Supply Chain
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Magnetometer Combines High Performance, Small Size
Integrated monolithic three-axis AMR sensor and a signal conditioning ASIC achieve ±30 G sensing range.
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Ultralow Jitter Clock Synthesizer Has Multichip Synchronization, JESD204B Clocking
Linear Technology’s patented EZSync output synchronization method guarantees repeatable and deterministic phase relationships between all clock divider outputs on the LTC6951 and accompanying EZSync supporting devices.
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Better Battery Anodes with Caged Silicon Nanoparticles
For many years energy-storage researchers have been trying to create battery anodes using silicon as the main material. For high-energy batteries, a high-capacity anode material is extremely important for performance.
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First-Ever Smartphone 3D Printer is $99
OLO’s team has worked over two years to create a portable design that can be used at a fraction of the cost of any other 3D printer on the market.
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Image Sensor Boosts Smartphone Picture Quality with Dual-Pixel Technology
Samsung's 12-MP, 1.4µm-pixel image sensor uses dual-pixel technology, enabling rapid phase-detection auto-focus for fast photo shooting, even in low light.
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GPS-Based Heading Sensor Immune to Extraneous Magnetic Influences
VectorNav Technologies' VN-360 derives geographic heading information from GPS/GNSS signals.
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650V GaN FET Has Low On-Resistance
Rds(on) of 41mOhm and ultra-low Qrr of 175 nC increases power density and achieves higher efficiencies over a broad range of power levels.
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Galaxy S7 Equips IDT Technology as Part of Wireless Fast Charge
Integrated Device Technology’s wireless charging technology allows mobile charging without a wired connection.
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Article Retraction: AMFitzgerald Develops Path to Harvest Broken MEMS Wafers
On March 17, 2016, Electronics360 published an article titled, “AMFitzgerald Develops Path to Harvest Broken MEMS Wafers.” The article incorrectly stated that AMFitzgerald has a process for salvaging broken wafers.
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LG Display to Build 5th-Generation OLED Light Panel Fab
The facility will initially produce 15,000 glass substrates per month.
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Microsemi to Divest Non-Core Business
The move will help the company focus on higher value ICs and SoC offerings.
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The Status of Lithography: It’s Complicated
What will emerge as the dominant lithography technology in semiconductor manufacturing?
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The Why, Where, and Hows of Signal Isolation
Galvanic isolation solves many signal-integrity problems and eliminates safety-related issues.
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Phase Control Thyristor Lowers Costs, Saves Space in Medium-Power Switching Apps
The VS-50TPS12L-M3 thyristor from Vishay is packaged in a long-leads TO-247 package and is suited for medium-power switching applications.
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Coilcraft Introduces High Frequency Power Inductors at APEC 2016
Coilcraft’s XEL40xx power inductors are suited for frequencies spanning 2 to over 5 MHz.
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Rambus Security Technologies Licensed to Altis
The agreement includes DPA countermeasures and other side-channel defenses.
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High-Power Negative Supply Ideal Diode-OR Controller? Withstands ±300V Transients
The LTC4371, a diode-OR controller for high-power telecom and datacom boards, provides seamless handoff between redundant power supplies.
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TSMC and ARM Form Agreement for 7nm FinFET SoCs
The multi-year deal will expand the collaboration between the two companies into leading-edge process technologies.
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Pirates!
It’s 2016 and cyber theft in the form of software piracy continues to mushroom. What is happening, how, why, and what are the real ramifications?
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Chinese Packaging Sales on Pace for $4.4 Billion in Sales in 2016
The packaging and assembly market has grown concurrently with electronic product manufacturing in the region.
