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Digitizing the last analog domain — Intelligent tire monitoring
BANF and Silicon Labs create an in-tire sensor solution using Bluetooth for real-time data monitoring of tires.
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Embedded World 2026: MediaTek unveils new IoT processors
The devices will be used for smart home, retail, industrial and commercial applications.
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Cellular and LoRaWAN hybrid expands IoT coverage worldwide
1NCE and Netmore’s hybrid technology will address 90% of the LPWAN market globally.
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Danisense achieves full ISO/IEC 17025 accreditation for AC calibration services
The in-house laboratory is now fully accredited for AC and DC calibration.
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Compact high-density digitizers for scalable systems
These digitizers deliver 10 bit vertical resolution and high sampling rates suited for fast detector signals and measurement environments.
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IBM, Lam Research to collaborate on future logic materials and processes
The goal will further IBM’s logic scaling roadmap.
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Report: Japan plans to boost domestic chip sales by 5x
The country set a goal of $253 billion in annual sales by 2040.
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Report: Full production of Samsung’s Texas fab possibly delayed to 2027
It could impact the production of American-made Tesla AI5 and AI6 chips.
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Everspin seeks to disrupt traditional NOR flash memory
The company’s Unisyst MRAM technology will offer a unified code storage and data memory architecture.
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Efficiency you can measure
Precise temperature, humidity and other sensors engineered for data centers and the food industry will be on display by E+E Elektronik at MCE 2026 in Milan, Italy.
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Applied Materials, Micron working on next-gen AI memory
The companies will work on new materials, architectures and more for DRAM, HBM and NAND.
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Absolutely APEC 2026 (March 22-26)
APEC has quickly become one of the pre-eminent events on the electronics industry calendar. Our electronics lead editor, Peter Brown, will attend to gather insights, spot trends and report on key developments.
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Broadcom unveils 400 G/lan optical DSP
Called Taurus, the device is considered an industry first.
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Embedded World 2026: Arduino launches Ventuno Q SBC
Powered by Qualcomm’s Dragonwing IQ-8, the single board computer is designed for both traditional and generative devices.
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Starlink, Deutsche Telekom to expand SATCOM collaboration
The deal will expand the telecom’s coverage to hard-to-reach areas.
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PEI-Genesis celebrates 80 years of engineered connector solutions
Through strategic acquisitions, product expansion and a deep passion for emerging technologies, the company steadily grew since 1946 alongside the evolving electronics industry.
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MWC 2026: Intel, Ericsson push AI-native 6G deployments
The collaboration will seek to move 6G from the research phase to eventual deployment.
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TI, Nvidia to collaborate on humanoid robot semiconductors
The companies will demonstrate the solution at Nvidia GTC 2026.
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ChicGrasp robotic system reshapes poultry processing automation
Originally developed in response to labor shortages in poultry processing plants amid the COVID-19 pandemic, the ChicGrasp is now a robotics system capable of learning by imitating human movements to handle chickens using an imitation learning algorithm and camera perceptions.
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Hitachi Energy and Pakal Technologies join forces in breakthrough silicon power semiconductor for high-voltage modules
The next-generation 3.3 kV power modules are critical to advance rail, renewables, energy storage, artificial intelligence and data center infrastructure.
