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At APEC 2026, AmberSemi to feature new PowerTile solutions to solve AI data center power problems
Highlights include PowerTile products with a variety of power ranges, as well as reference designs for common power configurations and artificial intelligence (AI) processors up to 6,000 A.
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Rohde & Schwarz to showcase future-proof EMC testing solutions at EMV 2026
The company will show its latest advancements in test and measurement equipment to address the evolving challenges within the electromagnetic compatibility (EMC) landscape.
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‘World’s smallest’ AI laser sniper mounted on unmanned ground robot
The directed energy weapon can reportedly neutralize, dazzle or disable hostile targets within mere seconds, and, thanks to its small footprint, can operate in urban zones, border regions, forests, deserts and other challenging terrain.
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RealSense unveils first-of-its-kind humanoid autonomous navigation at NVIDIA GTC, reinforcing its leadership in vision AI and human-robot safety
The demonstration will show how advanced perception and reasoning software enable safe humanoid navigation in real-world environments.
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Wirepas, TI to deploy large scale smart meter networks
The initial deployment will take place in India.
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Mouser Electronics sponsors 2026 Global Create the Future Design Contest to inspire technological innovation
The contest challenges engineers and innovators to design the next great thing, with a chance to win the grand prize.
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KRYTAR announces new compact 3 dB, 90° ULTRA+ hybrid coupler covers 2 to 18 GHz
The hybrid couplers deliver 3 dB of coupling over the frequency range of 2.0 GHz to 18.0 GHz in a compact package.
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Embedded World 2026: Ubitium achieves first RISC-V processor tape-out
The startup completed it on Samsung Foundry’s 8 nm process technology.
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Danisense to exhibit at APEC 2026
A new high precision DC and AC current clamp-on transducer for galvanically isolated measurement up to 500 Arms will be unveiled.
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Industrial vision technology agenda sealed by letter of intent
The companies will explore new sensing architectures combining conventional imaging with Prophesee’s Metavision event-based vision for developing faster, more accurate and power-efficient machine vision systems.
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Indium Corporation to feature materials solutions powering sustainability at APEC 2026
Thermal interface materials, sinter pastes and other products geared to improve the packaging and manufacture of electronic devices will be featured.
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2026 humanoid robot launches
Unlike previous years dominated by experimental prototypes, this wave of launches reflects a broader industry shift toward scalable, commercially viable humanoid platforms.
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Compostable robot survives 1 million uses before turning into plant food
The team used a water-free biodegradable elastomer, poly(glycerol sebacate) (PGS), to construct the robotic frame, which paved the way for soft actuators with low hysteresis as well as excellent elastic recovery.
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ECIA: 9 months of positive sale sentiment for electronic components
March is expected to be the 10th straight month as sales growth continues into the second quarter.
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Nvidia unveils GPU module for space-based inferencing
The Space-1 Vera Rubin module will be used for ODCs, geospatial intelligence and autonomous space operations.
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Cryogenic switching for quantum computing gets a boost
Menlo Micro and Rosenberger are collaborating on a multichannel ultra-low power switch module to accelerate scalable quantum systems.
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OPEX and Peltier partner to deliver first-of-its-kind cold storage solution for automated fulfillment systems
Users can seamlessly store and retrieve chilled and frozen products while eliminating the need for costly freezer chambers or specialized infrastructure.
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Micron to build second cleanroom at PSMC P5 site
The memory manufacturer completed its acquisition of the fab from the Taiwanese foundry.
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TI introduces Nvidia-based 800 V DC power architecture for AI data centers
The solution is designed to help overcome the limits these data centers are reaching with current power distribution architectures.
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Menlo Micro MM5627: First fully integrated, highly configurable 80 Gbps differential DP3T switch for advanced AI device validation
The switch combines 80 Gbps performance with high configurability, integrated DP3T logic and fully integrated on-chip components.
