Electronics Industry News & Analysis | Market Outlook & Trends

Foxconn Sells IP to Google

Hon Hai Precision Industry, the world's largest contract EMS provider, has sold a number of communications technology patents to Google.

MediaTek to Integrate Wolfson Audio

Fabless chip company Wolfson Microelectronics, which specializes in audio and power management chips for smartphones has cut a deal with mobile chipset firm MediaTek.

Top 25 Chip Company Ranking Shows Solid Growth

Micron, SK Hynix, Qualcomm and MediaTek benefited from the global economic recovery in 2013 as mobile phone demand persisted and rising ASPs helped drive memory markets forward.

Avnet's Q3 Sales Rise 6.1%

Distributor increases sales 6.1 percent to $6.7 billion in its fiscal 2014 third quarter compared to the third quarter of 2013.

Xilinx to Demonstrate FPGA Acceleration Technology at IBM Conference

Xilinx will demonstrate the industry’s first FPGA-based acceleration technology using the IBM CAPI protocol at the upcoming IBM Impact 2014 Conference

Custom Processor Development Team Raises Funds

Private Czech firm secures funds to roll out its application-specific instruction-set processor (ASIP) technology to the rest of the world.

Fujitsu, Panasonic Deal Makes Slow Progress

First mooted early in 2013 in line with the larger re-organization of Japan's struggling electronics sector, the FujiPana deal has moved one step closer to completion.

NXP's China Automotive Chip JV Begins Operations

As NXP turns in a profitable first quarter the first shipments have left the warehouse of China's first dedicated automotive chip company.

ARM's Royalties Dip, Licenses Boom

ARM has returned to profit in the first quarter of 2014. Licensing activity was particularly strong although royalty revenue declined year-on-year.

Hybrid Carbon Nanostructures Could Lead to Better Ultracapacitors

A combination of carbon nanomaterials shows promise for high-performance ultracapacitors.

Toshiba Starts 15nm NAND Production

Starting this month Toshiba is moving mass production of NAND flash non-volatile memory down to a 15nm minimum geometry manufacturing process.

TSMC Targets Mobile With 'InFO' Multi-Die Assembly

TSMC is refining its CoWoS 3D IC assembly offering to lower cost and extend appeal to the mobile chip companies and has called it InFO, for integrated fan-out.

Arrow Receives R2 Certification for Facility in Brazil

The Arrow Electronics facility in Brazil has been certified to several quality and environmental standards for electronics asset disposition.

Cadence Keeps Consolidating with Jasper Purchase

Cadence and Synopsys in consolidation competition

Digital Video Growth Spurs IC Markets

The video may be digital, but the interfaces are unavoidably analog, offering opportunities for analog and mixed-signal IC makers.

TSMC Forecasts 2014 Boom

The normally cautious TSMC has predicted that it will enjoy exceptional sales growth in 2014 and take market share from other foundries.

ASML Cuts Q2 Outlook on Logic Weakness

ASML's outlook for the 2Q14 shows a slight weakness as leading chip companies adjust their schedules around 20nm bulk CMOS and 16 and 14nm FinFET manufacturing.