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GOWIN Semiconductor announces new FPGA families for 2026
New capabilities allow designers to reduce external components, simplify system architecture and optimize board-level efficiency.
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Innodisk showcases integrated edge AI portfolio for industrial deployment at Embedded World 2026
The company will highlight advanced computing performance with practical system integration to enable scalable, secure and high-efficiency edge artificial intelligence (AI) implementation.
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Shimadzu unveils ultrapure water monitoring for chip manufacturing
The TOC analyzer detects urea and other difficult-to-oxidize organic compounds for accurate assessment of water quality.
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Dymax to demonstrate light-curing technologies for electronics assembly at the APEX EXPO 2026
The company will present UV/LED light-curable solutions developed for electronics assembly and printed circuit board manufacturing.
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Pleora launches eBUS SDK 7.0, delivering a unified, high-performance platform for next-generation imaging systems
The imaging system provides a powerful, standards-compliant foundation for GigE Vision and USB3 Vision connectivity across Windows, Linux and embedded operating systems.
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SWI6 and SMI6 series deliver ultra-efficient, globally compatible 6 W power solutions
They feature ultra-low no-load power consumption (less than 0.1 W), which lowers operating temperatures, extends adapter life, improves system reliability and reduces total costs.
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Tiny ‘electronic dolphin’ robot, no bigger than a sneaker, targets oil spills
The minibot, dubbed the "Electronic Dolphin," is, as its name suggests, shaped like a dolphin and roughly the size of a sneaker.
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Nordic Semiconductor expands nRF54L series with entry-level Bluetooth LE SoCs
The series has expanded to cover a wider range of applications, including cost-sensitive Bluetooth LE products.
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Self-sufficient modular robots flip, jump and function even when split apart
Made up of autonomous, Lego-like modules, each component of the legged metamachines features its own circuit board, battery and motor.
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Hyundai unveils firefighting robot that can endure 1,472° F heat
Hyundai Motor Company, in collaboration with Kia, Hyundai Rotem, Hyundai Mobis and the National Fire Agency, created its Unmanned Firefighting Robot to help protect human firefighters from the risks they face on the job.
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Rohde & Schwarz and Realtek demonstrate first test solution for Bluetooth LE High Data Throughput (HDT)
The companies have successfully validated the industry’s first test solution for the upcoming Bluetooth LE High Data Throughput (HDT) feature.
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Amphenol Printed Circuits shows PCBs for quantum computing at 2026 APS
The company will highlight its extensive capabilities in rigid, flexible and rigid-flex printed circuit boards (PCBs), with a focus on high-density multilayer flex for quantum.
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Taoglas debuts ‘world-first’ AI-powered antenna selection platform at Embedded World 2026
The platform enables engineers and non-technical decision-makers to quickly move from a blank slate to a validated antenna shortlist in minutes.
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Excelitas to showcase humm3 Flashlamp System at JEC World
Attendees will experience how humm3 enables high intensity photothermal processing with precise power control and uniform energy delivery.
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US firm introduces high-thrust underwater vehicle capable of 30-day missions
The vehicle, dubbed the Momentum Electric ROV, which can reportedly deliver extended support for drilling, inspection, maintenance and repair (IMR), surveys and construction work scopes, features plug-and-play sensors, 360° vision, automation, strong thrust and high payload capacity.
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Future Electronics and SnapMagic announce CAD model integration to support faster design cycles
Engineers can now download verified symbols, footprints and 3D models directly from supported product pages, enabling a smoother transition from component selection to PCB layout.
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TDK presents embedded solutions for next generation applications at Embedded World 2026
Technologies ranging from sensor solutions, power supplies and embedded motor controllers to flash storage solutions and microphones.
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Emerson launches new software defined radio for radar, satellite and 6G research
The device combines 20-gigahertz frequency range and phase-coherent, multi-channel architecture to accelerate next-generation radio frequency (RF) innovation.
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TASKING unveils industry’s first end-to-end compile, debug and test toolchain for Renesas RH850 microcontrollers, including new RH850/U2C series
With its new RH850-supported compiler, TASKING now provides a seamless environment that enables truly holistic development for automotive and industrial engineers.
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Aetina launches AIP-FR68S edge AI workstation at Embedded World 2026
The enterprise-grade "CXO Solution" artificial intelligence (AI) agent system enables users to achieve C-suite-level automated decision-making capabilities while ensuring complete data privacy in edge environments.
