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Renesas, Inventec to develop EV automotive gateways
The R-car SoC will be used to develop connected gateways for next-generation EVs.
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Emerson accelerates factory automation capabilities with agreement to acquire Afag
The acquisition expands Emerson’s factory automation offering and enhances exposure to key growth opportunities in discrete and hybrid markets.
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Innovative wire connecting solution replaces manual splicing processes in harsh environments
This solution is ideal for aviation, aerospace and other applications requiring ease-of-use and high reliability.
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Smart home systems keep seniors secure
Safety, health monitoring, medication management, environmental control and social connectivity are just some of the ways in which smart home control systems have transformed the notion of aging in place.
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Littelfuse launches new LTKAK2-L series high power TVS diodes in surface mount package
The diodes deliver robust circuit protection for high-power applications using 60% to 80% less PCB space.
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Fairview Microwave introduces RFID antennas for asset tracking, inventory
The antennas operate from 900 MHz to 2,400 MHz to ensure efficient and uninterrupted RFID tag reading.
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TechInsights Teardown: Samsung Galaxy Book 3 Pro laptop
A partial deep dive into the professional notebook.
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EV infrastructure leaders and laggards in US and Europe
An index showing the readiness of each state developing infrastructure in both regions.
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New optical spectrum analyzer delivers high performance
The instrument can be used to characterize diverse components including lasers for optical communications, optical transceivers and optical amplifiers.
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First Alice-powered smart display launched
Yandex unveils collaboration with Xiaomi for new smart home devices.
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FAA gives UPSFF the green light for BVLOS
UPS will operate Matternet’s M2 drones for package delivery beyond the visual line of sight.
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Comau’s advanced automation solutions increase Stellantis manufacturing efficiency and flexibility in Brazil
The automatic manufacturing system grants full flexibility to handle multiple model configurations for each of two distinct SUV body frames in addition to the brand’s other vehicles.
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Hyundai launches first in-vehicle payment service for parking
In a collaboration with Parkopedia, U.S. drivers will have access to 6,000 locations.
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Senseeker introduces digital readout IC for shortwave infrared (SWIR) and related electro-optical uses
The Neon RD0033 DROIC reportedly offers low-noise performance, triple-gain modes and a 10-micron pitch pixel with a capacitive transimpedance amplifier (CTIA) front-end circuit.
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Littelfuse unveils latest eFuse Protection ICs for USB Type-C port protection
The devices protect Type-C equipped consumer electronics against short circuits, overvoltage and electrostatic discharge strikes.
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Quantic Wenzel frequency synthesizer to support NASA’s Europa Clipper
Company engineers designed and developed a space-qualified frequency synthesizer assembly for NASA’s Europa Clipper mission.
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Report: China to invest $40 billion to develop chip equipment
The state-backed fund will help ease export restrictions.
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Video: The importance of advanced chip packaging
Intel gives a look inside its latest technology used for foundry and other designers.
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iPhone 15 to help iOS climb to record levels in 2023
However, worldwide volume of smartphones will drop to lowest level in a decade.
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3D-circuits: Enabling 3D-placement of electronic components
Integrating circuits directly into 3D plastic parts increases automation, saves work steps and reduces manufacturing costs.
