
Mouser Electronics examines the technology uses in everyday devices and industrial applications.
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GlobalWafers receives $400 million in CHIPS Act funding
The Taiwanese company will use the investment to help build two facilities in Missouri and Texas.
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Agreement seeks to drive 5G Open RAN adoption
Viavi and TIP will expand testing capabilities on networking technology.
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Teledyne e2v releases upscreened Arm based LX2160 processor for hi-rel aerospace and defense applications
The power-efficient LX2160 offers designers of embedded systems a lift of 2.6 more Giga instructions per Watt.
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Siemens unveils integrated IC design analysis tools
Its Tessent tool and Calibre software help identify ESD issues.
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Glass substrate suite supports heterogeneous integration approach
The device contains panel-level packaging lithography system and a submicron automatic metrology and inspection system.
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Video: First USB-powered scopes unveiled by Pico Technology
The device is used to boost production and debugging environments.
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Roundup: NTN device testing, AI-RAN Alliance, ASPICE compliance
A look into the latest in the electronics test and measurement landscape.
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Texas Instruments introduces 6 power modules
The devices use TI’s MagPack integrated magnetic packaging technology.
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An introduction to nanophotonic sensors
These sensors utilize the interactions between light and matter to detect physical, chemical or biological occurrences at extremely small scales.
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Buck converters: Operating principles and applications
Buck converters convert a higher voltage to a lower voltage while increasing the current.
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Video: Arizona is home to more than 40 chip investments
At SEMICON West 2024, the state touts its semiconductor prowess.
