Processors

Intel Foundry on track to deliver next-gen processors in 2025

08 August 2024
Intel Foundry is on track to deliver next-generation processors for foundry customers in 2025 after successfully testing its latest AI and server processors. Source: Intel Corp.

Intel Foundry, the semiconductor manufacturing wing of Intel Corp., has announced that its Panther Lake and Clearwater Forest technologies — its next generation AI PC client processor and server processor, respectfully — are on track for production in 2025

Through its Intel 18A process technology, the processors have powered-on and booted operating systems just two quarters after tape-out, Intel said. The company also said that the first external customer is expected to tape out on Intel 18A in the first half of next year.

Intel claims it is the first to successfully implement both RibbonFET gate-all-around transistors and PowerVia backside power technology for its foundry customers.

The announcement comes after Intel released the 18A process design kit (PDK) 1.0 that allows its foundry users to capture the capabilities of RibbonFET and PowerVia. Electronic design automation and intellectual property (IP) partners are also updating offerings for users’ final production designs, Intel said.

Why it matters

Intel said both processors booting operating systems without additional configurations or modifications indicate the health of the 18A process. Another sign of health is the Panther Lake processor DDR memory performance running at target frequency, the company said.

Meanwhile Clearwater Forest will be the first mass-produced, high-performance solution that combines RibbonFET, PowerVia and Foveros Direct 3D. The processor is the lead product for Intel 3-T base-dei technology, Intel said.

What is RibbonFET and PowerVia?

RibbonFET is a manufacturing technology that allows for tight control over electrical current in the transistor channel. This enables miniaturization of chip components while reducing power leakage.

PowerVia is a technology that optimizes signal routing by separating power delivery from the front side of the wafer. This improves power efficiency and reduces resistance.

Both technologies potentially could lead to substantial gains in computing performance and battery life in future electronic devices, Intel said.

To contact the author of this article, email PBrown@globalspec.com


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